Fluid- Or Gas Pressure-actuated Patents (Class 338/4)
  • Patent number: 11662264
    Abstract: A pressure measuring apparatus for measuring a jetting pressure of a liquid jetted from a nozzle includes a plate including: a first surface facing the nozzle; and a second surface opposite to the first surface; a pressure sensor configured to detect a discharge position and the discharge pressure at the discharge position of the liquid and generate a signal based on the discharge pressure; and electrical components including a controller configured to receive the signal and collect data regarding the discharge pressure. The pressure sensor is provided on the first surface of the plate and the electrical components are provided on the second surface of the plate.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Inho Won, Minseok Moon, Byoungkon Park, Sangho Lee, Jaewon Jeong
  • Patent number: 11609141
    Abstract: A material property sensor for a pressure transmitter comprises a sensing pattern immersed in a fill fluid. The pressure transmitter comprises a diaphragm configured for contact with a process fluid at an exterior surface of the diaphragm. The pressure transmitter further comprises a pressure sensor configured for sensing a pressure of the process fluid on the diaphragm. The pressure sensor and the diaphragm define a cavity within which the fill fluid is disposed such that the diaphragm of the pressure sensor is in contact with the fill fluid at an interior surface of the diaphragm. The sensing pattern is immersed in the fill fluid within the cavity and configured to measure an electrical property of the fill fluid at an initial time and at one or more subsequent times during operation of the pressure transmitter.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: March 21, 2023
    Assignee: SCHNEIDER ELECTRIC SYSTEMS USA, INC.
    Inventors: Timothy E. Dorr, Peter E. Allstrom
  • Patent number: 11340128
    Abstract: A sensor chip of a sensor element includes a diaphragm for measuring a differential pressure between a first pressure and a second pressure, a diaphragm for measuring an absolute pressure or a gauge pressure of the second pressure, a first pressure introduction path that transmits the first pressure to the diaphragm for measuring a differential pressure, and a second pressure introduction path that transmits the second pressure to the diaphragms. When the transmission of the first pressure or the second pressure to the diaphragms is indicated by an equivalent circuit, a path for transmitting the first pressure and a path for transmitting the second pressure are symmetrically formed.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: May 24, 2022
    Assignee: AZBIL CORPORATION
    Inventors: Tomohisa Tokuda, Masayuki Yoneda, Hirofumi Tojo, Ayumi Tsushima, Nozomi Kida
  • Patent number: 11262188
    Abstract: Sensing systems include a tube defining a Fabry-Perot cavity and an optical fiber including a distal end disposed within the Fabry-Perot cavity and a proximal end. A corrodible material caps the Fabry-Perot cavity. Devices for sensing corrosion of downhole equipment include an optical fiber with a corrodible material disposed over a distal end of the optical fiber. Systems for sensing a condition in equipment include an optical fiber with a fiber Bragg grating proximate a distal end thereof and a mass of sensor material coupled to the distal end of the optical fiber. The mass of sensor material is suspended from above the fiber Bragg grating. Other systems for sensing a condition in a wellbore include an optical fiber and a plurality of fiber Bragg gratings along a length thereof. A plurality of sensor materials are coupled to the optical fiber and surround respective fiber Bragg gratings.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: March 1, 2022
    Assignee: Baker Hughes Holdings LLC
    Inventors: Anusha Chilukuri, Othon R. Monteiro
  • Patent number: 11243130
    Abstract: A force sensor that is a MEMS sensor includes: a plurality of detectors arranged in a circle and each including an element disposed in part of a surface layer of a base component including a semiconductor; an elastic component including resin and disposed sandwiching the plurality of detectors from both sides; and a probe that is connected to an end of each of the plurality of detectors at a center portion of the circle in which the plurality of detectors are arranged, extends up to a position that protrudes from the elastic component, and to which force is applicable directly without passing the elastic component.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: February 8, 2022
    Assignee: NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY
    Inventor: Yoshitada Isono
  • Patent number: 11204293
    Abstract: Disclosed is a pressure transducer including a body made of a material having a first coefficient of thermal expansion, a fluidic inlet and a fluidic cavity enclosed by the body in fluidic communication with the fluidic inlet. The pressure transducer further includes a strain gauge including a resistive element in operable contact with the body. At least a portion of the resistive element made of a material having a second coefficient of thermal expansion that is different from the first coefficient of thermal expansion of the body. Disclosed further is a pressure transducer including a filler body located in a fluidic cavity of the pressure transducer configured to reduce adiabatic thermal effects on a transducer body. Disclosed are systems and methods incorporating the pressure transducers described herein.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: December 21, 2021
    Assignee: WATERS TECHNOLOGIES CORPORATION
    Inventors: Gary W. Bertone, Taylor J. Castagna, Robert J. Dumas
  • Patent number: 11162862
    Abstract: A pressure transducer is disclosed that includes an absolute pressure sensor assembly, a differential pressure sensor assembly, a main pressure port in communication with the absolute pressure sensor assembly and the differential pressure sensor assembly, a reference pressure port in communication with the differential pressure sensor assembly, and a compensation circuit in communication with the absolute pressure sensor assembly and the differential pressure sensor assembly. The compensation circuit is configured to reduce an error in an output of the differential pressure sensor assembly (due to absolute pressure) by at least a portion of an output received from the absolute pressure sensor assembly.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: November 2, 2021
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Wolf S. Landmann, Louis DeRosa
  • Patent number: 11135840
    Abstract: A fluid ejection system includes a fluid ejection die and a controller. The fluid ejection die includes a plurality of nozzles to eject fluid drops and a plurality of strain gauge sensors to sense strain within the fluid ejection die. The controller is to receive the sensed strain from each strain gauge sensor to determine a status of the fluid ejection die.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: October 5, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Gardner, Berkeley Fisher, Andrew Koll
  • Patent number: 11099088
    Abstract: A torque sensor assembly is used with a driveline component. The torque sensor assembly includes a holder, a sleeve, and at least one strain sensor. The holder includes a side wall that has a holder outer surface and a holder inner surface. The holder outer surface is corresponding to and attached to an aperture of the driveline component. The sleeve is corresponding to and attached to the holder inner surface. The strain sensor is attached to the sleeve and used to sense a strain in the driveline component.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: August 24, 2021
    Assignee: DEERE & COMPANY
    Inventors: Steven R. Whiteman, Jonathan D. Forster, Dean H. Lehrke, Stacy K. Worley
  • Patent number: 10983023
    Abstract: A pressure sensor assembly includes a tube, wherein a membrane to which the pressure to be measured is applied is arranged in the cross-section of the tube, where the membrane has a high flexural rigidity in a central region and is mounted resiliently in the edge region in the tube via two limbs, and includes a device for detecting the axial displacement which is easily accessible from the outside on the outer side of the tube and is advantageously not in contact with the process medium, and where the pressure sensor assembly has a particularly simple structural configuration, and can be used advantageously in measurement transducers for process instrumentation.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: April 20, 2021
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Ens, Gilbert Alexander Erdler, Stefan Klehr, Stefan von Dosky
  • Patent number: 10983017
    Abstract: An electrochemical sensor (100), comprising a substrate (105), two electrodes (130) and (140) screen printed onto said substrate, an elastomer (150) disposed over one of said plurality of screen printed electrodes, and one or more electroactive species disposed within said elastomer.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: April 20, 2021
    Assignee: ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
    Inventors: Jeffrey LaBelle, Austin Feldman, Mary Siuba, Ross Carlton, Jeffrey Andrade
  • Patent number: 10973419
    Abstract: An intravascular pressure sensor assembly is disclosed herein that is produced in part using photolithography and DRIE solid-state device production processes. Using DRIE production processes facilitates a number of features that could not be readily incorporated in sensor chips fabricated using mechanical saws. In accordance with a first feature, sensor chips are created with non-rectangular outlines. The sensor chip includes a widened portion that substantially abuts an inner wall of a sensor housing, and a cantilevered portion that is relatively narrow in relation to the widened portion. The non-rectangular outline of the sensor chip is formed using photolithography in combination with DRIE processing. In accordance with another feature, the sensor chip is positioned width-wise in the housing, thereby reducing a required length for the housing.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: April 13, 2021
    Assignee: PHILIPS IMAGE GUIDED THERAPY CORPORATION
    Inventor: Paul Douglas Corl
  • Patent number: 10942079
    Abstract: An apparatus includes a base assembly, a gasket and a housing assembly. The base assembly may have a locking feature and a bearing feature. The locking feature may have a first passage in communication with an exterior of the apparatus. The gasket may be disposed on the base assembly and may have (i) a base portion, (ii) a column portion and (iii) a second passage in communication with the first passage. The housing assembly may have a sealing feature and may be configured to hold a sensor. The sealing feature (a) may mate with the bearing feature and (b) may compress the base portion of the gasket. The sensor (a) may seal to the column portion of the gasket and (b) may be in communication with the exterior of the apparatus through the first passage and the second passage.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: March 9, 2021
    Assignee: VEONEER US INC.
    Inventors: Jacob Pusheck, Joshua Forwerck
  • Patent number: 10928264
    Abstract: A sensor assembly comprises a housing, a pressure interface, a piezoelectric sensor, a mechanical interface, and an electrical interface. The pressure interface is disposed on the housing and communicates with a pressure transmission tube. The piezoelectric sensor is disposed in the housing and senses a pressure input at the pressure interface. The mechanical interface is disposed at a first side of the housing and detachably engages a mounting mechanism. The electrical interface is disposed at a second side of the housing opposite to the first side.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: February 23, 2021
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Lei Pan, Pai Rajendra, Tongbao Ding, Weiguo Li
  • Patent number: 10908044
    Abstract: A pressure sensor comprising two parts connected with one another via an active braze joint manufactured by active hard soldering, or brazing, with an active hard solder, or braze, especially a pressure contactable, pressure-dependently elastically deformable, measuring membrane, especially a ceramic measuring membrane, and a platform, especially a ceramic platform, which are connected by an active braze joint connecting an outer edge of the measuring membrane (which covers a pressure chamber with an outer edge of an end of the platform facing the measuring membrane, whose measuring characteristics are improved in that the active braze joint has a coefficient of thermal expansion dependent on the dimensions of the active braze joint and on the materials of the parts and matched to a coefficient of thermal expansion of at least one of the parts, especially the measuring membrane.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: February 2, 2021
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventors: Andreas Rossberg, Elke Schmidt, Markus Rettenmayr, Peter Siegmund, Uta Kuhn, Simon Pauly, Nils Ponath
  • Patent number: 10890502
    Abstract: A pressure sensor device including: an absolute pressure sensor unit; a sensor case to accommodate the absolute pressure sensor unit; and an adhesive provided between the absolute pressure sensor unit and the sensor case to fix the absolute pressure sensor unit and the sensor case together, is provided. The sensor case has protrusions on the bottom surface, the absolute pressure sensor unit is provided above the protrusions, and there is space free of the adhesive at a part of a region between the absolute pressure sensor unit and the sensor case, and under the absolute pressure sensor unit.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: January 12, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Shuntaro Miyake, Shojiro Kurimata
  • Patent number: 10724418
    Abstract: A method of determining a flow resistance across a particulate filter located downstream of an internal combustion engine in an exhaust system. The method comprises measuring a first differential pressure across the particulate filter, measuring a second differential pressure downstream of the particulate filter, determining a pressure ratio of the first differential pressure and the second differential pressure, and from said pressure ratio, determining a flow resistance across the particulate filter. The second differential pressure is measured across a selective catalytic reduction system.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: July 28, 2020
    Assignee: Scania CV AB
    Inventors: Niklas Karpe, Krister Pettersson, Robert Svensson
  • Patent number: 10718678
    Abstract: An aircraft engine pressure transducer includes a first pressure transducer channel and a second pressure transducer channel. The first pressure transducer channel is configured to sense a pressure of the aircraft engine over a first pressure range and a first temperature range. The second pressure transducer channel is configured to sense the pressure of the aircraft engine over a second pressure range and a second temperature range, the second pressure range being a subset of the first temperature range, and the second temperature range being a subset of the first temperature range.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: July 21, 2020
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Bruce D. Paradise
  • Patent number: 10697844
    Abstract: The present disclosure includes a pressure transducer comprising: a frame; a cantilevered beam; a resilient beam portion; a signal processing circuit; a wiring terminal; and a support member. The resilient beam portion anchors the cantilevered beam to the frame. The cantilevered beam moves in response to a pressure-induced force applied to the cantilevered beam and the resilient beam portion bends producing a strain within the resilient beam portion. The support member comprises a cavity and the signal processing circuit is entirely installed inside the cavity. There is a strain gauge diffused into, implanted into, and/or affixed to the resilient beam portion. The cavity of the support member includes a first aperture disposed along the first surface of the support member and the inner surface of the frame covers the first aperture.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: June 30, 2020
    Assignee: HUBA CONTROL AG
    Inventor: Juerg Hess
  • Patent number: 10690632
    Abstract: An ultrasound probe for inspecting a bore opening onto a peripheral surface includes an offcentring device which includes at least two strips which are elastically deformable, connected to the ultrasound probe and configured to keep the emission head of the ultrasound probe pressed firmly against the wall of the bore that is to be inspected.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 23, 2020
    Assignees: Airbus Operations S.A.S., AIRBUS SAS
    Inventors: Alain Tissenier, Aurelien Rautureau
  • Patent number: 10679944
    Abstract: A semiconductor structure with a high resistivity wafer includes a device wafer. The device wafer includes a front side and a back side. A semiconductor element is disposed on the front side. An interlayer dielectric covers the front side. A high resistivity wafer consists of an insulating material. A dielectric layer encapsulates the high resistivity wafer. The dielectric layer contacts the interlayer dielectric.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: June 9, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Purakh Raj Verma, Kuo-Yuh Yang, Chia-Huei Lin
  • Patent number: 10663366
    Abstract: A semiconductor pressure sensor includes: a first semiconductor substrate having a plurality of recesses formed thereon; an intermediate semiconductor substrate joined to the first semiconductor substrate with a first oxide film interposed therebetween; a second semiconductor substrate joined to the intermediate semiconductor substrate with a second oxide film interposed therebetween; a first reference pressure chamber formed as a space surrounded by a first recess of the first semiconductor substrate and the intermediate semiconductor substrate; a second reference pressure chamber formed as a space surrounded by a second recess formed on the first semiconductor substrate, the intermediate semiconductor substrate, and the second semiconductor substrate, the intermediate semiconductor substrate having a through hole communicating with the second recess of the first semiconductor substrate; and piezoresistors formed on a surface of the second semiconductor substrate that receives pressure, along outer peripheri
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: May 26, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventor: Eiji Yoshikawa
  • Patent number: 10627946
    Abstract: Disclosed are a display panel and a display device. The display panel comprises a first substrate comprising a display region and a non-display region; a second substrate opposite to the first substrate; and a pressure sensor located on one side of the first substrate adjacent to the second substrate and located within the non-display region. The first and second substrates are adhered via a sealant, an orthogonal projection of the sealant on the first substrate is located within the non-display region of the first substrate, a distance from a midline of the sealant to a common boundary between the display region and the non-display region is larger than a distance from a geometric center of the pressure sensor to the common boundary between the display region and the non-display region. The midline of the sealant is a perpendicular bisector of a common perpendicular of the two edges of the sealant.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: April 21, 2020
    Assignee: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Huafeng Bian, Yan Shen, Xuan Lu, Feng Lu, Liang Liu, Qijun Yao
  • Patent number: 10620071
    Abstract: The invention relates to a pressure sensor (1) comprising a pressure sensing arrangement (8) and a housing. The housing comprises an intermediate member (2) and a bottom part (3), wherein the intermediate member (2) comprises an aperture (4). The aperture (4) extends through the intermediate member (2), wherein the aperture (4) is on a first end (5) covered by a diaphragm (6) connected to the intermediate member (2). A second end (7) of the aperture (4) is covered by the bottom part (3) comprising the pressure sensing arrangement (8). Task of the invention is to provide a pressure sensor which allows a simplified and cost effective assembly and mounting. The task is solved in that the intermediate member (2) comprises a gripping surface (16) on an outer surface of the housing.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: April 14, 2020
    Assignee: DANFOSS A/S
    Inventors: Hans-Henning Hansen, Ingvar Smari Kampp, Lars Nørgaard, Veenith Shetty, Klaus Tonnesen
  • Patent number: 10514314
    Abstract: In a sensor unit, a lower end surface of a terminal block (24) is attached to an upper end surface (12ES1) of a housing (12) by using a silicone-based adhesive in such a way as to cover an upper end surface (14ES1) of a hermetic glass (14). A covering layer (10A) made of a silicone-based adhesive is formed in a given thickness on the entire upper end surface (14ES1) of the hermetic glass (14), from which a group of input-output terminals (40ai) protrude.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: December 24, 2019
    Assignee: SAGINOMIYA SEISAKUSHO, INC.
    Inventors: Kazuya Takimoto, Kazunori Hirai, Hideaki Koga
  • Patent number: 10514312
    Abstract: A hydraulic pressure sensor for a vehicle comprises a sensor housing which comprises a fluid chamber, a sensor element for detecting the pressure of a fluid in the fluid chamber, and an electronic signal processing component which is electrically connected to the sensor element, for processing an electric signal characterizing the fluid pressure. Electrically conductive contacts for forwarding the electric signals processed by the electronic signal processing components are formed on an external main surface of the sensor housing.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: December 24, 2019
    Assignee: Lucas Automotive GmbH
    Inventors: Sven Michels, Thomas Baron, Karlheinz Schaust
  • Patent number: 10473546
    Abstract: A hermetic pressure sensor for measuring a fluid pressure includes a hermetic housing, formed of a first housing structure with a membrane section, a second housing structure hermetically connected to the first structure, and one or more strain sensing elements attached to the membrane section. The second housing structure includes openings for one or more electrical pins while a non-conductive hermetic seal holds the electrical pins in place. The pressure sensor measures the pressure of fluid entering the housing while also providing a hermetic seal.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: November 12, 2019
    Assignee: Sensata Technologies, Inc.
    Inventors: Frank Hendri Jacobs, Wico Hopman, Jochem Hendrik Talsma, Jochem Christiaan Nijs, Erik Hop
  • Patent number: 10477323
    Abstract: According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: November 12, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshihiro Higashi, Yoshihiko Fuji, Michiko Hara, Akiko Yuzawa, Shiori Kaji, Tomohiko Nagata, Akio Hori, Hideaki Fukuzawa
  • Patent number: 10466047
    Abstract: An electronic device having a pressure sensor configured to determine pressure is disclosed. The electronic device includes an enclosure defining an internal volume. The enclosure may include a sidewall with an external opening that provides a vent for the internal components. To reduce the response of the pressure sensor (that is, the time required to detect a pressure change), the pressure sensor may secure with an internal wall of the enclosure. Further, the internal wall includes an opening defining an air pocket significantly smaller than the internal volume. When the pressure sensor is mounted to receive air via the air pocket, the pressure sensor may respond faster to pressure changes, as compared to receiving air circulating throughout the internal volume. This is due in part to an amount of airflow passing through the air pocket causing a greater pressure change throughout the air pocket as compared to the internal volume.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: November 5, 2019
    Assignee: Apple Inc.
    Inventors: Rex T. Ehman, William C. Lukens, David M. Pelletier, Henry H. Yang
  • Patent number: 10436660
    Abstract: A pressure transducer for determining a pressure variable, comprising at least a pressure sensor with a measuring membrane and resistance elements integrated in the measuring membrane. The pressure sensor is arranged between a first and a second counter body, such that a pressure chamber forms between the measuring membrane and the first counter body, which pressure chamber can be subjected to a first pressure; wherein the side of the measuring membrane facing towards the second counter body can be subjected to a second pressure, and a displacement of the measuring membrane dependent upon the first and second pressures set.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: October 8, 2019
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventor: Anh Tuan Tham
  • Patent number: 10408692
    Abstract: Provided are a mechanical quantity measurement device having a higher signal-to-noise ratio and resolution than the prior art and a pressure sensor using the same. A mechanical quantity measurement device that is provided with a plurality of Wheatstone bridges on the main surface of a single semiconductor substrate that are composed from impurity-diffused resistors and detect the difference between the strain amount occurring in the x-axis direction and the strain amount occurring in the y-axis direction, which intersect at right angles on the main surface of the semiconductor substrate, said mechanical quantity measurement device being characterized in that the impurity-diffused resistors composing the plurality of Wheatstone bridges are disposed evenly in an area to be measured.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: September 10, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventor: Kentarou Miyajima
  • Patent number: 10371591
    Abstract: A differential pressure sensor includes one or more semiconductor dies which are thinned at portions of the die to create a chamber defining a sensitive diaphragm, having piezoresistive elements defined at a surface of the diaphragm. A first diaphragm is in fluid communication with a first fluid on an upper surface of the first diaphragm and is in fluid communication with a second fluid on a lower surface of the first diaphragm. A second diaphragm is in fluid communication with ambient pressure at an upper and a lower surface of the second diaphragm. The piezoresistive elements corresponding to the second diaphragm are electrically connected to the piezoresistive elements of the first diaphragm so as to compensate the output of the second diaphragm with respect to the output of the first diaphragm.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: August 6, 2019
    Assignee: Measurement Specialties, Inc.
    Inventors: David E. Wagner, Natasha V. Kachenko, James H. Hoffman
  • Patent number: 10362947
    Abstract: A pressure sensing catheter having a pressure sensor and an antenna that is coupled to the pressure sensor, e.g., by a connector, are provided. The pressure sensor can be adapted to measure a pressure surrounding the catheter, and the antenna can be adapted to telemetrically communicate the measured pressure to an external device. In an exemplary embodiment, the antenna, pressure sensor, and/or connector are hermetically sealed, e.g., by the catheter and/or a coating, to prevent the antenna, pressure sensor, and connector from coming into contact with fluid, thereby allowing the catheter to be permanently implanted or otherwise used for long term use. Exemplary methods for manufacturing and using pressure sensing catheters are also provided.
    Type: Grant
    Filed: April 11, 2005
    Date of Patent: July 30, 2019
    Assignee: INTEGRA LIFESCIENCES SWITZERLAND SARL
    Inventors: Christophe Mauge, Alan J. Dextradeur, Daniel J. McCusker, Stefan Meyer, Volker Bodecker, Max G. Ostermeier
  • Patent number: 10359330
    Abstract: A pressure sensor includes a diaphragm having a first principal surface and a second principal surface, a semiconductor chip in which resistors constituting a strain gauge are formed, a first structural body having one end coupled to a center of a second principal surface of the diaphragm and the other end coupled to the other surface of the semiconductor chip, and at least two second structural bodies disposed in two straight lines, orthogonal to each other, that pass through the center of the diaphragm in plan view so as to be disposed separately from the first structural body, and having one ends coupled to the second principal surface and the other ends coupled to the other surface of the semiconductor chip, in which the resistors are formed in regions between the first structural body and the second structural bodies in plan view in the semiconductor chip.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: July 23, 2019
    Assignee: Azbil Corporation
    Inventors: Yuki Seto, Yoshiyuki Ishikura, Rina Ogasawara
  • Patent number: 10349839
    Abstract: An implantable pressure sensor device (100) has a housing (10) which is at least partially made of a pressure transmitting membrane (20), and which includes one or more regions which can reversibly deform while maintaining the surface area of the membrane (20) when the internal volume of the housing (10) is changed. The housing (10) has a non-circular cross-section which can deform to a more circular shape when pressure in the internal volume increases. An inner housing is preferably situated within the housing, with its exterior spaced from the interior of the housing, and has its inner volume in fluid communication with the space between the housing and inner housing.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: July 16, 2019
    Assignee: BIOTRONIK SE & CO.
    Inventors: Jens Philipp, Joachim Elsner, Sarah Biela, Alois Pfenniger, Andreas Bitzer, Henning Ebert, Olaf Skerl, Andre van Ooyen
  • Patent number: 10337938
    Abstract: A dual range sensor apparatus includes a single pressure transducer element coupled to respective inputs of two discrete signal conditioning modules, or to both inputs of a multiple input signal conditioning module that is configured to condition the output signal of two transducer elements. The disclosed sensor apparatus outputs a pressure signal in a limited pressure range with very high accuracy, and also provides a pressure signal in a wider pressure range with the same accuracy that can be achieved with traditional pressure sensor configurations. The sensor apparatus may provide output on a single output node in a multiplexed output signal format. The multiplexed output signal format may include several digital output formats and may be provided on a single output pin of the sensor apparatus.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: July 2, 2019
    Assignee: Sensata Technologies, Inc.
    Inventors: Erik Krommenhoek, Arnout van den Bos
  • Patent number: 10288516
    Abstract: A pressure detection device including a mount whereon a pressure sensor is attached which comprises a membrane which has a surface intended to be subjected to a pressurized fluid and which is so arranged as to elastically deform according to pressure, and means for determining the deformation of the membrane along an axis normal to a mid-plane of the membrane in the rest state. The membrane is supported by a frame connected to the mount by a mechanical decoupling structure in order to isolate the membrane from stress resulting from a differential thermal expansion between the frame and the mount, with the membrane and the frame being made of the same material.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: May 14, 2019
    Assignee: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Jean-Christophe Riou, Eric Bailly
  • Patent number: 10267699
    Abstract: A pressure sensor element includes a die; a cavity and a trench formed in one surface of the die and defining therebetween a partition wall integral with and formed of the same material as the die; and a membrane formed on the die and covering the cavity and the trench.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: April 23, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Hyun Lim, Dae Hun Jeong, Tae Hun Lee
  • Patent number: 10248241
    Abstract: A digital signage system includes a transducer configured to transform a pressure to an electrical signal; a control apparatus configured to change information in association with the intensity of the electrical signal; and an output apparatus configured to output the information to an output target based on a command of the control apparatus.
    Type: Grant
    Filed: April 13, 2016
    Date of Patent: April 2, 2019
    Assignee: Ricoh Company, Ltd.
    Inventors: Tsuneaki Kondoh, Tomoaki Sugawara, Yuko Arizumi, Junichiro Natori, Mizuki Otagiri, Takahiro Imai
  • Patent number: 10215617
    Abstract: An analog sensor with digital compensation function includes a deformation part generating a deformation relating to a pressure sensed by the analog sensor; a strain gauge connected to the deformation part and generating a change in resistance relating to the deformation; a strain gauge bridge connected to the strain gauge and transferring the change in the resistance of the at least one strain gauge to output a first analog signal; and an analog-to-digital conversion module converting the first analog signal to a first digital signal, representative of weight. A signal processing and output circuit compensates the first digital signal and converts it into a second analog signal.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: February 26, 2019
    Assignees: METTER TOLEDO (CHANGZHOU) PRECISION INSTRUMENT LTD., METTER TOLEDO (CHANGZHOU) MEASUREMENT TECHNOLOGY LTD., METTER TOLEDO (CHANGZHOU) SCALE & SYSTEM LTD.
    Inventors: Feng Dai, Daniel Reber, Jean-Christophe Emery
  • Patent number: 10160636
    Abstract: A ceramic substrate is mainly constituted of ceramic, and has a first main surface and a second main surface located opposite to the first main surface. A recessed portion recessed toward a first main surface side is formed in the second main surface. A wire portion extending from an outer peripheral surface of the ceramic substrate to inside of the recessed portion is formed, and a bottom portion located on the first main surface side in the recessed portion has a portion thinner than another portion of the ceramic substrate other than the bottom portion.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: December 25, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Nobuaki Konno, Yoshiaki Hirata
  • Patent number: 10156489
    Abstract: A piezoresistive pressure sensor includes a substrate and a silicon device layer. The substrate has a cavity. The silicon device layer includes a diaphragm and a support element. A top surface of the diaphragm is connected to a top surface of the support element by one or more side surfaces. A recess of the silicon device layer is defined by the top surface of the diaphragm and the one or more side surfaces. A plurality of piezoresistive regions are on the top surface of the diaphragm, on the one or more side surfaces and on the top surface of the support element. A plurality of conductive regions are on the top surface of the support element. The plurality of conductive regions do not extend to the top surface of the diaphragm. The plurality of piezoresistive regions have a first ion dosage concentration. The plurality of conductive regions have a second ion dosage concentration. The second ion dosage concentration is greater than the first ion dosage concentration.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: December 18, 2018
    Assignee: ASIA PACIFIC MICROSYSTEMS, INC.
    Inventors: Hung-Lin Yin, Cheng-Yi Chiang, Yu-Che Huang
  • Patent number: 10151657
    Abstract: A diaphragm pressure gauge, in which a measuring spring is monitored in regard to integrity in that on the side, facing away from the process pressure, of the measuring spring a vacuum chamber is formed to which vacuum is applied and which is controlled by means of a vacuum monitoring device to maintain the vacuum.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: December 11, 2018
    Assignee: WIKA Alexander Wiegand SE & Co. KG
    Inventors: Reimund Kaufmann, Andreas Massong, Karsten Mottl
  • Patent number: 10113243
    Abstract: A manufacturing method of a casing of an electronic device including the following steps is provided. First, a casing body is formed by an injection molding technology, and the casing body includes a button portion. Thereafter, a sensing assembly is electroplated on an inner surface of the casing body. The sensing assembly includes a first conductive line and two first contacts. The first conductive line forms a strain sensing pattern on the button portion, and the two first contacts connect to two ends of the first conductive line, respectively.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: October 30, 2018
    Assignee: HTC Corporation
    Inventors: Cheng-Han Chung, Chao-Feng Wan
  • Patent number: 10088380
    Abstract: A multi-channel pressure measuring device includes a plurality of sample conduits and a plurality of sample inlets. Each sample inlet is configured to receive a respective sample conduit. The sample conduit is configured to channel a sample fluid and an incidental fluid through a respective sample inlet. The multi-channel pressure measuring device also includes a sample block including a plurality of collection wells coupled to the sample inlets. Each collection well includes a diameter larger than a diameter of a respective sample inlet. The sample block is fabricated from at least one of a transparent material and a translucent material. The multi-channel pressure measuring device further includes a plurality of filter indicator elements. Each filter indicator element is positioned within a respective collection well. Each filter indicator element is configured to retain the incidental fluid therewithin and to indicate a presence of the retained incidental fluid.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: October 2, 2018
    Assignee: General Electric Company
    Inventors: Jeffrey Dale Richey, Joshua Daniel Brown
  • Patent number: 10018650
    Abstract: A rocker device for a micromechanical Z sensor includes: two trough-shaped rocker arms mountable around a torsion pivot, the rocker device being configured asymmetrically with respect to the torsion pivot; and for each rocker arm, a strike region having at least one first strike element is provided, the strike region on each rocker arm being configured in definedly elevated fashion relative to a sensing region of the rocker device.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: July 10, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Andreas Scheurle, Guenther-Nino-Carlo Ullrich, Markus Heitz, Andrea Orto
  • Patent number: 10001396
    Abstract: A pressure-sensor apparatus for an air-mass measuring apparatus for a vehicle. The pressure-sensor apparatus has a circuit carrier, a first pressure sensor which is disposed on the circuit carrier and is designed to sense a pressure and to provide a first pressure signal representing the pressure, a second pressure sensor which is disposed on the circuit carrier and is designed to sense the pressure and to provide a second pressure signal representing the pressure, and an evaluator which is disposed on the circuit carrier and has a first input interface to receive the first pressure signal, a second input interface to receive the second pressure signal and an output interface to output an output signal provided using the first pressure signal and the second pressure signal.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: June 19, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Norbert Schneider, Michael Horstbrink, Michael Rittmann
  • Patent number: 9976922
    Abstract: The disclosure relates to a pressure sensor for measuring a fluid pressure, in particular a vacuum pressure. The pressure sensor contains a first and a second diaphragm connected to one another such that they enclose and hermetically seal a fluid space. Fluid can enter and exit the fluid space through a fluid supply element, which is connected to an exterior opening of the sensor. Each of the diaphragms is proximal to a reference electrode and forms a variable capacitor, the capacitance of which depends on the position of the diaphragms, which in turn depends on the pressure in the fluid space.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: May 22, 2018
    Assignee: Plöchinger Patent
    Inventor: Heinz Plöchinger
  • Patent number: 9945748
    Abstract: A pressure sensor includes a sensor member including a sensor face to which pressure is imparted and a cover member that covers at least part of the peripheral face of the sensor member while exposing the sensor face out of one end side. With such a configuration, the sensor member can be protected from a lateral force (side pressure), whereby the sensor member can be prevented from being broken by the application of the side pressure to the sensor member.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: April 17, 2018
    Assignee: MINEBEA MITSUMI INC.
    Inventors: Kiyoshi Omori, Hiroyuki Omae, Akira Muto, Tomoaki Watanuki
  • Patent number: 9939340
    Abstract: This pressure and temperature determining device includes a membrane, which has a face of contact with the fluid and a securing face opposite to the contact face, a pressure determining element secured to the membrane, and a temperature determining element secured to the membrane. The pressure determining element includes at least one piezoresistive track. The temperature determining element includes at least one thermoresistive track.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: April 10, 2018
    Assignee: MGI COUTIER
    Inventors: Marc Novellani, Chokri Ben Hammouda