Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: A memory device, includes a memory array for storing a plurality of vector data each of which has an MSB vector and a LSB vector. The memory array includes a plurality of memory units each of which has a first bit and a second bit. The first bit is used to store the MSB vector of each vector data, the second bit is used to store the LSB vector of each vector data. A bit line corresponding to each vector data executes one time of bit-line-setup, and reads the MSB vector and the LSB vector of each vector data according to the bit line. The threshold voltage distribution of each memory unit is divided into N states, where N is a positive integer and N is less than 2 to the power of 2, and the effective bit number stored by each memory unit is less than 2.

Abstract: A method of growing a single crystal ingot includes growing a single crystal silicon ingot from a silicon melt in a crucible within an inner chamber, adding a volatile dopant into a feed tube, positioning the feed tube within an inner chamber at a first height relative to a surface of the melt, adjusting the feed tube within the inner chamber to a second height at a speed rate, and heating the volatile dopant to form a gaseous dopant as the feed tube is moved from the first height to the second height at the speed rate. Each of the second height and the speed rate are selected to control a vaporization rate of the volatile dopant. The method also includes introducing dopant species into the melt while growing the ingot by contacting the surface of the melt with the gaseous dopant.

Abstract: A method of growing a single crystal ingot includes growing a single crystal silicon ingot from a silicon melt in a crucible within an inner chamber, adding a volatile dopant into a feed tube, positioning the feed tube within an inner chamber at a first height relative to a surface of the melt, adjusting the feed tube within the inner chamber to a second height at a speed rate, and heating the volatile dopant to form a gaseous dopant as the feed tube is moved from the first height to the second height at the speed rate. Each of the second height and the speed rate are selected to control a vaporization rate of the volatile dopant. The method also includes introducing dopant species into the melt while growing the ingot by contacting the surface of the melt with the gaseous dopant.

Abstract: A light-emitting device includes a substrate, a semiconductor epitaxial structure, and an etch stop layer. The substrate has a first surface and a second surface opposite to the first surface. The semiconductor epitaxial structure has a side surface that has a roughened structure formed with protrusions, and includes a first type semiconductor layer, an active layer, and a second type semiconductor layer disposed on the first surface of the substrate in such order. The etch stop layer is disposed on a surface of the semiconductor epitaxial structure away from the substrate for preventing an etching solution from etching the semiconductor epitaxial structure. A light-emitting package and a light-emitting apparatus are also provided. A method for manufacturing a light-emitting device is also provided.

Abstract: This disclosure provides systems, devices, apparatus, and methods, including computer programs encoded on storage media, for dynamic wave pairing. A graphics processor may allocate one or more GPU workloads to one or more wave slots of a plurality of wave slots. The graphics processor may select a first execution slot of a plurality of execution slots for executing the one or more GPU workloads. The selection may be based on one of a plurality of granularities. The graphics processor may execute, at the selected first execution slot, the one or more GPU workloads at the one of the plurality of granularities.

Abstract: A control method of a driving mechanism is provided, including: the driving mechanism provides a first electrical signal from a control assembly to the driving mechanism to move the movable portion into an initial position relative to the fixed portion, wherein the control assembly includes a control unit and a position sensing unit; the status signal of an inertia sensing unit is read; the control unit sends the status signal to the control unit to calculate a target position; the control unit provides a second electrical signal to the driving assembly according to the target position for driving the driving assembly; a position signal is sent from the position sensing unit to the control unit; the control unit provides a third electric signal to the driving assembly to drive the driving assembly according the position signal.

Abstract: A package structure and method of forming the same are provided. The package structure includes a polymer layer, a redistribution layer, a die, and an adhesion promoter layer. The redistribution layer is disposed over the polymer layer. The die is sandwiched between the polymer layer and the redistribution layer. The adhesion promoter layer, an oxide layer, a through via, and an encapsulant are sandwiched between the polymer layer and the redistribution layer. The encapsulant is laterally encapsulates the die. The through via extends through the encapsulant. The adhesion promoter layer and the oxide layer are laterally sandwiched between the through via and the encapsulant. A bottom portion of the encapsulant is longitudinally sandwiched between the adhesion promoter layer and the polymer layer.

Abstract: A modified cutinase is disclosed. The cutinase has the modified amino acid sequence of SEQ ID NO: 2, wherein the modification is a substitution of asparagine at position 181 with alanine, or substitutions of asparagine at position 181 with alanine and phenylalanine at position 235 with leucine. The modified enzyme has improved PET-hydrolytic activity, and thus, the high-activity PET hydrolase is obtained, and the industrial application value of the PET hydrolase is enhanced.

Abstract: A system and method remotely allocate bandwidth among content consumers on a computing network based on optimizing an aggregate objective pertaining to a plurality of flows of content. The system and method create a profile for each flow of the plurality of flows from a content provider to a content consumer on the computing network. Information is stored in each profile based on at least a metric associated with the corresponding flow. A target bandwidth for each profile is computed remotely, based on optimizing an aggregate objective pertaining to the plurality of flows of content. The optimizing is also based on the information stored in their respective profiles. The system and method distribute the bandwidth to each flow of the plurality of flows based on the target bandwidth remotely computed for each profile.

Abstract: An ultraviolet (UV) lamp assembly of a UV curing tool is provided for curing a low dielectric constant (low-k) material layer of a semiconductor wafer. The UV lamp assembly includes: a UV lamp which emits UV light; a first reflector arranged proximate to a first side of the UV lamp, the first reflector including a first surface facing the UV lamp from which UV light emitted by the UV lamp is at least partially reflected; and a UV reflective coating partially coating the first surface of the reflector. Suitably, a plurality of areas of the first surface of the reflector remain uncoated with the UV reflective coating and the plurality of uncoated areas are arranged to promote a uniform exposure of the semiconductor wafer to UV irradiation.

Abstract: An optical radar includes an optical-signal receiving unit and an optical-signal pickup unit. The optical-signal receiving unit is configured to receive a reflected light. The optical-signal pickup unit is coupled to the optical-signal receiving unit and includes a first optical-signal filtering circuit and a second optical-signal filtering unit. The first optical-signal filtering circuit is configured to filter out a first interference pulse of the reflected light, wherein the first interference pulse has a first interference voltage value higher than a reference voltage. The second optical-signal filtering circuit is coupled to the first optical-signal filtering circuit and configured to generate a clock signal comprising a clock pulse; and filter out a second interference pulse that does not match the clock pulse in time point from the reflected light.

Abstract: Described are systems and methods related to a memory block erase protocol. An example system includes a memory device having a memory array including a plurality of memory cells. The system further includes a processing device coupled to the memory device. The processing device is to determine a value of a metric associated with the memory array. Responsive to determine that the value of the metric is below a predetermined threshold, the processing device is further to initiate an erase protocol of the memory device. The processing device is further to erase sets of memory cells associated with one or more memory blocks of the memory array. The processing device is further to receive a programming command directed to the first set of memory cells. The processing device is further to perform a programming operation with respect to a set of memory cells responsive to receiving the programming command.

Abstract: A storage device and a data accessing method are disclosed, wherein the storage device includes a memory circuit and a control circuit. The memory circuit includes a plurality of multi-level cells, and each of the multi-level cells is configured to store at least a first bit, a second bit and a third bit in at least a first page, a second page and a third page. The control circuit is configured to read the first bits according to a one-time reading operation related to the first bits, read the second bits according to M-times reading operations related to the second bits, and read the third bits according to N-times reading operations related to the third bits, wherein the difference between M and N is less than or equal to one.

Abstract: An ultraviolet (UV) lamp assembly of a UV curing tool is provided for curing a low dielectric constant (low-k) material layer of a semiconductor wafer. The UV lamp assembly includes: a UV lamp which emits UV light; a first reflector arranged proximate to a first side of the UV lamp, the first reflector including a first surface facing the UV lamp from which UV light emitted by the UV lamp is at least partially reflected; and a UV reflective coating partially coating the first surface of the reflector. Suitably, a plurality of areas of the first surface of the reflector remain uncoated with the UV reflective coating and the plurality of uncoated areas are arranged to promote a uniform exposure of the semiconductor wafer to UV irradiation.

Abstract: The present invention provides a capacitive voltage transformer, including: a capacitive voltage-dividing component and an electromagnetic unit. The capacitive voltage-dividing component comprises: one or more levels of stacks, and each stack is a coupling capacitor. The coupling capacitor includes: an upper cover plate, a lower cover plate, an insulating sleeve, a capacitor core, squirrel cage electrodes, volume matching devices, a high voltage lead, and a low voltage lead. The lowermost coupling capacitor is provided with a medium voltage lead and a lead terminal. The low voltage lead of the lowermost coupling capacitor is led out through a low-voltage leading-out tube arranged in the lead terminal, and the medium voltage lead of the lowermost coupling capacitor is led out through a medium-voltage leading-out post arranged in the lead terminal. The medium-voltage leading-out post passes through and out of the low-voltage leading-out tube and is arranged coaxially with the low-voltage leading-out tube.

Abstract: A team sports vision training system based on extended reality, voice interaction and action recognition is configured to train vision and an action of a user. A head-mounted display device includes a task scenario player and a speech sensing module. An action capture device generates an action message. A computing server stores a scenario setting parameter group and includes a task scenario generating module, a speech recognition module and an action recognition module. The task scenario generating module generates a virtual task scenario image and a task parameter group according to the scenario setting parameter group. The speech recognition module generates a speech recognition result and a vision training result. Then action recognition module generates an action recognition result and a sport training result. The vision training result and the sport training result are configured to judge whether the user meets a training requirement.

Abstract: A wearable fNIRS brain imaging system, including a light source-photoelectric detector module, a control and wireless transmission module, a power source module, and an upper computer; the system is able to solve the problems in a wearable fNIRS brain imaging system or an EEG-fNIRS multi-modal brain imaging system where the relative position of a probe cannot be freely adjusted and a detection region is limited; in the present system, the relative positions of a light source probe and a photoelectric detector can be freely adjusted according to actual circumstances, and the distance between the two is automatically measured; a brain electricity sensor may be installed at the periphery of the light source probe and a bottom face of a cylindrical casing of the photoelectric detector, and distance therebetween synchronously changes with the probe, implementing EEG-fNIRS multi-modal brain imaging, and also able to capture brain electrical signals of differing densities.