Intel Patents

Intel Corporation designs and manufactures microprocessors and chipsets for computing and communications equipment manufacturers. Its products may be found in desktops, servers, tablets, smartphones and other devices.

Intel Patents by Type
  • Intel Patents Granted: Intel patents that have been granted by the United States Patent and Trademark Office (USPTO).
  • Intel Patent Applications: Intel patent applications that are pending before the United States Patent and Trademark Office (USPTO).
  • Patent number: 11973923
    Abstract: An example apparatus includes: a camera to record an image; memory to store instructions; and a processor in circuit with the memory, the processor to execute the instructions to: determine a depth based on: (a) the image and (b) a calibration parameter of the camera; and adjust the calibration parameter based on a temperature of the camera and the depth.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Aviad Zabatani, Sagy Bareket, Ohad Menashe, Erez Sperling, Alex Bronstein, Michael Bronstein, Ron Kimmel, Vitaly Surazhsky
  • Patent number: 11974227
    Abstract: This disclosure describes systems, methods, and devices related to wake up receiver (WUR) frequency division multiple access (FDMA) transmission. A device may cause to send a wake up receiver (WUR) beacon frame on a WUR beacon operating channel to one or more station devices. The device may determine a first wake-up frame to be sent on a first WUR operating channel, wherein the first WUR operating channel is associated with one or more frequency division multiple access (FDMA) channels used for transmitting one or more wake-up frames to the one or more station devices. The device may determine to apply padding to the first wake-up frame based on a field included in a header of the first wake-up frame. The device may cause to send the first wake-up frame to a first station device of the one or more station devices.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Shahrnaz Azizi, Daniel F. Bravo, Thomas J. Kenney, Vinod Kristem, Noam Ginsburg
  • Patent number: 11973519
    Abstract: Examples described herein relate to an apparatus comprising a central processing unit (CPU) and an encoding accelerator coupled to the CPU, the encoding accelerator comprising an entropy encoder to determine normalized probability of occurrence of a symbol in a set of characters using a normalized probability approximation circuitry, wherein the normalized probability approximation circuitry is to output the normalized probability of occurrence of a symbol in a set of characters for lossless compression. In some examples, the normalized probability approximation circuitry includes a shifter, adder, subtractor, or a comparator. In some examples, the normalized probability approximation circuitry is to determine normalized probability by performance of non-power of 2 division without computation by a Floating Point Unit (FPU). In some examples, the normalized probability approximation circuitry is to round the normalized probability to a decimal.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Bhushan G. Parikh, Stephen T. Palermo
  • Patent number: 11973504
    Abstract: An asynchronous multi-cycle reset synchronization circuit that can correlate any number of resets and synchronous clocks with simultaneous reset de-assertion and removal of reset assertion crossing hazards. The asynchronous multi-cycle reset synchronization circuit can also be paired with a synchronous multi-cycle reset synchronization circuit to correlate same domain asynchronous and synchronous resets. Also described is a synchronous reset multi-cycle synchronization circuit that correlates with any number of asynchronous resets and guarantees simultaneous reset de-assertion.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Leon Zlotnik, Lev Zlotnik, Jeremy Anderson
  • Patent number: 11972291
    Abstract: An apparatus and method for conditional quality of service in a processor. For example, one embodiment of a processor comprises: a plurality of processor resources to be allocated to a plurality of executed processes in accordance with a set of quality of service (QoS) rules; and conditional quality of service (QoS) circuitry/logic to monitor usage of the plurality of processor resources by the plurality of processes and to responsively modify an allocation of a first processor resource for a first process in response to detecting a first threshold value being reached in a second resource allocated to the first process.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Francesc Guim, Karthik Kumar, Mustafa Hajeer, Tushar Gohad
  • Patent number: 11973539
    Abstract: Disclosed herein are optical transceivers with multi-laser modules, as well as related optoelectronic assemblies and methods. In some embodiments, an optical transceiver may include: a first laser and a second laser; an optical output path, wherein an output of the first laser is coupled to the optical output path; and switching circuitry to decouple the output of the first laser from the optical output path and to couple an output of the second laser to the optical output path.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Saeed Fathololoumi, Ling Liao, Quan Tran
  • Patent number: 11973679
    Abstract: This disclosure describes systems, methods, and devices related to enhanced frame exchange. A device may generate a first subset of a plurality of fields, wherein the first subset is mandatory in a probe request frame. The device may generate a second subset of the plurality of fields, wherein the second subset is optional in the probe request frame regardless of capability information of the device. The device may generate the probe request frame comprising the first subset and the second subset. The device may cause to send the probe request frame to an access point (AP) device.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Robert Stacey, Daniel Bravo, Ido Ouzieli, Danny Alexander, Ofer Hareuveni
  • Patent number: 11973624
    Abstract: Examples described herein relate to link training between network connected devices. In some examples, an amount to extend link training is determined. The amount to extend link training can be determined by: receiving, by a receiver in a first device, signals over a lane from a transmitter in a second device, the signals indicating capability to extend link training time and amount to extend link training time; determining, at the first device, a link training time based on a default link training time and an amount to extend link training time; and performing link training based on the determined link training time. In some examples, the determined amount is highest common denominator of the received identified capability and transmitted indicated capability. In some examples, if the received communication indicates no ability to extend link training time, the link training time is a default link training time.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventor: Bruce McLoughlin
  • Patent number: 11973689
    Abstract: A processor may control a transmitter to send a first signal representing a request for one or more priority rules for data packet prioritization; to receive a second signal in response to the first signal, the second signal representing the one or more priority rules for data packet prioritization, and to receive a third signal representing a data packet including a header and a data payload. The header may comprise a first priority tag representing a first priority level. The processor may be configured to determine from the data payload and the one or more rules for data packet prioritization a second priority tag representing a second priority level and to replace the first priority tag with the second priority tag.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Ehud Reshef, Carlos Cordeiro
  • Patent number: 11972126
    Abstract: Technologies disclosed herein provide one example of a system that includes processor circuitry to be communicatively coupled to a memory circuitry. The processor circuitry is to receive a memory access request corresponding to an application for access to an address range in a memory allocation of the memory circuitry and to locate a metadata region within the memory allocation. The processor circuitry is also to, in response to a determination that the address range includes at least a portion of the metadata region, obtain first metadata stored in the metadata region, use the first metadata to determine an alternate memory address in a relocation region, and read, at the alternate memory address, displaced data from the portion of the metadata region included in the address range of the memory allocation. The address range includes one or more bytes of an expected allocation region of the memory allocation.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: David M. Durham, Michael D. LeMay, Sergej Deutsch, Joydeep Rakshit, Anant Vithal Nori, Jayesh Gaur, Sreenivas Subramoney
  • Patent number: 11973143
    Abstract: Integrated circuit structures having source or drain structures and germanium N-channels are described. In an example, an integrated circuit structure includes a fin having a lower fin portion and an upper fin portion, the upper fin portion including germanium. A gate stack is over the upper fin portion of the fin. A first source or drain structure includes an epitaxial structure embedded in the fin at a first side of the gate stack. A second source or drain structure includes an epitaxial structure embedded in the fin at a second side of the gate stack. Each epitaxial structure includes a first semiconductor layer in contact with the upper fin portion, and a second semiconductor layer on the first semiconductor layer. The first semiconductor layer comprises silicon, germanium and phosphorous, and the second semiconductor layer comprises silicon and phosphorous.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Ryan Keech, Benjamin Chu-Kung, Subrina Rafique, Devin Merrill, Ashish Agrawal, Harold Kennel, Yang Cao, Dipanjan Basu, Jessica Torres, Anand Murthy
  • Patent number: 11971754
    Abstract: Embodiments are generally directed to a flexible overlapping display. An embodiment of a mobile device includes a processor to process data for the mobile device, a bendable and foldable display screen, one or more device sensors to sense an orientation of the mobile device, and one or more display sensors to sense a current arrangement of the display screen. The processor is to identify one or more portions of the display screen that are visible to a user based at least in part on data from the one or more device sensors and the one or more display sensors.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Guy M. Therien, David W. Browning, Joshua L. Zuniga
  • Patent number: 11972635
    Abstract: In one example, a display includes an array of display pixels. Each display pixel includes at least one light-emitting diode. At least one of the display pixels includes an image sensor.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Akihiro Takagi, Kunjal Parikh
  • Patent number: 11972303
    Abstract: Methods, apparatus, and systems to dynamically schedule a workload to among compute blocks based on temperature are disclosed. An apparatus to schedule a workload to at least one of a plurality of compute blocks based on temperature includes a prediction engine to determine (i) a first predicted temperature of a first compute block of the plurality of compute blocks and (ii) a second predicted temperature of a second compute block of the plurality of compute blocks. The apparatus also includes a selector to select between the first compute block and the second compute block for assignment of the workload. The selection is based on which of the first and second predicted temperatures is lower. The apparatus further includes a workload scheduler to assign the workload to the selected one of the first or second compute blocks.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Carin Ruiz, Bo Qiu, Columbia Mishra, Arijit Chattopadhyay, Chee Lim Nge, Srikanth Potluri, Jianfang Zhu, Deepak Samuel Kirubakaran, Akhilesh Rallabandi, Mark Gallina, Renji Thomas, James Hermerding, II
  • Patent number: 11972001
    Abstract: Technologies for securely providing one or more remote accelerators hosted on edge resources to a client compute device includes a device that further includes an accelerator and one or more processors. The one or more processors are to determine whether to enable acceleration of an encrypted workload, receive, via an edge network, encrypted data from a client compute device, and transfer the encrypted data to the accelerator without exposing content of the encrypted data to the one or more processors. The accelerator is to receive, in response to a determination to enable the acceleration of the encrypted workload, an accelerator key from a secure server via a secured channel, and process, in response to a transfer of the encrypted data from the one or more processors, the encrypted data using the accelerator key.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Ned M. Smith, Brinda Ganesh, Francesc Guim Bernat, Eoin Walsh, Evan Custodio
  • Patent number: 11972269
    Abstract: Methods, apparatus, systems and articles of manufacture (e.g., physical storage media) to provide device enhancements for software defined silicon implementations are disclosed. Example non-transitory computer readable medium includes instructions to cause one or more processors to at least generate a first stock keeping unit, associate the first stock keeping unit with a semiconductor device, the first stock keeping unit associated with a first set of features to be provided by the semiconductor device, command the semiconductor device to activate a feature not included in the first set of features to cause the semiconductor device to provide a second set of features, generate a second stock keeping unit for the semiconductor device, and associate the second stock keeping unit with the semiconductor device and the second set of features to be provided by the semiconductor device.
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Katalin Klara Bartfai-Walcott, Arkadiusz Berent, Vasuki Chilukuri, Mark Baldwin, Vasudevan Srinivasan, Bartosz Gotowalski
  • Patent number: 11972165
    Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for configuring display screen coordinates. An example apparatus includes at least one storage device or storage disk, instructions, and at least one processor to execute the instructions. When executed, the example instructions cause the at least one processor to determine whether a first position of a first display screen is within a threshold of a second position of a second display screen, and in response to determining that the first position is within the threshold of the second position, adjust a first coordinate of the first display screen relative to a second coordinate of the second display screen, the first coordinate and the second coordinate to be adjusted within a graphics properties page related to configuration of content rendering between the first display screen and the second display screen.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventor: Sean J. Lawrence
  • Patent number: 11972519
    Abstract: Described herein are techniques for learning neural reflectance shaders from images. A set of one or more machine learning models can be trained to optimize an illumination latent code and a set of reflectance latent codes for an object within a set of input images. A shader can then be generated based on a machine learning model of the one or more machine learning models. The shader is configured to sample the illumination latent code and the set of reflectance latent codes for the object. A 3D representation of the object can be rendered using the generated shader.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Benjamin Ummenhofer, Shenlong Wang, Sanskar Agrawal, Yixing Lao, Kai Zhang, Stephan Richter, Vladlen Koltun
  • Patent number: 11973032
    Abstract: Memory bit cells having internal node jumpers are described. In an example, an integrated circuit structure includes a memory bit cell on a substrate. The memory bit cell includes first and second gate lines parallel along a second direction of the substrate. The first and second gate lines have a first pitch along a first direction of the substrate, the first direction perpendicular to the second direction. First, second and third interconnect lines are over the first and second gate lines. The first, second and third interconnect lines are parallel along the second direction of the substrate. The first, second and third interconnect lines have a second pitch along the first direction, where the second pitch is less than the first pitch. One of the first, second and third interconnect lines is an internal node jumper for the memory bit cell.
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Smita Shridharan, Zheng Guo, Eric A. Karl, George Shchupak, Tali Kosinovsky
  • Patent number: 11972545
    Abstract: The present disclosure provides an apparatus and method of guided neural network model for image processing. An apparatus may comprise a guidance map generator, a synthesis network and an accelerator. The guidance map generator may receive a first image as a content image and a second image as a style image, and generate a first plurality of guidance maps and a second plurality of guidance maps, respectively from the first image and the second image. The synthesis network may synthesize the first plurality of guidance maps and the second plurality of guidance maps to determine guidance information. The accelerator may generate an output image by applying the style of the second image to the first image based on the guidance information.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Anbang Yao, Ming Lu, Yikai Wang, Shandong Wang, Yurong Chen, Sungye Kim, Attila Tamas Afra
  • Patent number: 11973641
    Abstract: Techniques discussed herein can facilitate edge computing in connection with a variety of deployment scenarios. Various embodiments can facilitate one or more of: deploying UPF(s) (User Plane Function(s)) to support edge computing; removing UPF(s) not needed for edge computing; deploying local DN(s) (Data Network(s)); E2E (Edge-to-Edge) OSS (Operations Support System) deployment scenarios; and providing RAN (Radio Access Network) condition data to support various applications (e.g., autonomous driving).
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Joey Chou, Yizhi Yao
  • Patent number: 11972298
    Abstract: Technologies for migrating data between edge accelerators hosted on different edge locations include a device hosted on a present edge location. The device includes one or more processors to: receive a workload from a requesting device, determine one or more accelerator devices hosted on the present edge location to perform the workload, and transmit the workload to the one or more accelerator devices to process the workload. The one or more processor is further to determine whether to perform data migration from the one or more accelerator devices to one or more different edge accelerator devices hosted on a different edge location, and send, in response to a determination to perform the data migration, a request to the one or more accelerator devices on the present edge location for transformed workload data to be processed by the one or more different edge accelerator devices.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Evan Custodio, Francesc Guim Bernat, Suraj Prabhakaran, Trevor Cooper, Ned M. Smith, Kshitij Doshi, Petar Torre
  • Patent number: 11973041
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a mold layer having a first surface and a second surface opposite the first surface, and a plurality of first dies embedded in the mold layer. In an embodiment, each of the plurality of first dies has a surface that is substantially coplanar with the first surface of the mold layer. In an embodiment, the electronic package further comprises a second die embedded in the mold layer. In an embodiment, the second die is positioned between the plurality of first dies and the second surface of the mold layer.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Srinivas Pietambaram, Gang Duan, Deepak Kulkarni, Rahul Manepalli, Xiaoying Guo
  • Patent number: 11971841
    Abstract: An adapter is provided that includes a first interface to couple to a particular device, where link layer data is to be communicated over the first interface, and a second interface to couple to a physical layer (PHY) device. The PHY device includes wires to implement a physical layer of a link, and the link couples the adapter to another adapter via the PHY device. The second interface includes a data channel to communicate the link layer data over the physical layer, and a sideband channel to communicate sideband messages between the adapter and the other adapter over the physical layer. The adapter is to implement a logical PHY for the link.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Narasimha Lanka, Swadesh Choudhary, Mahesh Wagh, Lakshmipriya Seshan
  • Patent number: 11972230
    Abstract: Embodiments for a matrix transpose and multiply operation are disclosed. In an embodiment, a processor includes a decoder and execution circuitry. The decoder is to decode an instruction having a format including an opcode field to specify an opcode, a first destination operand field to specify a destination matrix location, a first source operand field to specify a first source matrix location, and a second source operand field to specify a second source matrix location. The execution circuitry is to, in response to the decoded instruction, transpose the first source matrix to generate a transposed first source matrix, perform a matrix multiplication using the transposed first source matrix and the second source matrix to generate a result, and store the result in a destination matrix location.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Menachem Adelman, Robert Valentine, Barukh Ziv, Amit Gradstein, Simon Rubanovich, Zeev Sperber, Mark J. Charney, Christopher J. Hughes, Alexander F. Heinecke, Evangelos Georganas, Binh Pham
  • Patent number: 11972979
    Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment a semiconductor device comprises a first interlayer dielectric (ILD), a plurality of source/drain (S/D) contacts in the first ILD, a plurality of gate contacts in the first ILD, wherein the gate contacts and the S/D contacts are arranged in an alternating pattern, and wherein top surfaces of the gate contacts are below top surfaces of the S/D contacts so that a channel defined by sidewall surfaces of the first ILD is positioned over each of the gate contacts, mask layer partially filling a first channel over a first gate contact, and a fill metal filling a second channel over a second gate contact that is adjacent to the first gate contact.
    Type: Grant
    Filed: June 7, 2023
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Leonard P. Guler, Michael Harper, Suzanne S. Rich, Charles H. Wallace, Curtis Ward, Richard E. Schenker, Paul Nyhus, Mohit K. Haran, Reken Patel, Swaminathan Sivakumar
  • Patent number: 11972780
    Abstract: A mechanism is described for facilitating cinematic space-time view synthesis in computing environments according to one embodiment. A method of embodiments, as described herein, includes capturing, by one or more cameras, multiple images at multiple positions or multiple points in times, where the multiple images represent multiple views of an object or a scene, where the one or more cameras are coupled to one or more processors of a computing device. The method further includes synthesizing, by a neural network, the multiple images into a single image including a middle image of the multiple images and representing an intermediary view of the multiple views.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Gowri Somanath, Oscar Nestares
  • Patent number: 11971827
    Abstract: Methods, apparatus, systems and articles of manufacture to control address space isolation in a virtual machine are disclosed. An example apparatus includes an address width adjustor to identify a memory width value corresponding to a guest memory associated with a virtual machine (VM), and generate an expanded emulated memory width value. The example apparatus also includes a memory mirror manager to generate a first guest physical address (GPA) range based on the memory width value, and generate a second GPA range based on the expanded emulated memory width value. The example apparatus also includes an EPT generator to generate root paging structures of a first type of EPT with respective addresses within the first GPA range, and generate root paging structures of a second type of EPT with respective addresses within (a) the first GPA range and (b) the second GPA range.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Jun Tian, Kun Tian, Yu Zhang
  • Patent number: 11973618
    Abstract: This disclosure relates to apparatuses, systems, and methods for channel estimation, and in particular channel estimation for 5G New Radio systems. The channel estimation interpolates, prior to performing a de-spreading operation, a first combined channel estimation and a second combined channel estimation to provide from the first combined channel estimation one or more channel estimation values at indices associated with the second combined channel estimation and/or to provide from the second combined channel estimation one or more channel estimation values at indices associated with the first combined channel estimation.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Thushara Hewavithana, Yuzhou Zhang, Xuebin Yang
  • Patent number: 11973121
    Abstract: Discussed herein are device contacts in integrated circuit (IC) structures. In some embodiments, an IC structure may include: a first source/drain (S/D) contact; a gate contact, wherein the gate contact is in contact with a gate and with the first S/D contact; and a second S/D contact, wherein a height of the second S/D contact is less than a height of the first S/D contact.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Guillaume Bouche, Andy Chih-Hung Wei, Mwilwa Tambwe, Sean T. Ma, Piyush Mohan Sinha
  • Patent number: 11973105
    Abstract: An integrated circuit structure comprises at least one metal gate formed in a first dielectric layer, the at least one metal gate comprising a workfunction layer and the gate oxide layer along sidewalls of the first dielectric layer. A field effect (FE) dielectric layer dielectric layer is above the first dielectric layer of the at least one metal gate. A precision resistor comprising a thin-film metallic material is formed on the FE dielectric layer above the at least one metal gate and extending laterally over the at least one metal gate.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Chieh-Jen Ku, Bernhard Sell, Leif Paulson, Kinyip Phoa, Shi Liu
  • Patent number: 11972781
    Abstract: An apparatus may include a memory to store a recorded video. The apparatus may further include an interface to receive at least one set of sensor information based on sensor data that is recorded concurrently with the recorded video and a video clip creation module to identify a sensor event from the at least one set of sensor information and to generate a video clip based upon the sensor event, the video clip comprising video content from the recorded video that is synchronized to the sensor event.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Glen J. Anderson, Giuseppe Raffa
  • Publication number: 20240133799
    Abstract: This disclosure describes systems, methods, and devices related to bond strength measurement. A device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. The device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventor: Khaled AHMED
  • Publication number: 20240134705
    Abstract: Adjusting workload execution based on workload similarity. A processor may determine a similarity of a first workload to a second workload. The processor may adjust execution of the first workload based on execution parameters of the second workload and the similarity of the first workload to the second workload.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Niranjan Hasabnis, Patricia Mwove, Ellick Chan, Derssie Mebratu, Kshitij Doshi, Mohammad Hossain, Gaurav Chaudhary
  • Publication number: 20240135209
    Abstract: A first computing system includes a data store with a sensitive dataset. The first computing system uses a feature extraction tool to perform a statistical analysis of the dataset to generate feature description data to describe a set of features within the dataset. A second computing system is coupled to the first computing system and does not have access to the dataset. The second computing system uses a data synthesizer to receive the feature description data and generate a synthetic dataset that models the dataset and includes the set of features. The second computing system trains a machine learning model with the synthetic data set and provides the trained machine learning model to the first computing system for use with data from the data store as an input.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Priyanka Mudgal, Rita H. Wouhaybi
  • Publication number: 20240134719
    Abstract: Embodiments described herein provide a technique to facilitate the synchronization of workgroups executed on multiple graphics cores of a graphics core cluster. One embodiment provides a graphics core including a cache memory and a graphics core coupled with the cache memory. The graphics core includes execution resources to execute an instruction via a plurality of hardware threads and barrier circuitry to synchronize execution of the plurality of hardware threads, wherein the barrier circuitry is configured to provide a plurality of re-usable named barriers.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Fangwen Fu, Chunhui Mei, John A. Wiegert, Yongsheng Liu, Ben J. Ashbaugh
  • Publication number: 20240133718
    Abstract: The disclosure is directed to apparatus and methods for detection of out of position (OOP) components in a carrier tape forming machine. An apparatus includes cross track sensors coupled to the bus interface circuitry, the cross track sensors configured to detect OOP components prior to overlaying the components on the carrier tape with cover tape, optical sensors to detect the OOP components on the carrier tape after overlaying with cover tape and prior to sealing and to detect reflections from OOP components seated on the carrier tape, an amplifier coupled to the optical sensors to amplify signals generated by the optical sensors and set a range for determining whether the components are OOP, and relays to receive indications of detected OOP components, and a controller coupled to the relays to stop the carrier tape forming machine as a function of signals received by the relays.
    Type: Application
    Filed: October 19, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Ngoc Duy VU, Nguyen Hoang Tan LE, Minh Anh Khoa NGUYEN
  • Publication number: 20240134604
    Abstract: Described herein is a generalized optimal reduction scheme for reducing an array modulo a constant. The constant modulo operation calculates a result for array of bits xi, width n modulo an odd positive integer constant d, (e.g., x[n:0] mod d). Circuitry to perform such operation can be configured to compress the array of bits xi, width n into an array of bits yi width m. The techniques described herein enable the design of optimal circuitry via iterative exploration of all potential reduction strategies that are available given the input constraints.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Theo Drane, Christopher Louis Poole, William Zorn, Emiliano Morini
  • Publication number: 20240134603
    Abstract: The techniques described in the detailed description above enable the manufacturing of circuits with increased performance and efficiency when performing division by a constant number. One embodiment provides circuitry including an input circuit to receive an input value including a plurality of bits, a logarithmic tree coupled with the input circuit, the logarithmic tree configured to compute an array of values based on a plurality of multi-bit groups of the plurality of bits of the input value, each value in the array of values includes a modulus of a corresponding multi-bit group with respect to the constant, a binary array adder to compute a quotient of the division operation based on the array of values, the input value, and the constant, and an output circuit to output the quotient.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Theo Drane, Christopher Louis Poole, William Zorn, Emiliano Morini
  • Publication number: 20240134797
    Abstract: Embodiments described herein provide a technique to facilitate the broadcast or multicast of asynchronous loads to shared local memory of a plurality of graphics cores within a graphics core cluster. One embodiment provides a graphics processor including a cache memory a graphics core cluster coupled with the cache memory. The graphics core cluster includes a plurality of graphics cores. The plurality of graphics cores includes a graphics core configured to receive a designation as a producer graphics core for a multicast load, read data from the cache memory; and transmit the data read from the cache memory to a consumer graphics core of the plurality of graphics cores.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: John A. Wiegert, Joydeep Ray, Vasanth Ranganathan, Biju George, Fangwen Fu, Abhishek R. Appu, Chunhui Mei, Changwon Rhee
  • Publication number: 20240134644
    Abstract: Embodiments detailed herein relate to matrix operations. In particular, support for matrix (tile) addition, subtraction, and multiplication is described. For example, circuitry to support instructions for element-by-element matrix (tile) addition, subtraction, and multiplication are detailed. In some embodiments, for matrix (tile) addition, decode circuitry is to decode an instruction having fields for an opcode, a first source matrix operand identifier, a second source matrix operand identifier, and a destination matrix operand identifier; and execution circuitry is to execute the decoded instruction to, for each data element position of the identified first source matrix operand: add a first data value at that data element position to a second data value at a corresponding data element position of the identified second source matrix operand, and store a result of the addition into a corresponding data element position of the identified destination matrix operand.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Robert VALENTINE, Dan BAUM, Zeev SPERBER, Jesus CORBAL, Elmoustapha OULD-AHMED-VALL, Bret L. TOLL, Mark J. CHARNEY, Barukh ZIV, Alexander HEINECKE, Milind GIRKAR, Simon RUBANOVICH
  • Publication number: 20240135485
    Abstract: The disclosure relates to tuning configuration parameters for graphics pipeline for better user experience. A device for graphics processing, comprising: hardware engines; a graphics pipeline at least partly implemented by the hardware engines; and a tuner, coupled to the hardware engines and the graphics pipeline, the tuner to: collect statuses of the device during runtime for a previous frame; determine configuration parameters based on the collected statuses, the configuration parameters associated with three-dimensional 3D rendering, pre-processing and video encoding of the graphics pipeline; and tune the graphics pipeline with the determined configuration parameters for processing a next frame.
    Type: Application
    Filed: September 1, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Fan He, Yi Qian, Ning Luo, Yunbiao Lin, Changliang Wang, Ximin Zhang
  • Publication number: 20240135750
    Abstract: An initializer for circle distribution on a 2D surface using a polar coordinate system for image compression, video compression, motion detection, and posture detection. The initializer can also be used for sphere distribution in a 3D shape. The initializer uses a mixed deterministic and iterative/stochastic approach. Using the polar coordinate system for initialization enables coverage of the user space, and after parameters are initialized, the method transitions to a cartesian coordinate system. Methods for using the polar system in CPU units by applying an XNOR/AND architecture for neural network model compression are also described. The neural network includes a perceptron for supervised learning of binary classifiers. The unit responsible for multiplication in a MAC architecture can be replaced with a non-linear expressive function. Thus, a neural network having a non-linear expressive perceptron (quadtron) is described for solving circle distribution and other problems.
    Type: Application
    Filed: November 16, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Pawel Tomkiewicz, Pawel Zielonka, Lukasz Braszka, Monica Lucia Martinez-Canales
  • Publication number: 20240135483
    Abstract: Described herein is a graphics processor comprising a system interconnect and a graphics processor cluster coupled with the system interconnect. The graphics processor cluster includes circuitry configurable to generate per-frame neural representations of a multi-view video via incremental training and transferal of weights.
    Type: Application
    Filed: October 23, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Shengze Wang, Alexey Supikov, Joshua Ratcliff, Ronald Azuma
  • Publication number: 20240136279
    Abstract: Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device, and integrated inductors formed over the semiconductor devices. Power delivery to the device is on the opposite side of the semiconductor devices. The integrated inductors may be used for power step-down to reduce device thickness and/or a number of power rails.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Min Suet Lim, Telesphor Kamgaing, Chee Kheong Yoon, Chu Aun Lim, Eng Huat Goh, Jooi Wah Wong, Kavitha Nagarajan
  • Publication number: 20240136244
    Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
  • Publication number: 20240136277
    Abstract: A device includes a device level having a metallization structure coupled to a semiconductor device and a transistor above the device level. The transistor has a body including a single crystal group III-V or group IV semiconductor material, a source structure on a first portion of the body and a drain structure on a second portion of the body, where the source structure is separate from the drain structure. The transistor further includes a gate structure including a first gate structure portion in a recess in the body and a second gate structure portion between the source structure and the drain structure. A source contact is coupled with the source structure and a drain contact is coupled with the drain structure. The source contact is in contact with the metallization structure in the device level.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Gilbert Dewey, Ryan Keech, Cory Bomberger, Cheng-Ying Huang, Ashish Agrawal, Willy Rachmady, Anand Murthy
  • Publication number: 20240134804
    Abstract: An apparatus comprising translator circuitry to receive a plurality of physical addresses of memory data, determine an offset associated with each of the physical page addresses and apply a tweak seed to each offset to generate a plurality of tweaks.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Marcin Andrzej Chrapek, Reshma Lal
  • Publication number: 20240134786
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed for sparse tensor storage for neural network accelerators. An example apparatus includes sparsity map generating circuitry to generate a sparsity map corresponding to a tensor, the sparsity map to indicate whether a data point of the tensor is zero, static storage controlling circuitry to divide the tensor into one or more storage elements, and a compressor to perform a first compression of the one or more storage elements to generate one or more compressed storage elements, the first compression to remove zero points of the one or more storage elements based on the sparsity map and perform a second compression of the one or more compressed storage elements, the second compression to store the one or more compressed storage elements contiguously in memory.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Martin-Thomas Grymel, David Bernard, Niall Hanrahan, Martin Power, Kevin Brady, Gary Baugh, Cormac Brick
  • Patent number: D1024974
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Samantha Rao, Harish Jagadish, Arvind S