Patents by Inventor Ichiro Suehiro
Ichiro Suehiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220146371Abstract: The present disclosure relates to a plastic optical fiber (POF) core diameter measuring method and a POF core diameter measuring apparatus, and a POF defect detecting method, and a POF defect detecting apparatus used therefor. Light irradiation mechanisms are provided for irradiating a side of a POF with light, with imaging mechanisms provided on the opposite side of the POF from the light irradiation mechanisms; and a data processing mechanism for processing image data on the POF acquired from the imaging mechanisms to calculate the core diameter of the POF. The ratio (D/W) of the shortest distance D to a light emission width W is in the range of 0.9 to 1.3 where W is the light emission width of the light irradiation mechanisms and D is the shortest distance between a light emission position of the light irradiation mechanisms and the side of the POF.Type: ApplicationFiled: February 3, 2020Publication date: May 12, 2022Applicant: NITTO DENKO CORPORATIONInventors: Masaru Sakamoto, Ichiro Suehiro
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Patent number: 10746664Abstract: Provided are a polarizing film imaging apparatus, a polarizing film inspection apparatus including the imaging apparatus, and a polarizing film inspection method using the imaging apparatus. The imaging apparatus includes: a light source that is configured to emit light toward a polarizing film to be inspected; an imaging unit that is arranged on an optical axis of the light source and on an opposite side to the light source with the polarizing film therebetween; and at least one of a circular polarizing plate arranged between the light source and the polarizing film, and a wavelength plate arranged between the polarizing film and the imaging unit.Type: GrantFiled: July 30, 2018Date of Patent: August 18, 2020Assignees: NITTO DENKO CORPORATION, UTSUNOMIYA UNIVERSITYInventors: Shunsuke Sasaki, Ichiro Suehiro, Shuhei Shibata, David Ignacio Serrano Garcia, Yukitoshi Otani
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Publication number: 20190033226Abstract: Provided are a polarizing film imaging apparatus, a polarizing film inspection apparatus including the imaging apparatus, and a polarizing film inspection method using the imaging apparatus. The imaging apparatus includes: a light source that is configured to emit light toward a polarizing film to be inspected; an imaging unit that is arranged on an optical axis of the light source and on an opposite side to the light source with the polarizing film therebetween; and at least one of a circular polarizing plate arranged between the light source and the polarizing film, and a wavelength plate arranged between the polarizing film and the imaging unit.Type: ApplicationFiled: July 30, 2018Publication date: January 31, 2019Applicants: NITTO DENKO CORPORATION, UTSUNOMIYA UNIVERSITYInventors: Shunsuke Sasaki, Ichiro Suehiro, Shuhei Shibata, David Ignacio Serrano Garcia, Yukitoshi Otani
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Patent number: 8985818Abstract: The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.Type: GrantFiled: November 26, 2010Date of Patent: March 24, 2015Assignee: Nitto Denko CorporationInventors: Daisuke Kitagawa, Yoshinari Takayama, Ichiro Suehiro, Hideyuki Usui, Takashi Oda
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Patent number: 8734964Abstract: An etching resist has a first heat-generating layer, a second heat-generating layer, and a metal compound layer including a metallic oxynitride layer containing a metallic oxynitride. The first heat-generating layer, the metallic oxynitride layer, and the second heat-generating layer are directly or indirectly laminated such that the metallic oxynitride layer is positioned between the first heat-generating layer and the second heat-generating layer.Type: GrantFiled: December 15, 2009Date of Patent: May 27, 2014Assignees: National Institute of Advanced Industrial Science and Technology, Nitto Denko CorporationInventors: Kazuma Kurihara, Takashi Nakano, Takayuki Shima, Junji Tominaga, Kazuya Fujioka, Ichiro Suehiro
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Patent number: 8558273Abstract: The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.Type: GrantFiled: June 6, 2011Date of Patent: October 15, 2013Assignee: Nitto Denko CorporationInventors: Hirokazu Matsuda, Ichiro Suehiro
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Publication number: 20130029091Abstract: A method of producing a resin sheet includes the steps of arranging a resin sheet between a substrate and a die opposed to the substrate, and forming a through-hole in the resin sheet to pass through the resin sheet in a pressing direction by relatively pressing the die against the substrate. The die includes a first protrusion protruding toward a downstream side in the pressing direction. A second protrusion protruding toward the downstream side in the pressing direction is formed on a peripheral edge portion of an end portion of the first protrusion on the downstream side in the pressing direction. An end portion of the second protrusion on the downstream side in the pressing direction is formed at an acute angle in sectional view along the pressing direction.Type: ApplicationFiled: July 11, 2012Publication date: January 31, 2013Applicant: NITTO DENKO CORPORATIONInventor: Ichiro Suehiro
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Publication number: 20120230043Abstract: The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.Type: ApplicationFiled: November 26, 2010Publication date: September 13, 2012Applicant: NITTO DENKO CORPORATIONInventors: Daisuke Kitagawa, Yoshinari Takayama, Ichiro Suehiro, Hideyuki Usui, Takashi Oda
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Publication number: 20110298004Abstract: The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.Type: ApplicationFiled: June 6, 2011Publication date: December 8, 2011Applicant: NITTO DENKO CORPORATIONInventors: Hirokazu MATSUDA, Ichiro SUEHIRO
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Patent number: 8021756Abstract: The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.Type: GrantFiled: August 25, 2009Date of Patent: September 20, 2011Assignee: Nitto Denko CorporationInventors: Ichiro Suehiro, Hiroyuki Katayama, Kouji Akazawa, Hideyuki Usui
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Patent number: 7781794Abstract: The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.Type: GrantFiled: March 24, 2009Date of Patent: August 24, 2010Assignee: Nitto Denko CorporationInventors: Ichiro Suehiro, Kouji Akazawa, Hideyuki Usui
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Publication number: 20100209670Abstract: The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet.Type: ApplicationFiled: February 16, 2010Publication date: August 19, 2010Applicant: NITTO DENKO CORPORATIONInventors: Ichiro SUEHIRO, Kazuya FUJIOKA, Hirokazu MATSUDA, Koji AKAZAWA, Ryuichi KIMURA, Hideyuki USUI
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Publication number: 20100167015Abstract: An etching resist containing a metallic oxynitride. The etching resist of the present invention can be suitably used, for example, in the production of a molded article for surface-working an optical member such as a microlens sheet, a light diffusing sheet, a non-reflective sheet, a sheet for encapsulating photosemiconductor elements, an optical waveguide, an optical disk, or a photosensor.Type: ApplicationFiled: December 15, 2009Publication date: July 1, 2010Applicants: National Institute of Advanced Ind. Sci. and Tech., NITTO DENKO CORPORATIONInventors: Kazuma Kurihara, Takashi Nakano, Takayuki Shima, Junji Tominaga, Kazuya Fujioka, Ichiro Suehiro
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Publication number: 20100053960Abstract: The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.Type: ApplicationFiled: August 25, 2009Publication date: March 4, 2010Applicant: NITTO DENKO CORPORATIONInventors: Ichiro SUEHIRO, Hiroyuki KATAYAMA, Kouji AKAZAWA, Hideyuki USUI
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Publication number: 20090242928Abstract: The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.Type: ApplicationFiled: March 24, 2009Publication date: October 1, 2009Applicant: NITTO DENKO CORPORATIONInventors: Ichiro SUEHIRO, Kouji AKAZAWA, Hideyuki USUI
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Patent number: 7559681Abstract: The present invention provides a light pipe for a direct-type backlight having an upper surface and a lower surface, which has: a light reflecting member provided on the upper surface; and plural light scattering members formed concentrically on at least one surface selected from the upper surface and the lower surface, wherein each of the plural light scattering members is a circular groove or a circular projection, wherein each area between respective light scattering members is substantially the same.Type: GrantFiled: November 1, 2005Date of Patent: July 14, 2009Assignee: Nitto Denko CorporationInventors: Ichiro Suehiro, Noriaki Harada, Yuji Hotta
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Patent number: 7290902Abstract: The present invention provides A direct-type backlight having: a resin sealing member including at least one resin layer, which has a light reflecting section formed on the outermost surface of the resin sealing member; an optical semiconductor element sealed by the resin sealing member; and plural circular light scattering grooves formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.Type: GrantFiled: April 14, 2005Date of Patent: November 6, 2007Assignee: Nitto Denko CorporationInventors: Ichiro Suehiro, Yuji Hotta, Naoki Sadayori, Noriaki Harada, Kazuki Uawada
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Patent number: 7231706Abstract: An anisotropic conductive film is prepared by winding an insulated wire around a core member to form one roll of a winding layer, placing an insulating resin film on the obtained winding layer, and repeating the step of winding the insulated wire and the step of placing the insulating resin film to give a laminate alternately having the winding layer comprising a single row of insulated wires and an insulating resin layer made from the insulating resin film. A coating layer and insulating resin layer are melted to integrate the winding layer and the insulating resin layer. The laminate then is sliced along a plane forming an angle with the insulated wire in a desired film thickness.Type: GrantFiled: April 3, 2003Date of Patent: June 19, 2007Assignee: Nitto Denko CorporationInventors: Miho Yamaguchi, Ichiro Suehiro, Fumiteru Asai, Yuji Hotta
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Publication number: 20060118973Abstract: The present invention provides a sheet for optical-semiconductor-element encapsulation, which comprises: an outermost resin layer A that is to be brought into contact with one or more optical semiconductor elements; a light-diffusing layer formed on the layer A and containing light-diffusing particles; and a resin layer B formed on the light-diffusing layer and having a lower refractive index than that of the layer A. Also disclosed is a process for producing an optical semiconductor device using the sheet.Type: ApplicationFiled: November 15, 2005Publication date: June 8, 2006Inventors: Noriaki Harada, Yuji Hotta, Ichiro Suehiro, Naoki Sadayori
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Publication number: 20060119751Abstract: The present invention provides a light pipe for a direct-type backlight having an upper surface and a lower surface, which has: a light reflecting member provided on the upper surface; and plural light scattering members formed concentrically on at least one surface selected from the upper surface and the lower surface, wherein each of the plural light scattering members is a circular groove or a circular projection, wherein each area between respective light scattering members is substantially the same.Type: ApplicationFiled: November 1, 2005Publication date: June 8, 2006Inventors: Ichiro Suehiro, Noriaki Harada, Yuji Hotta