Pin Or Sleeve Means Patents (Class 249/67)
  • Patent number: 10300646
    Abstract: The present invention provides a parting locking device configured such that a locking member can be uncoupled from a base holder even with a locking bar inserted in the locking member, and the locking bar stably moves. The locking bar includes a thick-walled and thin-walled portions. In a first state in which the thick-walled portion is located between an engagement element and the inner surface of a bar inserting hole, and in a third state in which the locking bar is pulled out of the locking member, the engagement element is moved to first or second engagement element paths, and the locking member is uncoupled from the base holder. In a second state in which the thin-walled portion is located between the engagement element and the inner surface of the bar inserting hole (9), the engagement element is engaged with engagement recesses, thereby keeping the locking member coupled to the base holder.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: May 28, 2019
    Assignee: Aiyuki Giken Co., Ltd.
    Inventor: Masatoshi Nishimura
  • Patent number: 9610709
    Abstract: The present invention provides a method and system for the management of multiple heated mould tools (302, 304) in a facility with limited resource, by monitoring energy usage of a first mould tool (302), and starting a second mould tool (304) when enough energy is available.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: April 4, 2017
    Assignee: SURFACE GENERATION LIMITED
    Inventor: Ben John Halford
  • Patent number: 9067342
    Abstract: Embodiments of the present disclosure are directed towards a mold chase for integrated circuit package assembly and associated techniques and configurations. In one embodiment, a method includes receiving a package substrate, the package substrate including a first die mounted on the package substrate by a plurality of first interconnect structures, and a plurality of second interconnect structures disposed on the package substrate and configured to route electrical signals of a second die, protecting a top surface of individual interconnect structures of the plurality of second interconnect structures from deposition of a mold material, and depositing the mold material on the package substrate between the individual interconnect structures of the plurality of second interconnect structures. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: June 30, 2015
    Assignee: Intel Corporation
    Inventor: Bogdan M. Simion
  • Patent number: 8968623
    Abstract: A method for demolding concrete blocks which are cast in a resilient mold supported in a rigid frame, the mold having a top surface and at least one cavity with an opening on the top surface, which cavity holds a cured cast concrete block. The mold has two opposing edges. The demolded blocks are stacked on a collection surface. A support is positioned over the cavity and the mold, the support and the frame are inverted and positioned in demolding apparatus. After two opposing edges of the mold are engaged by the demolding apparatus, the support is withdrawn to allow the mold to sag. The blocks may release from the mold and fall onto the collection surface. If any blocks remain in the mold, a plunger mechanism is pushed against the sagging mold to release the blocks. Guide members may facilitate positioning the blocks on the collection surface.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: March 3, 2015
    Assignee: Rosetta Hardscapes, LLC
    Inventor: James A. Manthei
  • Patent number: 8425217
    Abstract: A molding apparatus includes a mold cavity (26), an ejector pin (30), and a sensor (42). The ejector pin has a first surface (48) exposed to the cavity and a second surface (40) not exposed to the cavity. The sensor (42) is in communicative contact with the ejector pin second surface (40). The sensor (42) is capable of sensing pressure in a mold cavity (26) through the ejector pin (30). The molding apparatus may include a hollow ejector pin (108) with a first end (120) facing the mold cavity (26). A sensor (104) embedded in the hollow ejector pin first end (120) senses a mold cavity parameter. A signal line (112) from the sensor (104) is routed through the hollow ejector pin (108).
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: April 23, 2013
    Inventor: Rodney J. Groleau
  • Patent number: 8282372
    Abstract: Provided are a apparatus and a method for vulcanizing a pneumatic tire, where are capable of: smoothly releasing a vulcanized pneumatic tire from multiple sectors separated from one another in a circumferential direction in each of an upper mold and a lower mold; and thereby lightening load on each mold. In addition to springs for biasing the sectors to always move into a smaller diameter, respectively, pushpins for moving the sectors into larger and smaller diameters are actuated by the respective cylinder rods of drive cylinders, and thereby the movements of the individual sectors into the larger and smaller diameters are controlled. Accordingly, even though the sectors would otherwise move abruptly into the smaller diameter due to biasing forces of the springs after the vulcanized tire is released from the sectors at the larger diameter, a radius-reducing movement speed of the sectors is control led by the cylinder rods in contact with rear ends of the push pins.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: October 9, 2012
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventor: Akikazu Seko
  • Patent number: 8123998
    Abstract: An injection molding method for a plate-shaped resin substrate, wherein a through-hole whose diameter gradually becomes smaller from one surface to the other surface is provided thereon and fine flow path that connects to the through-hole is provided on the other surface. A cavity is formed by joining one molding die forming one surface with the other molding die forming the other surface. A part of the one molding die that forms the through-hole includes a taper pin that protrudes from the one molding die toward the other molding die. The substrate is formed by filling the cavity with resin material, and the substrate is released from the other molding die by separating the one molding die from the other molding die. By pushing the inner wall of the through-hole with the taper pin projected further toward the other molding die, the substrate is released from the one molding die.
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: February 28, 2012
    Assignee: Konica Minolta Opto, Inc.
    Inventor: Kanji Sekihara
  • Patent number: 7556236
    Abstract: An individual ice cube handling device is disclosed comprising an ice tray and a decorative flag. The ice tray includes a plurality of compartments having a retaining collar formed therein located at a central, inferior position of each compartment. A staff portion of a decorative flag coaxially engages the retaining collar so that, when water is added to the compartments and frozen therein, the decorative flag extends beyond the superior surface of each frozen cube so as to provide a means of removing individual ice cubes from the tray, a means of hygienically handling the cubes, and a means of displaying a decorative or informative banner. The staff is shaped and configured as a tapered rod so as to facilitate removal of the decorative flag from the ice when desired.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: July 7, 2009
    Inventor: Robert Slappay
  • Publication number: 20080160658
    Abstract: A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.
    Type: Application
    Filed: September 12, 2007
    Publication date: July 3, 2008
    Applicant: HARVATEK CORPORATION
    Inventors: BILY WANG, JONNIE CHUANG, HUI-YEN HUANG
  • Publication number: 20070290119
    Abstract: An improved sucker pin bushing for an injection mold is disclosed. In various preferred embodiments, the improved sucker pin bushing maintains much of the configuration of a conventional sucker pin bushing, namely a body portion and a head portion having a larger diameter than the body portion. A shoulder is formed where the body portion meets the head portion. However, the need for a jam screw or other retaining means is eliminated by the present invention by the inclusion of threads on the head portion of the bushing.
    Type: Application
    Filed: October 26, 2006
    Publication date: December 20, 2007
    Inventor: Anthony J. Cerniglia
  • Patent number: 6843947
    Abstract: A method for roughing surfaces and edges of concrete casted blocks, comprising a block support surface having a plurality of surface sections. A first of the surface sections has a rear end thereof above an adjacent front end of a second of the surface sections to create a ledge for projecting a leading edge portion of concrete blocks conveyed over the first surface section. A first roughing device has a plurality of impacting elements thereon for roughing concrete blocks. The first roughing device is disposed generally above the rear end of the first surface section for abrading a projecting leading edge portion of each concrete block as they are conveyed over the rear end. A conveyor displaces concrete blocks over the first and second surface sections, the blocks being tilted when reaching a predetermined position over the ledge to avoid being abraded by the roughing device.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: January 18, 2005
    Assignee: Techo-Bloc Inc.
    Inventors: Charles Ciccarello, Yvon Laporte, Hugo Laporte
  • Patent number: 6761921
    Abstract: The present invention provides a kit (200) for producing a high quality sushi product with uniformity and at a high rate of production. The kit (200) includes a Nigiri Sushi mold (10, 110) and a California Sushi Roll apparatus (54, 154.) In a preferred embodiment, the kit (200) includes a traditional Japanese bento box (18,20) that houses both the Nigiri Sushi mold (10, 110) and California Sushi Roll (54, 154.) The Nigiri Sushi mold (10, 110) is made up of a mold (12, 112) having several indentations (28, 128) for supporting the preferred ingredients. The Nigiri mold (12, 112) is joined with the plate (14, 114) and is placed in the bottom half of the Japanese bento box (18) to form the lower portion of the Sushi kit (200) of the present invention. The apparatus (54, 154) used to form the California Rolls sits atop an inverted Nigiri mold (12, 112) with plate (14, 114) and includes a roller sheet (56, 156) that is flexibly attached to a base plate (64, 164.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: July 13, 2004
    Inventor: Michael P. Young
  • Patent number: 6752616
    Abstract: An ejector is coated with a thin, hard, low friction, lubricous coating for use in a mold to eject molded articles from the mold without the use of liquid lubricants. The preferred ejector has a thin, low friction, coefficient coating with a thickness on the order of 0.00004 inch to 0.0001 inch. This coating provides long lasting, dry lubrication for low friction reciprocation of the ejector within a bore in the mold. The thin lubricous coating allows the ejector to be inventoried and sold in nominal sizes and cut down to the desired size by the mold builder to suit a specific application, and the cut ends are then deburred by the mold builder and finish ground to size, with the lubricous coating remaining intact at the cut end of the ejector. The coating is so thin that the nominal size of the ejector is essentially unchanged. The very thin coating does not chip or flake at the cut end, as would result in cavities into which the plastic could flow and form flashing on the plastic part being molded.
    Type: Grant
    Filed: June 19, 2001
    Date of Patent: June 22, 2004
    Inventor: Glenn Starkey
  • Patent number: 6572073
    Abstract: A vial having an outer wall which is straight and cylindrical and a curved inner cavity. The inner cavity is curved in a substantially uniform arc. The apex of the curved cavity is closer to the cylindrical outer wall of the vial than the ends of the inner cavity. The inner cavity is substantially uniform in cross section throughout its length.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: June 3, 2003
    Assignee: Great Neck Saw Manufacturers, Inc.
    Inventor: Daniel Jacoff
  • Patent number: 6540200
    Abstract: A freezer tray unit that houses removable inserts with various cavity shapes. This unit can be used to make ice in an unlimited number of shapes, by simply changing the inserts. This unit is made up of several kit contents. The quantities required for one kit are the body (1), slotted rod (1), bottom tray (1), releasers (8), and inserts (8). The unit utilizes two mechanisms for ice removal. One mechanism removes ice from individual inserts. Features responsible for this mechanism are the insert guard, slotted rod, releaser, and bottom tray. Another mechanism removes ice from all the inserts simultaneously. The ice removal features utilized in this mechanism are the insert guard, ice guard, slotted rod, and releaser. The inserts can be utilized independently in refrigerators for effective space management. Also, the inserts may be utilized for making baked products in ovens.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: April 1, 2003
    Inventor: Oluwafemi Ajibola Afolabi
  • Patent number: 6345974
    Abstract: An ejector pin with a pressure sensor is provided, of which the sensor output can be utilized without any correction even in different diameter thereof, so that no design changes are required according to loads to the ejector pin. The ejector pin has a bar portion for extruding a molded component and a sleeve portion slidably housing the bar portion. The end of the bar portion faces the cavity from the opening at the end of the guide portion. A housing room is defined by the step portion at the lower end of the sleeve portion. A strain producing portion with an U-shaped cross section fixed on the base end of the bar portion is disposed inside the housing room. A strain sensor is attached on the lower surface of the beam of the strain producing portion. Only the area of the end of the bar portion is related to the pressure detection. When the pressure of a resin is applied on the end of the bar portion, the downward load on the bar portion bends the beam down.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: February 12, 2002
    Assignee: Futaba Denshi Kogyo Kabushiki Kaisha
    Inventors: Hiroaki Kawasaki, Yutaka Hiroshima, Chisato Akinari, Yasuo Ishiwata
  • Patent number: 6042361
    Abstract: A mold for use in a plastic injection molding system includes a venting pin assembly which can not only vent an article-defining cavity in the mold but can also eject a formed plastic article in an open position of the mold. A porous insert of the assembly permits air from the article-defining cavity to flow there-through while preventing the passage of molten plastic from the article-defining cavity in a closed position of the mold. A venting pin of the assembly in the form of a hollow ejector pin has an elongated aperture formed therethrough to permit the flow of air therethrough. The porous insert is positioned in the aperture at a gas hole formed through an end surface of the ejector pin. The insert and the gas hole are sized so that the insert and the end surface help to form a "Class A" surface on the article formed in the article-defining cavity.
    Type: Grant
    Filed: March 12, 1998
    Date of Patent: March 28, 2000
    Assignee: Larry J. Winget
    Inventor: John F. Murphy
  • Patent number: 5871782
    Abstract: An improved transfer molding apparatus has a laminated chase block with many sets, which is capable of fabricating a plurality of semiconductor packages. The apparatus includes an upper plate and a movable lower plate and a plurality of posts disposed between the upper and lower plates. A plurality of laminated chase blocks is fixed to the posts. A plurality of ejecting means are disposed at one side of the chase blocks and supply means concurrently supplies a molding compound to the plurality of chase blocks.
    Type: Grant
    Filed: November 26, 1996
    Date of Patent: February 16, 1999
    Assignee: LG Semicon Co. Ltd.
    Inventor: Sihn Choi
  • Patent number: 5804226
    Abstract: A bushing for retaining a knock out pin and a removable knock out pin assembly utilizing that bushing. The bushing has a pin holding portion composed of upstanding flexible arms engagable with a knock out pin, each of the arms having a lug for engaging the knock out pin. A retention ring is formed on the bottom of the bushing, the ring having an outwardly-extending flange for engaging an aperture in a plastic mold. The knock out pin has opposite grooves for accommodating the lugs of the bushing, the pin being removable by rotating the pin 90.degree. to disengage the lugs from the grooves so that the pin can be axially removed.
    Type: Grant
    Filed: December 9, 1996
    Date of Patent: September 8, 1998
    Inventor: Borislav Boskovic
  • Patent number: 5702736
    Abstract: An assembly for manufacturing a plastic piston using a first mold and a second mold, each mold having an axial recess, centering element, core element and contact face. The second mold is movable toward and away from the first mold and can be connected to the first mold using a transverse slide on the first mold and a holding apparatus.
    Type: Grant
    Filed: June 20, 1995
    Date of Patent: December 30, 1997
    Assignee: ITT Automotive Europe GmbH
    Inventor: Nabil Henein
  • Patent number: 5644833
    Abstract: An ejector is coated with a thin, hard, low friction, lubricous coating for use in a mold to eject molded articles from the mold without the use of liquid lubricants. The preferred ejector has a thin, low friction, coefficient coating with a thickness on the order of 0.00004 inch to 0.0001 inch. This coating provides long lasting, dry lubrication for low friction reciprocation of the ejector within a bore in the mold. The thin lubricous coating allows the ejector to be inventoried and sold in nominal sizes and cut down to the desired size by the mold builder to suit a specific application, and the cut ends are then deburred by the mold builder and finish ground to size, with the lubricous coating remaining intact at the cut end of the ejector. The coating is so thin that the nominal size of the ejector is essentially unchanged. The very thin coating does not chip or flake at the cut end, as would result in cavities into which the plastic could flow and form flashing on the plastic part being molded.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: July 8, 1997
    Assignee: D & L Incorporated
    Inventor: Glenn Starkey
  • Patent number: 5580416
    Abstract: A mandrel assembly has a hollow main tube and two annular sleeves, wherein an inner diameter of the two annular sleeves is larger than an outer diameter of the two main tube ends. The two annular sleeves are sleeved respectively on the two main tube ends, which can be easily disengaged from the mandrel assembly when applied with an external force.
    Type: Grant
    Filed: January 31, 1995
    Date of Patent: December 3, 1996
    Assignee: Industrial Technology Research Institute
    Inventors: Chin-I Lin, Chung-Lin Wu, Rong-Shian Liu, Gou-Don Chu
  • Patent number: 5547365
    Abstract: A fan blade mold is disclosed having a center shaft molding unit and a blade molding unit disposed around the center shaft molding unit and defining with the fan blade mold a plurality of blade molding cavities around the center shaft molding unit for molding the blades of the fan blade, the center shaft molding unit having a longitudinal center cavity for molding the center shaft of the integral fan blade to be molded, a plurality of knock-out pins spaced around the center cavity for knocking out the fan blade and for molding a respective circular dent on a hub of the fan blade, and a reference line raised from the top side and aligned with one lateral side of one blade molding cavity, the knock-out pins being respectively disposed at the radial lines which pass through the point at 1/3 of the radial width of each blade molding cavity measured from the left lateral side of each blade molding cavity.
    Type: Grant
    Filed: March 17, 1995
    Date of Patent: August 20, 1996
    Inventor: Wen-Hao Chuang
  • Patent number: 5501588
    Abstract: A mold for a semiconductor package having a port for feeding resin which can be fixed either in an upper mold (1) or a bottom mold (2) corresponding to the location of the flange tip so that the operating rate of the equipment is increased to achieve high productivity.
    Type: Grant
    Filed: April 17, 1995
    Date of Patent: March 26, 1996
    Assignee: Han-Mi Mold & Tool Co., Ltd
    Inventor: Nho K. Kwak
  • Patent number: 5480296
    Abstract: An improved transfer molding apparatus is provided for molding a preheated resin under pressure to thereby encapsulate a small element, such as a semiconductor device or package. In one aspect of the invention, the improvement consists of providing a shortened pot into which a piston is forcibly pressed to generate a flow of preheated resin in the encapsulating process, the improvement comprising the replacement of a single-element top drive plate, as found in a conventional apparatus, by a two-piece top drive plate which enables a shortening of the pot and corresponding reduction in the amount of air that would otherwise be trapped between the plunger and the resin during the process. The elimination of this air significantly reduces foaming, porosity, voids, and other defects in the cured resin which finally surrounds the electrical elements encapsulated thereby.
    Type: Grant
    Filed: June 22, 1994
    Date of Patent: January 2, 1996
    Assignee: Goldstar Electron Co., Ltd.
    Inventor: Keun Y. Jang
  • Patent number: 5451156
    Abstract: A mold assembly has an ejector assembly which includes a rotating camming device and a longitudinally sliding locking device. The ejector pins of the ejector assembly are replaced by rotating the camming device to slide the locking device into a disengaged position. The ejector pins are now free to be removed from the mold assembly. Once new ejector pins are inserted into the mold assembly the camming device is rotated back to its engaged position to lock the ejector pins into the mold assembly. The rotation of the camming device is in excess of 180.degree. which provides a locking feature in both the engaged and disengaged positions.
    Type: Grant
    Filed: February 4, 1994
    Date of Patent: September 19, 1995
    Assignee: Bermar Associates, Inc.
    Inventors: Paul E. Roncelli, deceased, Duane Pickering
  • Patent number: 5433263
    Abstract: The casting ejector includes a forcibly cooled ejector plate and a plurality of depending, solid ejector pins of high thermal conductivity cooperate with a casting mold to increase the strength of specifying portions of the casting. Copper, nickel, and alloys of each having a thermal conductivity of 40 W/mK or more are used, and the pins are disposed to contact high-stress locations of the casting.
    Type: Grant
    Filed: October 25, 1993
    Date of Patent: July 18, 1995
    Assignee: Hitachi Metals, Ltd.
    Inventors: Nobuaki Ohnishi, Yasuo Iizuka
  • Patent number: 5372496
    Abstract: A molding apparatus for plastic objects which includes a valve which allows ejector pins to be positioned in close proximity to the valve needle. The valve includes a valve body and a flange surrounding at least a portion of the valve body such that the outer edges of the valve body and/or the flange may have slots which extend lengthwise from the top to the bottom of the valve. Depressed portions in the side portions of the flange and corresponding outer edges of the valve body may also extend through the length of the valve. The slots and depressed portions may be utilized for positioning ejector pins in close proximity to the valve needle.
    Type: Grant
    Filed: February 18, 1993
    Date of Patent: December 13, 1994
    Inventor: Yoshihiko Taniyama
  • Patent number: 5356284
    Abstract: The present invention provides a mold with gas ejection of pieces formed in the mold. The mold includes a female body part and a male body part. The male body part includes a male molding surface with a surrounding plastic injection shut off face and a reciprocable gas controlling blow off pin slideably trapped within a pin recess at the shut off face. The pin has an enlarged bottom portion and a narrowed upper portion with a gas passage starting upwardly through the lower bottom portion into the upper portion and opening sideways through the pin which has a solid top surface above the sideways opening. The pin receiving recess has an undercut configuration including a small diameter upper region and a larger diameter base region with clearance for sliding of the pin in the recess. The clearance is at a minimum near the solid top surface of the pin and increases downwardly from the upper to the lower portion of the pin.
    Type: Grant
    Filed: July 1, 1991
    Date of Patent: October 18, 1994
    Assignee: Izon Industries Inc.
    Inventor: James Sheffield
  • Patent number: 5338176
    Abstract: The invention is a pie crust lifting tool and corresponding rolling board for lifting pie crusts from a rolling board and placing them in a pie plate in anticipation of baking. The lifting tool has a handle at one end and a circular shaped portion known as the lifting ring at the other end. The rolling board is used in conjunction with the tool and has a specially shaped groove in the upper surface in order to accommodate the tool when the crust is being rolled. The groove is circular in shape and has a straight channel connecting the circular shape with one edge of the board. The tool rests in the board until one is ready to use the board. Pie crust or other dough is rolled on the board and then lifted off of the board by use of the lifting tool. The dough is then transported to a pie plate or pie dish or other baking utensil.
    Type: Grant
    Filed: June 8, 1993
    Date of Patent: August 16, 1994
    Inventor: Michael A. Semeraro
  • Patent number: 5295802
    Abstract: A gripper (2) for removing a molded workpiece (9) from the opened mold (1, 3) of a molding machine is coupled through a step-up drive transmission with the ejector (13, 15, 17) associated with the mold in such a manner that the ejector causes it to execute a movement away from the ejector in the same direction of motion as the ejector. The drive transmission can in particular have co-operating limit stops (45, 43) on the ejector and on the gripper, and one of these limit stops is mounted on a drive step-up lever (37). In another embodiment, the step-up drive transmission is designed as a hydraulic transmission.
    Type: Grant
    Filed: November 30, 1992
    Date of Patent: March 22, 1994
    Inventor: Richard Hersbt
  • Patent number: 5219594
    Abstract: Disclosed is a molding apparatus which includes(A) a mold for making an undercut part which includes coring sandwiched between top and bottom cavity halves, where the coring is divided into three or four sections; and(B) a press for(1) separating the coring from the top and bottom cavity halves; and(2) separating the sections from each other.
    Type: Grant
    Filed: August 10, 1992
    Date of Patent: June 15, 1993
    Assignee: Occidental Chemical Corporation
    Inventors: Leon G. Meyer, Thomas T. Brylinski
  • Patent number: 5074779
    Abstract: A mold for resin-sealing of a semiconductor device includes a molding board, a cavity retainer which is secured to the molding board forming a void facing the molding board, a plurality of cavity inserts, each of which is embedded in the cavity retainer so that the face thereof is exposed, each cavity insert having a cavity formed in the face, a plurality of ejecting pins arranged to travel freely and penetrating each cavity insert and the cavity retainer, one end of the ejecting pin protruding into the inside of the void of the cavity retainer, the other end of each ejecting pin protruding into the inside of the cavity of the cavity insert, an ejector plate to which one end of each ejecting pin is secured, the ejector plate being positioned in the void of the cavity retainer, and elastic pins which penetrate through the ejector plate to elastically support the cavity inserts on the molding board.
    Type: Grant
    Filed: November 14, 1990
    Date of Patent: December 24, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasutsugu Tsutsumi, Sueyoshi Tanaka
  • Patent number: 5017123
    Abstract: The invention provides means for removably attaching ejector pins for an injection molding machine to a movable knock-out plate. The knock-out plate has slidably attached thereto a latch plate to engage ejector pin heads and thereby secure them to the knock-out plate.
    Type: Grant
    Filed: March 7, 1990
    Date of Patent: May 21, 1991
    Inventor: Paul G. Sloane
  • Patent number: 5015280
    Abstract: A mold arranged between a pair of heater blocks for molding an optical element comprises a pair of first and second elements each having a molding surface for defining a cavity and an outer surface opposite to the molding surface and in contact with a corresponding heater block, and a ring member for guiding the first and second elements. The rear surface of at least one of the first and second elements has a part which is not in contact with the corresponding heater block. Also, another mold comprises a pair of first and second elements each having a molding surface for defining a cavity and an outer surface opposite to the molding surface, a first ring member for guiding the first and second elements, and a second outer ring member made of a material with a lower thermal conductivity than that of the first ring member. A molding method for optical elements is such that a glass with a viscosity of 10.sup.
    Type: Grant
    Filed: August 22, 1989
    Date of Patent: May 14, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takayuki Kimoto, Masaaki Sunohara, Takashi Inoue, Shoji Nakamura, Daijirou Yonetani
  • Patent number: 5011398
    Abstract: A device for aiding in the assembly of a mold apparatus of the type including a mold cavity having a first side which is contoured to impart a shape to a component, a second side, and an aperture extending between the first and second sides, and of the type including an ejector pin positioned adjacent the second side, the ejector pin having an end positioned to move into the aperture to become a portion of a surface including the first side when the mold assembly is assembled, and positioned to effect movement of the component away from the mold cavity after the component is imparted with the shape, the device including an assembly pin having an end positioned to pass through the aperture, and a sleeve having a first portion positioned to slide onto the end of one of the ejector pins and to support itself on the end of the ejector pin and having a second portion protruding from the end of the ejector pin to receive therein the end of the assembly pin in axial alignment with the ejector pin in the sleeve.
    Type: Grant
    Filed: July 26, 1990
    Date of Patent: April 30, 1991
    Assignee: Outboard Marine Corporation
    Inventor: Russell J. VanRens
  • Patent number: 4981430
    Abstract: A pneumatically operated mold ejection apparatus using a pneumatic pressure source exterior to a multiplate injection molding tool. The pressure source operates at least one knock-out pin disposed within a molding plate. Said pin is connected to a pneumatic piston spring loaded against a stop positioning the pin flush with the inner wall of the cavity during injection of plastic. The stop also positions the piston so that compressed air can reach the piston's surface when the pressure source is actuated. The piston includes a circumferential annular groove containing an O-ring for pneumatic sealing. The back side of the molding plate includes pneumatic channels between the cylinder and their intersection with a complimentary channel in the backing plate. These channels connect the system to the pressure source, and are surrounded by an O-ring trapped between the molding and backing plates for pneumatic sealing.
    Type: Grant
    Filed: January 23, 1989
    Date of Patent: January 1, 1991
    Inventor: Joseph E. Zimmerman, Jr.
  • Patent number: 4979891
    Abstract: A mold for forming an optical disk base provided with a movable specular plate, a stationary specular plate, and an annular stamper having inner and outer peripheral edges. The reverse surface of the stamper is in contact with one of the specular plates, and the stamper is supported at its inner end portion by an inner stamper retainer and at its outer end portion by an outer stamper retainer. A cavity is formed between the stamper and the other one of the specular plates when the mold is closed.
    Type: Grant
    Filed: August 9, 1989
    Date of Patent: December 25, 1990
    Assignee: Sumitomo Heavy Industries, Ltd.
    Inventor: Takehiko Kitamura
  • Patent number: 4929170
    Abstract: An ejector blade for ejecting parts from injection molds. The ejector blade has an elongate shank portion with a slotted end therein, a flat blade portion having an end shaped to be engaged within the slot, and apertures through the engaged ends in registration with one another with a pin engaged in the apertures to join the shank and blade portions releasably so that different blade portions can be mounted on the shank portion. The pin is a slotted roll pin and the aperture in the shank portion is larger in diameter than the aperture in the blade portion in order to permit some movement between the blade and shank portions to accommodate variations in a mold in which the ejector blade is used.
    Type: Grant
    Filed: April 27, 1989
    Date of Patent: May 29, 1990
    Inventor: Borislav Boskovic
  • Patent number: 4891002
    Abstract: A product ejector in a motor-driven, direct-acting type hydraulic mold clamping system, which includes a rod mounted on a ball screw for driving a moving platen at a forward end of the screw on the side of the platen, so that the rod is immovable axially and engageable with and disengageable from an ejector plate attached to an ejector bar slidably arranged within a bore in the platen. When the platen moves rearwardly, the ejector plate, moving together with the platen, is abutted against the rod. As the platen moves farther rearwardly, the rod causes the ejector bar to project into a mold mounted to the platen, against the force of a spring inteposed between the ejector plate and the platen, to eject a molded article.
    Type: Grant
    Filed: April 15, 1988
    Date of Patent: January 2, 1990
    Assignee: Fanuc Ltd.
    Inventors: Yoshiharu Inaba, Shigeo Tokunaga
  • Patent number: 4824358
    Abstract: A rotary block having a gate is rotatably mounted within either one of stationary or movable die plates so that the gate forms a resin passage interconnected to a molding cavity in the stationary die plate in the mold closing state. A gate slug which is inevitably formed on a molded article in injection molding can effectively be cut off by rotating the rotary block so as to intercept the resin passage before a mold opening process.
    Type: Grant
    Filed: June 8, 1988
    Date of Patent: April 25, 1989
    Assignee: Shinkoh Sellbic Co., Ltd.
    Inventor: Hiroshi Takeuchi
  • Patent number: 4819906
    Abstract: A mold to manufacture an improved press-on bottle cap is disclosed. The cap has a top disk and a thin-walled outer skirt dependent therefrom with an annular tear score line on its inside wall and a laterally projecting tear tab which permit the cap to divide into a lower portion an upper reclosure cap. An annular lip is provided about the outside wall of the cap, approximately in the middle of the reclosure cap. The lip is discontinuous with an open sector above the tear tab. The mold has its parting line in the plane of the annular lip and the lower half of the mold has a lateral cavity to form the tear tab. In this manner, a laterally offset tear tab is provided without splitting the mold cavity along an axial plane.
    Type: Grant
    Filed: December 29, 1986
    Date of Patent: April 11, 1989
    Inventor: Benjamin A. Cochrane
  • Patent number: 4805869
    Abstract: A method and apparatus for the manufacture of molded plastic tape dispensers are convenient and efficient for the production of a plurality of tape dispensers having both common and differing design shape portions, and enable a simplified changeover between production runs of differing designs. A stationary mold plate is adapted to releaseably receive one of a plurality of inserts having differently designed mold cavities formed therein.
    Type: Grant
    Filed: June 23, 1987
    Date of Patent: February 21, 1989
    Assignee: Manco, Inc.
    Inventors: Craig M. Saunders, John R. Nottingham
  • Patent number: 4793499
    Abstract: A tamper evident closure device having a closure with an internally threaded skirt with a groove therein between radially outer and inner skirt portions to receive a tamper evident band having an inwardly extending bead which engages under a transfer ring of a container to hold the tamper evident band down and hence separate it from the closure as the closure is unscrewed from the container. A method of simultaneously stripping the closure and tamper evident band from a common mold core is also disclosed.
    Type: Grant
    Filed: November 13, 1987
    Date of Patent: December 27, 1988
    Assignee: Alfatechnic AG
    Inventors: Werner F. Dubach, Kenneth M. Sinnott
  • Patent number: 4741197
    Abstract: A method of removing or ejecting a part from a first die after the part has been superplastically formed in a cavity of the die at an elevated temperature such that the part sticks to the surfaces of the die. The method includes the steps of forming a flange of the part between opposed die surfaces and providing movable plate within the die cavity and a ring on the opposed surface of the first die that engages the flange and the part in the cavity in a uniform manner. The movable plate and ring are then translated away from the die surfaces to uniformly move the part from the first die after the dies are separated.
    Type: Grant
    Filed: April 25, 1986
    Date of Patent: May 3, 1988
    Assignee: Aluminum Company of America
    Inventors: Edwin H. Spuhler, James M. Story
  • Patent number: 4618121
    Abstract: A mold for forming a plastic cap and removing a cap from such a mold. The mold comprises female and male members which, together, form a mold cavity in which the cap is formed. The female member includes an upper assembly and a plurality of cams. The cams have radial protrusions engaging the male member to form annular recesses in the cap. The cap is removed from the mold by moving the upper assembly of the female member axially and the cams thereof radially away from the cap, and then removing the cap itself from the male member of the mold. Preferably the cap is shrunk onto the male member to develop a space between the cap and the female member of the mold prior to moving the female member away from the cap.
    Type: Grant
    Filed: August 15, 1984
    Date of Patent: October 21, 1986
    Assignee: American Safety Closure Corp.
    Inventor: Vincent N. Conti
  • Patent number: 4595169
    Abstract: There is disclosed a mold for making a fastener assembly which is substantially less expensive to construct and maintain than existing molds. The disclosed mold uses one-half the number of ejector pins ordinarily used in molding fastener assemblies having connected fasteners with bar sections and button sections joined by filament sections. The improved fastener assembly is useable in a hand-held tag attacher of a well-known type, e.g., as disclosed in U.S. Pat. No. 3,650,452.
    Type: Grant
    Filed: August 1, 1985
    Date of Patent: June 17, 1986
    Assignee: Monarch Marking Systems, Inc.
    Inventor: Gene R. Derringer
  • Patent number: 4588158
    Abstract: A single-piece, injection molded rack for holding test tubes or similar articles and a mold for producing the same. In a preferred three-tiered form, the intermediate tier is a lattice defined by the intersection of two superposed sets of parallel bars. These two sets of bars are formed by two pairs of correspondingly channeled slides that cooperatively engage to form a portion of the mold cavity corresponding to the lattice. The channels in each set of slides are aligned with the path of movement of the slides to permit their sliding, uniaxial movement relative to the molded bars. To further enable this sliding movement between mold segments and the molded rack, the connecting supports between the top tier and the intermediate tier are provided on the sides of the rack, while the connecting supports between the intermediate tier and the bottom tier are provided on the front and rear of the rack.
    Type: Grant
    Filed: August 26, 1985
    Date of Patent: May 13, 1986
    Assignee: Sybron Corporation
    Inventor: Ravinder C. Mehra
  • Patent number: 4562990
    Abstract: In molding of plastic materials, particularly thermoset compounds, venting of dies is essential to obtain well molded parts, and this invention discloses improved venting of dies in molding of thermoset plastic compounds wherein a vent path 4 vents from the die into a vent well 3, said vent well comprises a wedge shape having a transition angle of 10.degree. to 35.degree. and a vent extension 6 extending from said vent well 3, to the atmosphere.
    Type: Grant
    Filed: June 6, 1983
    Date of Patent: January 7, 1986
    Inventor: Robert H. Rose
  • Patent number: 4555086
    Abstract: A plastic molding apparatus for molding a semiconductor element with a plastic by using transfer molds which comprising upper and lower heater plates, lower and upper molds disposed between the upper and lower heater plates, a first lower ejector plate disposed below the low heater plate, a second lower ejector plate disposed between the lower heater plate and the lower mold and connected to the first lower ejector plate through rods, lower ejector pins mounted on the second lower ejector plate capable of extending into mold cavity and a device for controlling the movement of the second lower ejector plate.
    Type: Grant
    Filed: January 10, 1984
    Date of Patent: November 26, 1985
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventor: Tsutomu Kiyotomo