Patents by Inventor Jin-Woo Park

Jin-Woo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923343
    Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: March 5, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaekyung Yoo, Jayeon Lee, Jae-eun Lee, Yeongkwon Ko, Jin-woo Park, Teak Hoon Lee
  • Publication number: 20240069875
    Abstract: Disclosed herein are a neural network model deployment method and apparatus for providing a deep learning service. The neural network model deployment method may include providing a specification wizard to a user, searching for and training a neural network based on a user requirement specification that is input through the specification wizard, generating a neural network template code based on the user requirement specification and the trained neural network, converting the trained neural network into a deployment neural network that is usable in a target device based on the user requirement specification, and deploying the deployment neural network to the target device.
    Type: Application
    Filed: June 14, 2023
    Publication date: February 29, 2024
    Inventors: Jae-Bok PARK, Chang-Sik CHO, Kyung-Hee LEE, Ji-Young KWAK, Seon-Tae KIM, Hong-Soog KIM, Jin-Wuk SEOK, Hyun-Woo CHO
  • Publication number: 20240066578
    Abstract: An aluminum plate coiling device capable of coiling an extruded and rolled aluminum plate without generating distortion or deformation of the aluminum plate is disclosed. The aluminum plate coiling device has a simple structure, thereby being capable of achieving a reduction in installation space and a reduction in installation cost.
    Type: Application
    Filed: October 19, 2022
    Publication date: February 29, 2024
    Inventors: Do Bong PARK, Jin Woo PARK, Seong Heon KIM
  • Publication number: 20240072000
    Abstract: A semiconductor package includes a substrate; a substrate pad on the substrate; a first semiconductor chip and a second semiconductor chip on the substrate; a connective terminal between the substrate pad and the first semiconductor chip and between the substrate pad and the second semiconductor chip; a dummy pad on the substrate, and spaced apart from the substrate pad, wherein the dummy pad is between the first semiconductor chip and the second semiconductor chip; and an underfill material layer interposed between the substrate and the first semiconductor chip and between the substrate and the second semiconductor chip, wherein the dummy pad and the substrate pad include a same material.
    Type: Application
    Filed: August 25, 2023
    Publication date: February 29, 2024
    Inventors: Jin-Woo PARK, Un-Byoung KANG, Chung Sun LEE
  • Publication number: 20240066576
    Abstract: An aluminum plate manufacturing method capable of achieving an enhancement in productivity through a reduction in the number of processes and a reduction in processing time is disclosed. In the aluminum plate manufacturing method, a plate is rolled after being extruded to a desired thickness. Accordingly, it is possible to reduce the number of processes and a processing time and, as such, achieving an enhancement in productivity, as compared to a conventional manufacturing process using only rolling.
    Type: Application
    Filed: October 14, 2022
    Publication date: February 29, 2024
    Inventors: Do Bong PARK, Jin Woo PARK, Seong Heon KIM
  • Publication number: 20240072228
    Abstract: A display device comprises a first pixel including a first emission area, a second pixel including a second emission area spaced apart from the first emission area in a first direction, and a bank partitioning the first emission area and the second emission area, wherein the first pixel includes a first alignment electrode, a second alignment electrode, and a third alignment electrode sequentially located, spaced apart from each other in the first direction, and overlapping with the first emission area, first light-emitting elements above, and overlapping with, the first alignment electrode and the second alignment electrode, second light-emitting elements above, and overlapping with, the second alignment electrode and the third alignment electrode, and a dummy electrode between the first emission area and the second emission area, and overlapping with the bank.
    Type: Application
    Filed: August 2, 2023
    Publication date: February 29, 2024
    Inventors: Won Jun LEE, Dong Woo KIM, Do Yeong PARK, Se Hyun LEE, Kwi Hyun KIM, Min Gyeong SHIN, Jin Joo HA
  • Patent number: 11911134
    Abstract: An apparatus for non-invasively measuring bio-information is provided. The apparatus for estimating bio-information may include a pulse wave sensor configured to measure a pulse wave signal from an object; a sensor position sensor configured to obtain sensor position information of the pulse wave sensor with respect to the object, based on the object being in contact with the pulse wave sensor; and a processor configured to estimate the bio-information based on blood vessel position information of the object, the sensor position information, and the pulse wave signal.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Woo Choi, Sang Yun Park, Hye Rim Lim, Jae Min Kang, Seung Woo Noh
  • Publication number: 20240062998
    Abstract: Disclosed is a method of processing a substrate. The method may include: a substrate loading operation of loading a substrate into a treating space of a chamber; a film removal operation of removing a film provided on the substrate; a protective film formation operation of forming a protective film containing oxygen on the substrate; and a substrate unloading operation of unloading the substrate from the treating space.
    Type: Application
    Filed: December 9, 2021
    Publication date: February 22, 2024
    Inventors: Jin Woo PARK, Hyeong Shin CHO
  • Publication number: 20240062408
    Abstract: A method for analyzing a visitor on the basis of a video in an edge computing environment is provided. The method includes the steps of: extracting feature data from a captured video of an offline space; generating detection data on a location and an appearance of an object contained in the captured video from the feature data using an artificial neural network-based detection model; and integrating detection data of a location and an appearance of a target object.
    Type: Application
    Filed: November 15, 2021
    Publication date: February 22, 2024
    Applicant: MAY-I INC.
    Inventors: Jin Woo PARK, In Sik SHIN
  • Publication number: 20240058820
    Abstract: Provided is a portable isothermal amplification device for amplifying a nucleic acid using an isothermal amplification method, the device comprising: a tube insertion part into which a PCR tube is to be inserted, which is provided in an upper portion of the portable isothermal amplification device; a cover for covering the tube insertion part; a storage space for accommodating a heating device and a storage space cover for blocking the storage space from an outside, which is provided in a lower portion of the portable isothermal amplification device; and a heat insulator for blocking heat from the outside and a heat-sensing sticker capable of measuring a temperature of heat generated by the heating device, which is provided inside the storage space.
    Type: Application
    Filed: August 20, 2022
    Publication date: February 22, 2024
    Inventors: Jin Woo PARK, Bong Kyun KIM, So Young KIM
  • Publication number: 20240055398
    Abstract: A semiconductor package includes a first substrate, a memory semiconductor package on a first surface of the first substrate, an adhesive layer between the first surface of the first substrate and the memory semiconductor package, a wire extending from an upper surface of the memory semiconductor package and connected to the first substrate, a logic semiconductor chip on the first surface of the first substrate, a first connection terminal between the first surface of the first substrate and the logic semiconductor chip, and a molding layer, wherein a first height of the memory semiconductor package is smaller than a second height of the logic semiconductor chip, and wherein an uppermost surface of the molding layer and the upper surface of the logic semiconductor chip are coplanar.
    Type: Application
    Filed: April 28, 2023
    Publication date: February 15, 2024
    Inventors: Choong Bin Yim, Ji-Yong Park, Jin-Woo Park, Jong Bo Shim
  • Publication number: 20240041325
    Abstract: A computer implemented method, system and device are provided. The method transmits an energizing signal from an external antenna, coupled to a local external device (LED), to an implanted antenna of a passive implanted medical device (PIMD). The energizing signal is transmitted while the external antenna is at first and second positions. The method receives, at the external antenna, first and second energy transfer characteristic (ETC) values associated with the first and second positions, respectively. The method is under control of one or more processors configured with program instructions. The method analyzes the first and second ETC values to determine a difference therebetween. The method provides an energy transfer level (ETL) indicator based on the difference between the first and second ETC values. The ETL indicator provides feedback regarding a degree of energy transfer associated with at least one of the first and second positions.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 8, 2024
    Inventors: Jin Woo Park, Michael Fonseca, William D. Barrett, Philip M. FitzSimons
  • Patent number: 11890082
    Abstract: A system and method are provided for determining a pressure associated with a lumen of a body. A wireless sensor is positioned in the lumen of the body. The sensor comprises an LC resonant circuit having a resonant frequency configured to vary in response to changes in pressure in the lumen. One or more sensor calibration parameters are stored at an external base unit. The external based unit generates and transmits an energizing signal. A ring down response is received from the wireless sensor. The system and method determine the resonant frequency of the LC resonant circuit from the ring down response and calculate the pressure in the lumen from the resonant frequency of the LC resonant circuit utilizing the one or more sensor calibration parameters associated with the LC resonant circuit.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: February 6, 2024
    Assignee: TC1 LLC
    Inventors: Florent Cros, David O'Brien, Michael Fonseca, Matthew Abercrombie, Jin Woo Park, Angad Singh
  • Publication number: 20230402358
    Abstract: A semiconductor package includes a package substrate, substrate pads provided on a top surface of the package substrate, at least one core ball on at least one of the substrate pads, a redistribution substrate provided on the top surface of the package substrate, and a semiconductor chip mounted on the redistribution substrate. The redistribution substrate is electrically connected to the package substrate through a plurality of solder balls provided on a bottom surface of the redistribution substrate. The at least one core ball is electrically connected to the redistribution substrate. A diameter of the at least one core ball is greater than a diameter of each of the plurality of solder balls.
    Type: Application
    Filed: February 27, 2023
    Publication date: December 14, 2023
    Inventors: CHOONGBIN YIM, JI-YONG PARK, JIN-WOO PARK
  • Patent number: 11844257
    Abstract: A display device includes a first pixel area including a first pixel electrode and a first organic light emitting layer, a tandem pixel area including a tandem pixel electrode, a first tandem organic light emitting layer and a second tandem organic light emitting layer, a capping layer including a first capping layer corresponding to the first organic light emitting layer and a tandem capping layer corresponding to both the first tandem organic light emitting layer and the second tandem organic light emitting layer, and a common electrode between the first capping layer and the first organic light emitting layer and between the tandem capping layer and the second tandem organic light emitting layer. Each of the first capping layer and the tandem capping layer has a thickness, and the thickness of the tandem capping layer is smaller than the thickness of the first capping layer.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: December 12, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Solji Kim, Jungjin Yang, Donghoon Kim, Jin Woo Park, Jinsook Bang, Seokjae Lee, Sunhye Lee, Sanghoon Yim
  • Publication number: 20230395032
    Abstract: A circuit stage including a first transistor including a first electrode and a gate electrode, the first electrode being coupled to a first input terminal and the gate electrode being coupled to a second input terminal configured to receive a first clock signal, an output circuit coupled to the second input terminal and a second power input terminal, an input circuit coupled to a second electrode of the first transistor and to a third input terminal, the third input terminal being configured to receive a first control clock signal, the input circuit being configured to control voltages of the second node and a third node, a first driving circuit coupled to a first power input terminal and to a fourth input terminal configured to receive a second control clock signal, and a second driving circuit coupled to the fourth input terminal and the third node.
    Type: Application
    Filed: August 21, 2023
    Publication date: December 7, 2023
    Inventors: Chul Kyu KANG, Yong Sung PARK, Jin Woo PARK, Dong Sun LEE
  • Publication number: 20230397456
    Abstract: A display device including a display panel including a plurality of transistors and displaying an image on a front surface thereof; and a sensing module on a rear surface of the display panel, wherein the display panel includes a first region that overlaps the sensing module and a second region that does not overlap the sensing module, a W/L ratio of one of the transistors in the first region is greater than a W/L ratio of another of the transistors in the second region, the W/L ratio being obtained by dividing a width of a channel of the transistor by a length of the channel.
    Type: Application
    Filed: August 21, 2023
    Publication date: December 7, 2023
    Applicant: Samsung Display Co., Ltd.
    Inventors: Jin Woo PARK, Won Kyu KWAK, Dong Wook KIM, Hyun-Chol BANG
  • Publication number: 20230393694
    Abstract: A touch screen panel including a substrate having an effective area and a pad area, sensing electrodes disposed in the effective area, pads disposed in the pad area, wirings connecting the sensing electrodes and the pads, respectively, the wirings each having different lengths, and an electrostatic dispersion pad disposed adjacent to a sensing electrode disposed closest to the pad area among the sensing electrodes.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 7, 2023
    Inventors: In Cheol KIM, Il Ho LEE, Byoung Won CHOI, Jin Woo PARK
  • Patent number: 11835457
    Abstract: Disclosed is a fluorescent composition for whole blood analysis capable of predicting the diagnosis, treatment and prognosis of diseases through blood analysis. In the case of using the fluorescent composition of exemplary embodiments of the present invention for whole blood analysis, the shape of a target material such as red blood cells and white blood cells may be maintained as it is and non-target biomaterials and the like may be dissolved to increase the sensitivity and affinity to the target and improve the staining efficiency of the blood cell nucleic acids, thereby increasing the fluorescent efficiency. Therefore, more accurate blood cell analysis is possible than conventional techniques, and through this, it is possible to accurately predict not only the diagnosis of the disease, but also the treatment method and prognosis.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: December 5, 2023
    Inventors: Jin Woo Park, Kiwon Kim, HyungJun Yoon, Eunae Jeong, Hyejin Jin, Yoeseph Cho
  • Patent number: 11835865
    Abstract: An overlay measurement apparatus that can quickly measure an overlay error between layers with a large height difference is provided. The overlay measurement apparatus measures an error between a first overlay mark and a second overlay mark formed in a pair on different layers of a wafer. The overlay measurement apparatus includes an imaging system configured to acquire alignment images of a pair of first and second overlay marks at a plurality of focus positions, and a controller communicatively coupled to the imaging system. The overlay measurement apparatus can rapidly and accurately measure an overlay error between layers with a large height difference.
    Type: Grant
    Filed: May 10, 2023
    Date of Patent: December 5, 2023
    Assignee: AUROS TECHNOLOGY, INC.
    Inventors: Hyeon Gi Shin, Bo Kyung Ryu, Jung Sun Ko, Jin Woo Park