Abstract: Embodiments of a microelectronic assembly includes: an interposer comprising a first portion in contact along an interface with a second portion; a first integrated circuit (IC) die embedded in a dielectric material in the first portion of the interposer; and a second IC die coupled to the first portion of the interposer opposite to the second portion, wherein: the second portion comprises a glass substrate with a channel within the glass substrate, a portion of the channel has an opening at the interface, a conductive pad in the first portion is exposed in the opening, and the conductive pad is coupled to a circuit in at least one of the first IC die or the second IC die.

Abstract: Embodiments of a package substrate includes: a conductive via in a first layer, the first layer comprising a positive-type photo-imageable dielectric; a conductive trace in a second layer, the second layer comprising a negative-type photo-imageable dielectric; and an insulative material between the first layer and the second layer, the insulative material configured to absorb electromagnetic radiation in a wavelength range between 10 nanometers and 800 nanometers. The conductive via is directly attached to the conductive trace through the insulative material, the positive-type photo-imageable dielectric is soluble in a photoresist developer upon exposure to the electromagnetic radiation, and the negative-type photo-imageable dielectric is insoluble in the photoresist developer upon exposure to the electromagnetic radiation.

Abstract: Embodiments are generally directed to memory prefetching in multiple GPU environment. An embodiment of an apparatus includes multiple processors including a host processor and multiple graphics processing units (GPUs) to process data, each of the GPUs including a prefetcher and a cache; and a memory for storage of data, the memory including a plurality of memory elements, wherein the prefetcher of each of the GPUs is to prefetch data from the memory to the cache of the GPU; and wherein the prefetcher of a GPU is prohibited from prefetching from a page that is not owned by the GPU or by the host processor.

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

Abstract: Embodiments described herein include software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. One embodiment provides for data aware sparsity via compressed bitstreams. One embodiment provides for block sparse dot product instructions. One embodiment provides for a depth-wise adapter for a systolic array.

Abstract: Disclosed herein are tools and methods for subtractively patterning metals. These tools and methods may permit the subtractive patterning of metal (e.g., copper, platinum, etc.) at pitches lower than those achievable by conventional etch tools and/or with aspect ratios greater than those achievable by conventional etch tools. The tools and methods disclosed herein may be cost-effective and appropriate for high-volume manufacturing, in contrast to conventional etch tools.

Abstract: An apparatus to facilitate increasing processing resources in processing cores of a graphics environment is disclosed. The apparatus includes a plurality of processing resources to execute one or more execution threads; a plurality of message arbiter-processing resource (MA-PR) routers, wherein a respective MA-PR router of the plurality of MA-PR routers corresponds to a pair of processing resources of the plurality of processing resources and is to arbitrate routing of a thread control message from a message arbiter between the pair of processing resources; a plurality of local shared cache (LSC) sequencers to provide an interface between at least one LSC of the processing core and the plurality of processing resources; and a plurality of instruction caches (ICs) to store instructions of the one or more execution threads, wherein a respective IC of the plurality of ICs interfaces with a portion of the plurality of processing resources.

Abstract: Disclosed herein are source/drain regions in integrated circuit (IC) structures, as well as related methods and components. For example, in some embodiments, an IC structure may include: an array of channel regions, including a first channel region and an adjacent second channel region; a first source/drain region proximate to the first channel region; a second source/drain region proximate to the second channel region; and an insulating material region at least partially between the first source/drain region and the second source/drain region.

Abstract: A non-linear activation function may be approximated by linear functions. The input range of the activation function may be divided into input segments. One or more input segments may be selected based on statistical analysis of input data elements in the input range. A parameter of a first linear function that approximates the activation function for at least part of a selected input segment may be stored in a first portion of a first look-up table (LUT). The first portion of the first LUT is dedicated to a first group of post processing engines (PPEs). A parameter of a second linear function that approximates the activation function for at least part of an unselected input segment may be stored in a shared pool of LUT entries, which includes a second portion of the first LUT and a portion of a second LUT and is shared by multiple groups of PPEs.

Abstract: One embodiment provides for a computer-readable medium storing instructions that cause one or more processors to perform operations comprising determining a per-layer scale factor to apply to tensor data associated with layers of a neural network model and converting the tensor data to converted tensor data. The tensor data may be converted from a floating point datatype to a second datatype that is an 8-bit datatype. The instructions further cause the one or more processors to generate an output tensor based on the converted tensor data and the per-layer scale factor.

Abstract: A computing platform comprising a plurality of disaggregated data center resources and an infrastructure processing unit (IPU), communicatively coupled to the plurality of resources, to compose a platform of the plurality of disaggregated data center resources for allocation of micro service s cluster.

Abstract: A method and system of image processing with multi-skeleton tracking uses a temporal object key point loss metric.

Abstract: In an example, an apparatus comprises a plurality of execution units comprising at least a first type of execution unit and a second type of execution unit and logic, at least partially including hardware logic, to expose embedded cast operations in at least one of a load instruction or a store instruction; determine a target precision level for the cast operations; and load the cast operations at the target precision level. Other embodiments are also disclosed and claimed.

Abstract: A bumpless hybrid organic glass interposer. One or more high density pattern (HDP) routing layers are placed on a functional, thin, carrier, separate from the intended organic substrate patch or package. The HDP layer(s) is/are then attached to the substrate package. The interposers achieve electrical connections between the HDP layer and underlying routing layer of the substrate package by utilizing a self-align dry etch process through landing pads connected to the HDP routing.

Abstract: Described herein is a truncated modified Booth squarer that is commutative and accurate to 1 unit in the last place. In various embodiments, the truncated Booth squarer is a radix-4 Booth squarer or a radix-8 Booth squarer. The truncated Booth squarer can be included within integer, floating-point, or fixed-point units within a graphics processor or compute accelerator, including matrix accelerator units or tensor processors.

Abstract: Computer computation of correctly rounded floating point summation is described. An example of apparatus includes a first circuit to sort multiple floating point (FP) values based on an exponent of each FP value and store the sorted FP values in a buffer, and to provide the plurality of FP values for summation sequentially in a sorted order starting with a FP value having a smallest exponent; a second circuit to iteratively sum the FP values and store an accumulated value, generate and store a residual value representing fully resolved bits from the accumulator, and generate an intermediate output including the residual value; and a third circuit to perform final rounding of the output, the final rounded output being a correctly rounded summation of the maximum floating point values.

Abstract: An apparatus includes a central processing unit (CPU), including a plurality of processing cores, each having a cache memory, a fabric interconnect coupled to the plurality of processing cores and cryptographic circuitry, coupled to the fabric interconnect including mesh stop station to receive memory data and determine a destination of the memory data and encryption circuitry to encrypt/decrypt the memory data based on a destination of the memory data.

Abstract: A first die has a port to couple the first die to a second die over a die-to-die interconnect. The port includes circuitry to implement a physical layer of the die-to-die interconnect, send first protocol identification data over the physical layer to identify a first protocol in a plurality of protocols, send first data over the interconnect to the second die, wherein the first data comprise data of the first protocol, send second protocol identification data over the physical layer to identify a different second protocol in the plurality of protocols, and send second data over the interconnect to the second die, wherein the second data comprise flits of the second protocol.

Abstract: Examples described herein include a system comprising: a processing unit package comprising: at least one core and at least one offload processing device communicatively coupled inline between the at least one core and a network interface controller, the at least one offload processing device configurable to perform packet processing. In some examples, the at least one offload processing device is to allow mapping of packet processing pipeline stages of networking applications among software running on the at least one core and the at least one offload processing device to permit flexible entry, exit, and re-entry points among the at least one core and the at least one offload processing device.

Abstract: Techniques are disclosed for using neural network architectures to estimate predictive uncertainty measures, which quantify how much trust should be placed in the deep neural network (DNN) results. The techniques include measuring reliable uncertainty scores for a neural network, which are widely used in perception and decision-making tasks in automated driving. The uncertainty measurements are made with respect to both model uncertainty and data uncertainty, and may implement Bayesian neural networks or other types of neural networks.

Abstract: Systems and methods described herein may relate to providing a dynamically configurable circuitry able to process data associated with a variety of matrix dimensions using one or more complex number operations, one or more real number operations, or both. Configurations may be applied to the configurable circuitry to program the configurable circuitry for a next operation. The configurable circuitry may process data according to a variety of operations based at least in part on operation of a repeated processing element coupled in a compute network of processing elements.

Abstract: Embodiments herein relate to systems, apparatuses, or processes for improving off-package edge bandwidth by overlapping electrical and optical serialization/deserialization (SERDES) interfaces on an edge of the package. In other implementations, off-package bandwidth for a particular edge of a package may use both an optical fanout and an electrical fanout on the same edge of the package. In embodiments, the optical fanout may use a top surface or side edge of a die and the electrical fanout may use the bottom side edge of the die. Other embodiments may be described and/or claimed.

Abstract: Techniques, structures, and materials related to extreme ultraviolet (EUV) lithography are discussed. Multiple patterning inclusive of first patterning a grating of parallel lines and second patterning utilizing EUV lithography to form plugs in the grating, and optional trimming of the plugs may be employed. EUV resists, surface treatments, resist additives, and optional processing inclusive of plug healing, angled etch processing, electric field enhanced post exposure bake are described, which provide improved processing reliability, feature definition, and critical dimensions.

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: In one embodiment, an apparatus includes: a first queue to store requests that are guaranteed to be delivered to a persistent memory; a second queue to store requests that are not guaranteed to be delivered to the persistent memory; a control circuit to receive the requests and to direct the requests to the first queue or the second queue; and an egress circuit coupled to the first queue to deliver the requests stored in the first queue to the persistent memory even when a power failure occurs. Other embodiments are described and claimed.

Abstract: A computer platform is disclosed. The computer platform comprises a central processing unit (CPU) including at least one socket having a plurality of tiles and control circuitry to partition the socket into a plurality of sub-sockets and assign a unique identity to each of the plurality of sub-sockets for security verification, wherein each sub-socket comprises at least one of the plurality of tiles to operate as a cluster of resources.

Abstract: Disclosed herein are non-planar transistor (e.g., nanoribbon) arrangements having asymmetric gate enclosures on at least one side. An example transistor arrangement includes a channel material shaped as a nanoribbon, and a gate stack wrapping around at least a portion of a first face of the nanoribbon, a sidewall, and a portion of a second face of the nanoribbon. Portions of the gate stack provided over the first and second faces of the nanoribbon extend in a direction parallel to the longitudinal axis of the nanoribbon for a certain distance that may be referred to as a “gate length.” A portion of the gate stack wrapping around the sidewall of the nanoribbon does not extend along the entire gate length, but, rather, extends over less than a half of the gate length, e.g., about one third of the gate length, thus making the gate enclosure on that sidewall asymmetric.

Abstract: Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.

Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a first die having a first surface and an opposing second surface, wherein the first die is embedded in a first dielectric layer, wherein the first surface of the first die is coupled to the second surface of the package substrate, and wherein the first dielectric layer is between a second dielectric layer and the second surface of the package substrate; a second die having a first surface and an opposing second surface, wherein the second die is embedded in the second dielectric layer, and wherein the first surface of the second die is coupled to the second surface of the package substrate by a conductive pillar; and a shield structure that at least partially surrounds the conductive pillar.

Abstract: Embodiments of a system and methods for localized high density substrate routing are generally described herein. In one or more embodiments an apparatus includes a medium, first and second circuitry elements, an interconnect element, and a dielectric layer. The medium can include low density routing therein. The interconnect element can be embedded in the medium, and can include a plurality of electrically conductive members therein, the electrically conductive member can be electrically coupled to the first circuitry element and the second circuitry element. The interconnect element can include high density routing therein. The dielectric layer can be over the interconnect die, the dielectric layer including the first and second circuitry elements passing therethrough.

Abstract: Hyperchip structures and methods of fabricating hyperchips are described. In an example, an integrated circuit assembly includes a first integrated circuit chip having a device side opposite a backside. The device side includes a plurality of transistor devices and a plurality of device side contact points. The backside includes a plurality of backside contacts. A second integrated circuit chip includes a device side having a plurality of device contact points thereon. The second integrated circuit chip is on the first integrated circuit chip in a device side to device side configuration. Ones of the plurality of device contact points of the second integrated circuit chip are coupled to ones of the plurality of device contact points of the first integrated circuit chip. The second integrated circuit chip is smaller than the first integrated circuit chip from a plan view perspective.

Abstract: Various methods and devices for positioning autonomous agents including verifying a reported agent location using physical attributes of the received signal; improving agent formation for iterative localization; selecting agents for distributed task sharing; intelligent beacon-placement for group localization; relative heading and orientation determination utilizing time of flight; and secure Instrument Landing System (ILS) implementation for unmanned agents.

Abstract: For example, an Extremely High Throughput (EHT) wireless communication station (STA) may be configured to set a Resource Unit (RU) allocation subfield in an EHT Signal (SIG) field to indicate an RU assignment for an Orthogonal Frequency Division Multiple Access (OFDMA) EHT Physical layer (PHY) Protocol Data Unit (PPDU) according to a predefined RU allocation table, the RU assignment for the OFDMA EHT PPDU comprising a Multiple Resource Unit (MRU) comprising a plurality of RUs; and transmit the OFDMA EHT PPDU comprising the EHT SIG field.

Abstract: In one embodiment, memory cell includes a control gate, a floating gate, a substrate comprising a source region and a drain region, a first isolator between the control gate and floating gate, and a second isolator between the floating gate and the substrate. The memory cell is configured to have a retention time that is within a statistical window around a selected lifespan. The selected lifespan may be less than ten years, such as, for example, less than one year, less than one month, or less than one week.

Abstract: Field effect transistors having field effect transistors having gate dielectrics with dipole layers and having gate stressor layers, and methods of fabricating field effect transistors having gate dielectrics with dipole layers and having gate stressor layers, are described. In an example, an integrated circuit structure includes a semiconductor channel structure including a monocrystalline material. A gate dielectric is over the semiconductor channel structure, the gate dielectric including a high-k dielectric layer on a dipole material layer, and the dipole material layer distinct from the high-k dielectric layer. A gate electrode has a workfunction layer on the high-k dielectric layer, the workfunction layer including a metal. A first source or drain structure is at a first side of the gate electrode. A second source or drain structure is at a second side of the gate electrode opposite the first side.

Abstract: Methods, systems, and storage media are described for the prioritization of services for control and data transmission for new radio (NR) systems. In particular, some embodiments may be directed to the prioritization of hybrid automatic repeat request-acknowledgment (HARQ-ACK) transmissions. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, integrated circuit structures having channel structures with sub-fin dopant diffusion blocking layers are described. In an example, an integrated circuit structure includes a fin having a lower fin portion and an upper fin portion. The lower fin portion includes a dopant diffusion blocking layer on a first semiconductor layer doped to a first conductivity type. The upper fin portion includes a portion of a second semiconductor layer, the second semiconductor layer on the dopant diffusion blocking layer. An isolation structure is along sidewalls of the lower fin portion. A gate stack is over a top of and along sidewalls of the upper fin portion, the gate stack having a first side opposite a second side. A first source or drain structure at the first side of the gate stack.

Abstract: An apparatus to facilitate compression of memory data is disclosed. The apparatus comprises one or more processors to receive uncompressed data, adapt a format of the uncompressed data to a compression format, perform a color transformation from a first color space to a second color space, perform a residual computation to generate residual data, compress the residual data via entropy encoding to generate compressed data and packing the compressed data.

Abstract: An embodiment of an electronic apparatus may include one or more substrates, and logic coupled to the one or more substrates, the logic to allocate a first memory portion to a first application as a combination of a local memory and remote memory, wherein the remote memory is shared between multiple compute nodes, and manage a first memory balloon associated with the first memory portion based on two or more memory tiers associated with the local memory and the remote memory. Other embodiments are disclosed and claimed.

Abstract: An embodiment of a latch apparatus for a circuit board comprises a first latch body with a retention mechanism for the circuit board, a second latch body with a coupling mechanism for a connector, and a spring mechanism mechanically coupled between the first latch body and the second latch body. Other embodiments are disclosed and claimed.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to enhance and audio signal.

Abstract: An apparatus comprises an input register comprising a state register and a parity field, a first round secure hash algorithm (SHA) datapath communicatively coupled to the state register, comprising a first section to perform a ? step of a SHA calculation, a second section to perform a ? step and a ? step of the SHA calculation, a third section to perform a ? step of the SHA calculation and a fourth section to perform a ? step of the SHA calculation.

Abstract: Various embodiments herein provide techniques for minimum mean-square error interference rejection combining (MMSE-IRC) processing of a received signal, distributed between a baseband unit (BBU) and a remote radio unit (RRU). The RRU may perform a first phase of processing based on an extended channel that includes a channel of one or more user equipments (UEs) served by the RRU and interference samples that correspond to other cells or additive noise. The first phase may include scaling the interference samples by a scaling coefficient to obtain a modified extended channel, and performing maximum ratio combining (MRC) on the modified extended channel to obtain a processed signal. The RRU may send the processed signal to the BBU for the second phase of processing. The second phase of processing may include regularized zero forcing to remove interference. Other embodiments may be described and claimed.

Abstract: Various embodiments of the present disclosure may be used to determine how activation downlink control information (DCI), release DCI, and dynamic retransmission DCI are distinguished for DCI formats 3_0/3_1 for Mode-1 sidelink resource allocation. Furthermore, in case of asynchronous downlink (DL) and sidelink (SL) carriers, embodiments of the present disclosure may be used to determine how a user equipment (UE) determines transmission slots with respect to system frame number (SFN) or direct frame number (DFN) when activated with Type 1 configured scheduling.

Abstract: Embodiments disclosed herein include memory bitcells and methods of forming such memory bitcells. In an embodiment, the memory bitcell is part of an embedded DRAM (eDRAM) memory device. In an embodiment, the memory bitcell comprises a substrate and a storage element embedded in the substrate. In an embodiment, the storage element comprises a phase changing material that comprises a binary alloy. In an embodiment, the memory bitcell further comprises a first electrode over a first surface of the storage element, and a second electrode over a second surface of the storage element.

Abstract: An extension device is positioned within a point-to-point link to connect two devices, where the extension device includes error detection circuitry to detect a set of errors at the extension device. The extension device further includes memory to store an event register, where the extension device is to write data to the event register to describe detection of an error by the error detection circuitry. The extension device further includes a transmitter to transmit a notification signal to indicate the detection of the error and presence of the data in the event register associated with the error.

Abstract: An embodiment of an integrated circuit may comprise circuitry communicatively coupled to two or more sub-non-uniform memory access clusters (SNCs) to allocate a specified memory space in the two or more SNCs in accordance with a SNC memory allocation policy indicated from a request to initialize the specified memory space. An embodiment of an apparatus may comprise decode circuitry to decode a single instruction, the single instruction to include a field for an opcode, and execution circuitry to execute the decoded instruction according to the opcode to provide an indicated SNC memory allocation policy (e.g., a SNC policy hint). Other embodiments are disclosed and claimed.

Abstract: An apparatus of an edge computing node, a method, and a machine-readable storage medium. The apparatus is to decode messages from a plurality of clients within the edge computing network, the messages including respective coded data for respective ones of the plurality of clients; computing estimates of metrics related to a global model for federated learning using the coded data, the metrics including a gradient on the coded data; use the metrics to update the global model to generate an updated global model, wherein the edge computing node is to update the global model by calculating the gradient on the coded data based on a linear fit of the global model to estimated labels from the federated learning; and send a message including the updated global model for transmission to at least some of the clients.

Abstract: An embodiment of an integrated circuit may comprise first circuitry to manage a memory in accordance with a page size and a channel interleave granularity, and second circuitry coupled to the first circuitry, the second circuitry to store data in a primary region of the memory at a primary address, and manage a mirror of the data in a secondary region of the memory at a secondary address at a regional granularity on demand at run time. Other embodiments are disclosed and claimed.