Abstract: The present disclosure provides a robot palm, which includes: a housing having a particle-containing space configured to accommodate particles so that a pressure thereof is changeable; particles filled in the particle-containing space; and an upper membrane installed at an upper portion of the housing and configured to grip an object by changing its shape and rigidity according to a pressure change of the particle-containing space.

Abstract: A gripper for a picking device for small piece goods is provided. The gripper includes a delivery table extending in a first horizontal direction and a second horizontal direction orthogonal to the first horizontal direction, a gripping jaw guide assembly having two gripping jaws extending in the first horizontal direction over the delivery table, wherein at least one of the gripping jaws is movable in the second horizontal direction, and a drive unit which is coupled to the gripping jaw guide assembly and configured to move the gripping jaw guide assembly in the first horizontal direction. At least one of the gripping jaws is configured as a suction jaw and has a suction device having a suction surface for suctioning a small piece good, wherein a vacuum can be applied on the suction device using a suction line.

Abstract: The present disclosure relates to a system for assembling an inside mirror for a vehicle, the system including a plurality of robots each having at least one of a vision measurement unit, a fastening unit, and a gripper configured to grip an inside mirror for a vehicle, and a control unit configured to control the plurality of robots to measure a first mounting surface of a windshield glass and a second mounting surface of the inside mirror, move the inside mirror so that the first and second mounting surfaces are attached to each other while overlapping each other, and fasten the inside mirror and the windshield glass in a state in which the first and second mounting surfaces are attached to each other.

Abstract: In a teaching method for an industrial robot having a hand on which a conveyance object is to be mounted, the teaching method includes a positioning member attaching step in which a positioning member for determining a position of a conveyance object to be mounted on the hand in a horizontal direction is attached to an upper face side of the hand and, after that, a teaching step in which the hand is moved to a predetermined position to perform teaching for the industrial robot, and after that, a positioning member detaching step in which the positioning member is detached from the hand. When the conveyance object is mounted on the hand in a state that an end face of the conveyance object is contacted with the positioning member, the conveyance object is disposed at a normal mounting position on the hand.

Abstract: A vibration motor includes a first vibrating body including a first projection and a second vibrating body including a second projection, the first vibrating body and the second vibrating body receiving electric power and vibrating to generate a driving force and transmitting the driving force to a driven section, a first coil spring configured to urge the first vibrating body and the second vibrating body in a driving direction and restrict positions of the first vibrating body and the second vibrating body in the driving direction, and a case housing the first vibrating body, the second vibrating body, and the first coil spring. The first vibrating body, the second vibrating body, and the first coil spring are arranged in the driving direction. The number of first coil springs is smaller than the number of first and second vibrating bodies in the urging direction.

Abstract: A retainer apparatus configured to releasably retain an article, comprising a face plate member each having a front face, a plurality of vacuum cups and a plurality of support pins each extending distally relative to the front face, respectively, wherein the vacuum cups and the support pins are laterally spaced from one another, wherein the plurality of vacuum cups retain the article to the retainer apparatus in a presence of vacuum, wherein the plurality of support pins are extendable/retractable relative to the face plate member, wherein each of the support pins have a longitudinal axis, respectively, and are configured to contact the article to support the article against movement along the longitudinal axis and support the article against movement transverse to the longitudinal axis, and a locking mechanism configured to inhibit the support pins from being retractable and extendable when the locking mechanism is engaged.

Abstract: A robot controller is a controller which controls, via a hand control device, a robot hand that grips an article with two or more gripping portions. The robot controller includes, a size information acquisition unit which acquires size information about the article based on an image obtained by a visual sensor for detecting the article, and a gripping adjustment unit which changes, in response to the size information, a gripping distance, which is the space between the gripping portions, in a gripping state or a gripping force of the gripping portions in the gripping state.

Abstract: A robot control device includes: a creep-information storage unit that stores an amount of bending in correspondence with a cumulative time, the bending occurring in a robot due to creep deformation; a mastering-data storage unit that stores mastering data of the robot; a timer that measures the cumulative time; and a correction unit that corrects the mastering data stored in the mastering-data storage unit based on the amount of bending stored in the creep-information storage unit in correspondence with the cumulative time measured by the timer.

Abstract: A substrate transport apparatus for transporting substrates, the substrate transport apparatus including a frame, at least one transfer arm connected to the frame, at least one end effector mounted to the at least one transfer arm and at least one substrate support pad disposed on the at least one end effector, the at least one substrate support pad has a configuration that effects increased friction force, resulting from an increased friction coefficient, in at least one predetermined direction.

Abstract: A method of aligning a substrate contact material to a substrate material includes determining a hardness of a substrate material. The method further includes matching a hardness of a substrate contact material to the hardness of the substrate material. The method further includes adding the substrate contact material to a plurality of contact structures of a substrate handling device, wherein the substrate handling device comprises an edge and a planar surface, a first contact structure of the plurality of contact structures extends from the edge, and a second contact structure of the plurality of contact structures extends from the planar surface.

Abstract: Substrate transfer robot blades used to engage and support a substrate during transfer include a blade body having a blade support surface and at least one pad having a top surface and an opposite bottom surface, a central opening extending from the top surface to the bottom surface, and a resilient portion formed from the at least one pad. The resilient portion formed from the at least one pad extends from and cantilevers from a side surface of the central opening of the at least one pad that is disposed directly on the side surface at the end of a long axis of the resilient portion. The resilient portion further includes a curved substrate contact surface on an outermost end of the resilient portion on which a substrate is supported when disposed on the substrate transfer robot blade.

Abstract: Disclosed is a surgical instrument with an elongate body with a longitudinal axis having a distal end and a proximal end. The instrument has a pitch capstan having an axis transversely to the longitudinal axis at one end of the elongate body. At least two pairs of cables extend along the elongate body, along the pitch axis to a respective work member to which they are attached. The cables are guided in sliding contact along a slide bearing situated at or near the pitch axis. Also disclosed is a handle for a medical instrument having a hinging connection with the elongate body situated near an inside hand region of the user.

Abstract: User interface devices for manipulating a robotic surgical tool in a surgical robotic system are described. A user interface device can includes a device body containing a tracking sensor to generate a spatial state signal in response to movement of the device body. The spatial state signal can be used to control a spatial motion of a surgical robotic system actuator. Several grip linkages can be pivotally coupled to the device body. A grip linkage displacement sensor may monitor movement of the grip linkages relative to the device body, and generate a grip signal in response to the movement. The grip signal can be used to control a grip motion of a robotic surgical tool mounted on the surgical robotic system actuator. Other embodiments are also described and claimed.

Abstract: A gripping device includes carriages or pivot arms carrying gripping elements. The carriages or pivot arms are mounted and guided in a base body and are drivable by at least one cylinder-piston unit. A switching module is mounted on the base body. The switching module includes at least one pressure medium connection and at least one electrical connection. At least one electrically controllable valve, which is switching a pressure medium, and at least one electronic controller for implementing external and internal control signals are arranged in the control module. The internal control signals originate from at least one sensor which detects at least one physical characteristic variable of the carriage(s) and/or the cylinder-piston unit at least in or on the base body. The gripping device can be adapted to at least one machine control system with a minimum interconnection and programming effort.

Abstract: A present disclosure relates to a shape compliant electroadhesive gripper for picking up atypical objects having various shapes, sizes, and materials, and a shape compliant electroadhesive gripper according to one embodiment of the present disclosure includes a body, a shape compliant module disposed on the body, rigidity of the shape compliant modules being variably controllable, and an electroadhesive module disposed on the shape compliant module.

Abstract: Robotic gripper fingers are disclosed. A gripper assembly includes a first finger defining a first object engagement face and a second finger defining a second object engagement face. The first object engagement face of the first finger opposes the second object engagement face of the second finger. The gripper assembly also includes at least one actuator in communication with the first finger that is configured to actuate the first finger relative to the second finger. The gripper assembly includes at least one first sensor facing outward from the first object engagement face. The at least one first sensor is configured to detect objects to be manipulated by actuating the first finger relative to the second finger.

Abstract: A surgical instrument comprises a spacer element comprising a proximal region and a distal region, an end effector coupled to a distal end of the spacer element, a user hand interface at a proximal end of the spacer element, and a securing element for securing the proximal end of the spacer element to a user wrist. The user hand interface comprises an elongate member including a lumen and extending from a distal end to a proximal end of the user hand interface. The user hand interface further comprises an actuation cable extending within the lumen from the distal end to the proximal end of the user hand interface. The proximal region of the spacer element comprises a curved portion extending from the user hand interface. The user hand interface is movable in a manipulation space proximal of the distal region and distal of the proximal end of the spacer element.

Abstract: Provided is a substrate processing apparatus including a load-lock chamber; a transfer chamber connected to the load-lock chamber; and one or more processing chambers connected to the transfer chamber. The transfer chamber includes a transfer arm that transfers a substrate between the load-lock chamber and the one or more processing chambers, the load-lock chamber includes a plurality of load-lock stations for accommodating a plurality of substrates as a matrix of m×n. According to the substrate processing apparatus, a time taken to transfer substrates may be reduced greatly, and productivity may be improved.

Abstract: A semiconductor processing apparatus according to the present embodiment is provided with a stage capable of placing a semiconductor substrate thereon and of rotating the semiconductor substrate. A plurality of holders are provided on the stage, to hold an edge of the semiconductor substrate. A plurality of sensors are provided to the plurality of holders, respectively, to detect the edge of the semiconductor substrate. An elevator mechanism is capable of changing heights of the holders. A controller controls the elevator mechanism to change the heights of the holders so that the plurality of sensors detect the edge of the semiconductor substrate.

Abstract: An endoscopic surgical assembly houses at least one force transmitting member that is connected to a surgical attachment supported on the endoscopic surgical assembly. The endoscopic surgical assembly includes an elongate shaft having a proximal end and a distal end configured for connection to a surgical attachment. At least one longitudinal cavity is formed in an outer surface of the elongate shaft and extends between the proximal and distal ends of the elongate shaft. The at least one longitudinal cavity is configured for disposal of the at least one force transmitting member therein such that the at least one force transmitting member is translatable relative to the elongate shaft.

Abstract: A substrate transport apparatus for transporting substrates, the substrate transport apparatus including a frame, at least one transfer arm connected to the frame, at least one end effector mounted to the at least one transfer arm and at least one substrate support pad disposed on the at least one end effector, the at least one substrate support pad has a configuration that effects increased friction force, resulting from an increased friction coefficient, in at least one predetermined direction.

Abstract: An apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include at least a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.

Abstract: A workpiece processing apparatus including a control unit that is provided with a storage medium on which a polishing load measured when an upper turn table is moved downward to a fixed position in a state wherein the workpiece is properly held in holding hole of the carrier is recorded in advance, calculates a difference between a polishing load measured when upper turn table is moved downward to the fixed position in a state wherein the workpiece is held in holding hole of the carrier and the polishing load recorded on the storage medium, and judges the occurrence of abnormal holding of the workpiece if the calculated difference exceeds a threshold value. As a result, it becomes possible to detect abnormal holding of a workpiece in a short time with a high degree of precision before the workpiece is processed and prevent breakages of the workpiece and the processing apparatus.

Abstract: A substrate transport device includes a shaft, a first moving part for moving the shaft in a vertical direction and in a rotational direction, at least one rotation arm attached to the shaft, and a supporting part having an upper surface waved as seen front view, wherein the rotation arm includes a contact rotation arm which directly or indirectly contacts the upper surface of the supporting part.

Abstract: An object of the present invention is to provide a charged particle beam device that suppresses the influence of an external electromagnetic wave, even when a shielding member, such as a vacuum valve, is in the open state. To achieve the above object, a charged particle beam device including a vacuum chamber (111) having an opening (104) that surrounds a sample delivery path is proposed. The charged particle beam device includes a conductive material (118) surrounding the opening (104) for conduction between the vacuum chamber (111) and a conductive member (106) disposed on the atmosphere side. According to an embodiment of the present invention, it is possible to restrict an electromagnetic wave (117) from reaching the sample chamber via the delivery path.

Abstract: A method of manufacturing a jaw member of an end-effector assembly includes forming one or more stress-relief cavities within a sealing plate. Each one of the one or more stress-relief cavities defines a pad portion of an electrically-conductive surface of the sealing plate. The method also includes forming a stop member on each pad portion of the electrically-conductive surface of the sealing plate, performing an overmolding operation wherein the one or more stress-relief cavities is configured to prevent force applied to a bottom surface of the sealing plate during the overmolding operation from stressing each pad portion to avoid compromising adhesion between the stop member and the electrically-conductive surface of the sealing plate.

Abstract: In accordance with one aspect of the exemplary embodiments, a substrate transport apparatus is provided comprising a drive mechanism, a movable arm assembly connected to the drive mechanism, an end effector connected to the arm assembly. A chuck for holding a substrate is mounted on the end effector and having a movable edge gripper with a contact surface and an edge of the substrate may be gripped by actuating the movable edge gripper to engage the substrate with the contact surface. The apparatus further comprising a motion sensor for providing a signal to actuate the movable edge gripper to close and open the moveable edge gripper for capturing and releasing the substrate.

Abstract: A substrate transfer apparatus and a substrate transfer system are disclosed. The substrate transfer apparatus including a main body and a plurality of main arms arranged side by side on the main body, wherein a plurality of branch arms are disposed on both sides of each of the main arms, and the plurality of main arms and the plurality of branch arms are disposed in a same supporting plane. When a substrate is transferred, the plurality of main arms and the plurality of branch arms are both disposed beneath the substrate and support the substrate together. Therefore, the downward recess of the substrate due to gravity action can be greatly reduced, so that the flatness of the substrate can be effectively improved, therefore, the display quality of the display product produced can be improved.

Abstract: A self-damping end effector including a base, a finger extending from the base and adapted to support a substrate, and a damper associated with the finger, the damper having a natural frequency within a predetermined tolerance of a natural frequency of the finger.

Abstract: The present disclosure provides a robot gripper, comprising a bottom plate (101), a side plate A (102), an intermediate plate (103), a side plate B (104), guide rods (105), sliding blocks (106), cylinders (107), spherical joints (108), pneumatic quick plug connectors, a connecting plate (114), racks (115), a gear (116), a gear shaft (117), a horn type switch support (120), detection switches (121) and a detection head (122). By adopting the robot gripper, the bottom plate (101) can be connected with six-shaft flanges of a robot together by connectors; a gripper arm can be designed to connect the connecting plate (114) to grip a hub according to different demands; and the opening and closing state of the gripper can be detected by the detection switches (121). The robot gripper has the advantages of low price, compact overall structure, large clamping force, strong stability and the like.

Abstract: A substrate carrying device includes pads that hold a substrate, and a hand having recesses formed therein. The pads are placed in the recesses and detachably attached to the hand. Each of the pads includes a flange, and the flange of at least one of the pads includes an outer peripheral part detachably attached to the hand, an elastic part that is able to bend in the recess, and a substrate holding part that rises from an inner edge of the elastic part and holds the substrate by vacuum suction.

Abstract: A substrate transporting arm and a substrate transporting apparatus to prevent a substrate from sliding and increase a process speed of the substrate, thereby improving productivity. The substrate transporting arm includes a body and a plurality of substrate supporters coupled to the body. Each of the plurality of substrate supporters includes a substrate holder and a substrate supporter pin, and an inner side of the substrate holder includes an inclined portion.

Abstract: Embodiments of mechanisms for measuring the distance between a robot blade and at least one measurement target are provided. A method for measuring the distance includes emitting a signal to the measurement target by a signal source assembly. The method also includes receiving the signal reflected from the measurement target by a signal reception assembly. The method further includes determining the distance between the robot blade and the measurement target. The distance is determined based on the time difference between the emission of the signal from the signal source assembly and the receipt of the signal by the signal reception assembly.

Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.

Abstract: An anti-slip end effector for transporting a workpiece, configured to be attached to a robotic arm, includes: a workpiece-supporting area for placing a workpiece thereon for transportation; and at least one anti-slip protrusion disposed in the workpiece-supporting area for supporting a backside of the workpiece, said anti-slip protrusion having a top face capable of contacting and adhering to the backside of the workpiece by van der Waals force and capable of pivoting on a pivot axis, said pivot axis being disposed away from a center of the top face as viewed from above.

Abstract: A wafer handling traction control system is provided that is able to detect slippage of a semiconductor wafer with respect to an end effector and is able to adjust the end effector's movement in order to minimize further slippage. Upon the detection of relative motion of the semiconductor wafer with respect to the end effector past a threshold amount, the end effector's movements are adjusted to minimize slippage of the semiconductor wafer. The wafer handling traction control system may include a sensor that detects relative motion between the semiconductor wafer and the end effector.

Abstract: Disclosed is an end effector apparatus including a base including a wrist coupling component. The base may be substantially triangular in shape. A plurality of fingers extends from the base. Each finger includes a plurality of wafer support pads for supporting wafers being processed. Each finger has a width dimension, a height dimension and a length dimension, wherein the height dimension tapers smaller along at least a tip portion of the finger.

Abstract: A robotic system that can have a body and four flippers is described. Any or all of the flippers can be rotated. The flippers can have self-cleaning tracks. The tracks can be driven or passive. The robotic system can be controlled by, and send audio and/or video to and/or from, a remote operator control module. The methods of using and making the robotic system are also described.

Abstract: There are provided a substrate transferring apparatus for continuously loading/unloading a plurality of substrates in and from a process chamber to reduce time spent on transferring the substrates and to improve productivity and a substrate processing system using the same. The substrate transfer apparatus is installed in the transfer chamber and transfers substrates between first and second process chambers which is positioned lateral sides of the transfer chamber and a load rock chamber. The substrate transfer apparatus includes a driving unit to supply a rotational force, a spindle connected to the driving unit, first swivel plate arms to load/unload substrate to/from first process chamber, and second swivel plate arms to load/unload substrate to/from second process chamber. Since substrates before and after being processed are rapidly exchanged during the simultaneous or continuous process of plural substrates, processing rate increases and overall productivity can be increased.

Abstract: An apparatus for testing a wafer includes a wafer chuck on which the wafer is loaded to perform a wafer test process. The wafer chuck is maintained at a high temperature in a predetermined temperature range. The apparatus for testing a wafer further includes a wafer handling arm supporting the wafer and transferring the wafer to the wafer chuck, and a wafer heating module coupled to the wafer handling arm, arranged parallel to the wafer, and preheating the wafer to be loaded on the wafer chuck.

Abstract: Embodiments of mechanisms for measuring the distance between a robot blade and at least one measurement target are provided. A method for measuring the distance includes emitting a signal to the measurement target by a signal source assembly. The method also includes receiving the signal reflected from the measurement target by a signal reception assembly. The method further includes determining the distance between the robot blade and the measurement target. The distance is determined based on the time difference between the emission of the signal from the signal source assembly and the receipt of the signal by the signal reception assembly.

Abstract: An actuator includes an effective stiffness. The effective stiffness is based at least in part on non-linear deflection characteristics of buckling. A method of varying an effective stiffness of an actuator includes providing an actuator and varying an effective stiffness of the actuator based at least in part on non-linear deflection characteristics of buckling. Another method of varying an effective stiffness of an actuator includes applying a load to a member. The load causes the member to buckle, and the buckling produces non-linear deflection of the member. The method further includes varying an effective stiffness of an actuator based at least in part on the non-linear deflection of the member.

Abstract: In an embodiment, the present invention discloses a EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty and cleaned environments, separate cleaning chambers for different components of the double container carrier, gripper arms for picking and placing different components using a same robot handler, gripper arms for holding different components at different locations, horizontal spin cleaning and drying for outer container, hot water and hot air (70 C) cleaning process, vertical nozzles and rasterizing megasonic nozzles for cleaning inner container with hot air nozzles for drying, separate vacuum decontamination chambers for outgassing different components, for example, one for inner and one for outer container with high vacuum (e.g., <10?6 Torr) with purge gas, heaters and RGA sensors inside the vacuum chamber, purge gas assembling station, and purge gas loading and unloading station.

Abstract: Disclosed is a wafer support and alignment apparatus. The wafer support and alignment apparatus includes a wafer support component adapted to seat, align and support a wafer. The wafer support component includes at least one flat portion to support the wafer, at least one alignment lip portion protruding upward from the at least one flat portion, and at least one recessed pocket carved out of a portion of the at least one base portion. The at least one recessed pocket is adapted to receive at least one pad.

Abstract: A protective device is provided for a gripping device on a handling apparatus, e.g., a handling robot. The gripping device has gripping parts in the form of gripping fingers, which gripping parts are movable using a transmission mechanism. The gripping device has at least one overload safety device as the protective device which, in response to the exceeding of a certain force on the gripping device, has the effect of an evasion of the gripping device. The protective device responds exclusively in response to forces which occur from a direction and which act upon the gripping parts outside a direction of forces required for gripping objects.

Abstract: A suction structure includes a pad and a fixing base. The pad includes a contact portion which makes contact with a target object to be sucked and which has a seal wall, and a major surface portion which is surrounded by the contact portion and which defines an inner space in conjunction with the seal wall as the contact portion makes contact with the target object. The fixing base includes a support portion configured to support the pad at a position offset from the center of the major surface portion of the pad, and a suction hole configured to bring the inner space into communication with a vacuum source.

Abstract: A robotic end effector system and method having a plurality of end effectors which are selectively suitable for particular applications on a workpiece. The end effectors include a resident controller adapted to execute tasks specific to the end effector and are rapidly attachable and removable from the robot for easy change over to different workpieces.

Abstract: A robot hand (10) comprises an outside section that is not adapted for entry into a high-temperature area and an entry section adapted for entering the high-temperature area includes a frame (15) extending from the base unit and covering intermediate portions of the shafts; a distal end support (30) provided in the frame and adapted to support near distal end portions of the shafts; and holding units (13, 14) each attached to corresponding each of the shafts for holding a workpiece. The proximal end support is adapted to support the shafts via a bearing. The distal end support includes support holes larger than the outer diameters of the shafts such that the shafts are inserted into the support holes, respectively.

Abstract: The present disclosure relates to a wafer transfer robot having a robot blade that can be used to handle substrates that are patterned on both sides without causing warpage of the substrates. In some embodiments, the wafer transfer robot has a robot blade coupled to a transfer arm that varies a position of the robot blade. The robot blade has a wafer reception area that receives a substrate. Two or more spatially distinct contact points are located at positions along a perimeter of the wafer reception area that provide support to opposing edges of the substrate. The two or more contact points are separated by a cavity in the robot blade. The cavity mitigates contact between a backside of the substrate and the robot blade, while providing support to opposing sides of the substrate to prevent warpage of the substrate.

Abstract: This robot hand includes a first finger portion and a second finger portion being relatively movable in a direction in which an object to be grasped is grasped and bar-shaped claw members fixed to the first finger portion and the second finger portion. A plurality of claw members are fixed in parallel to at least either the first finger portion or the second finger portion.