Abstract: The present invention provides fused heterocyclic derivatives represented by the general formula: wherein R1 represents H, halogen, OH, etc.; R2 represents H, halogen or an alkyl group; R3 and R4 represent H, OH, halogen, etc.; Q represents alkylene, etc.; ring A represents aryl or heteroaryl; and G represents , or pharmaceutically acceptable salts thereof, or prodrugs thereof, which exhibit an excellent inhibitory activity in human SGLT and are useful as agents for the prevention or treatment of a disease associated with hyperglycemia such as diabetes, postprandial hyperglycemia, impaired glucose tolerance, diabetic complications or obesity, pharmaceutical compositions comprising the same, and pharmaceutical uses thereof.

Abstract: The present invention provides pyrazole derivatives represented by the general formula: wherein R1 represents H, an optionally substituted C1-6 alkyl group etc.; one of Q and T represents a group represented by the general formula: or a group represented by the general formula: while the other represents an optionally substituted C1-6 alkyl group etc.; R2 represents H, a halogen atom, OH, an optionally substituted C1-6 alkyl group etc.; X represents a single bond, O or S; Y represents a single bond, a C1-6 alkylene group etc.; Z represents CO or SO2; R4 and R5 represent H, an optionally substituted C1-6 alkyl group etc.; and R3, R6 and R7 represent H, a halogen atom etc.

Abstract: A polishing pad (10) has an upper-layer pad (11) having a hole (11a) defined therein, a light-transmittable window (41) disposed in the hole (11a) for allowing light to pass therethrough, and a lower-layer pad (12) disposed below the upper-layer pad (11) and having a light passage hole (12a) defined therein which has substantially the same diameter as the hole (11a) in the upper-layer pad (11). A transparent film (13) with an adhesive agent applied to upper and lower surfaces thereof is interposed between the upper-layer pad (11) and the lower-layer pad (12). The hole (11a) defined in the upper-layer pad (11) and the light passage hole (12a) defined in the lower-layer pad (12) have substantially the same size as each other.

Abstract: To coat a solution on both surfaces continuously in such a state that an edge portion of the substrate is so constructed as to be fixed, and the substrate is attached to a substrate fixing frame having a positioning mechanism.

Abstract: A polishing apparatus has a polishing table having a polishing surface, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the polishing table, and a film thickness measuring device embedded in the polishing table. The film thickness measuring device includes a light source for applying light having a predetermined wavelength to a surface of the workpiece, a spectroscope for separating light reflected from the surface of the workpiece, and a charge coupled device array for capturing light separated by the spectroscope. The polishing apparatus also has a controller operable to analyze information captured by the charge coupled device array over the entire surface of the workpiece to obtain a film thickness at a desired point on the surface of the workpiece.

Abstract: A computer portion 201 of a printer includes a memory storing a printer driver software 201a and nozzle profile data 211. The printer driver software 201a includes a raster image processor (RIP) 203. When the RIP 203 receives document data 209, the RIP 203 converts the document data 209 into bitmap data 210 which is one dot/one bit data for 300 data/inch. Then, the nozzle data converting portion 204 converts the bitmap data 210 into driving data 212 based on the nozzle profile data 211. At this time, each bit of the bitmap data 210 is replaced by 16 bits. That is, the data amount is increased to 16 times of the bitmap data 210. Accordingly, fine control of ink ejection can be achieved.

Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

Abstract: The present invention provides pyrazole derivatives represented by the general formula: wherein R1 represents H, an optionally substituted C1-6 alkyl group etc.; one of Q and T represents a group represented by the general formula: or a group represented by the general formula: while the other represents an optionally substituted C1-6 alkyl group etc.; R2 represents H, a halogen atom, OH, an optionally substituted C1-6 alkyl group etc.; X represents a single bond, O or S; Y represents an optionally substituted C1-6 alkylene group etc.; Z represents —RB, —CORC etc. in which RB represents an optionally substituted C1-6 alkyl group etc.; and RC represents an optionally substituted C1-6 alkyl group etc.; R4 represents H, an optionally substituted C1-6 alkyl group etc.; and R3, R5 and R6 represent H, a halogen atom etc.

Abstract: A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal wire formed on the organic membrane. An arithmetic mean deviation Ra of the profile of the surface of the organic membrane where the metal wire is formed is not less than 60 nm and not more than 5×10?2 D, where D is the width of the metal wire. The contact angle with respect to water on the surface of the organic membrane where the metal wire is formed is not less than 110°.

Abstract: A recording head 200 has a plurality of nozzle orifices aligned in a row extending in a first direction. The recording head 200 is arranged with the nozzle orifices in confrontation with a recording medium P. The recording medium P is moved in a second direction B with respect to the recording head 200. Also, ink droplets ejected from the nozzle orifices are charged to a charged amount that corresponds to deflection amount of the ink droplets. The charged ink droplets are deflected in a direction perpendicular to a main scanning line. The plurality of ink droplets ejected from the plurality of nozzle orifices impinge on the same pixel position or at a nearby position so that it is possible to impinge multiple droplets at the same pixel position or a nearby position. As a result, it is possible to back up broken nozzles and to reduce recording distortion.

Abstract: A piezoelectric element is attached to a diaphragm via a relay member. A length of the relay member is shorter than the length of the piezoelectric element and longer than an active section in the piezoelectric element with respect to a direction orthogonal to a direction in which a plurality of nozzles are aligned. Also, a surface of the relay member that attached to the diaphragm has a width that is shorter than the piezoelectric element with respect to the direction in which the nozzles are aligned.

Abstract: An ink jet head includes: a pressure chamber that stores an ink and has an orifice; a filter plate including a through hole portion and a filter portion, the through hold portion disposed separately from the filter portion with a certain gap; a supply unit that supplies the ink through the filter portion to the pressure chamber; and a jetting unit that jets ink droplets through the orifice from the pressure chamber. The filter portion is formed to have a first aperture ratio. At least one through hole is formed on the through hole potion so that the filter portion has a second aperture ratio. The first aperture ratio is smaller than the second aperture ratio.

Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

Abstract: An inkjet recording device includes an ink reservoir that stores ink, a recording head having a plurality of nozzle holes for forming recording dots on a recording medium by ejecting ink particles from the plurality of nozzle holes onto the recording medium positioned opposite the plurality of nozzle holes, an ink channel for supplying ink from the ink reservoir to the recording head, ink discharging means for discharging ink from the recording head and the ink channel, evacuating means for creating a vacuum state in the recording head and the ink channel, and ink filling means for filling the evacuated recording head and ink channel with deaerated ink. The ink discharging means divides the recording head and the ink channel into a plurality of sections and independently discharges ink from each section of the recording head and the ink channel.

Abstract: An ink jet head includes: a chamber plate having a plurality of pressuring chambers formed therein for storing an ink; a vibrating plate bonded to the chamber plate; a housing having an ink flow path through which an ink is supplied into the pressuring chambers; an orifice through which an ink is ejected from the pressuring chambers; and a longitudinal vibration mode piezoelectric element for generating pressure under which an ink droplet is ejected through the orifice. A thickness of the vibration plate is from 5 &mgr;m to 10 &mgr;m.

Abstract: An orifice electrode/ink receiving member 11 is attached to an orifice plate 13 that is attached to a recording head module 10. An ink absorbing member 111 is embedded in a lower surface of the orifice electrode/ink receiving member 11. A recording ink droplet 14 ejected through an orifice 12 is deflected as needed by an angled electric field 85 and then impinges on a recording sheet 60 to form a recording dot 70. On the other hand, a refresh ink droplet 15 is deflected by the angled electric field 85 and impinges on the ink absorbing member 111 of the orifice electrode/ink receiving member 11 after flying in a U-turn path. In this configuration, the ink absorbing member 111 provided to the orifice electrode/ink receiving member 11 collects ink, so that there is no need to increase a gap between the recording head module 10 and the recording sheet 60 so much in order to dispose the ink absorbing member 111, preventing decrease in recording precision and paper jam.

Abstract: A polishing apparatus comprises a polishing table having a polishing surface and a top ring for holding a substrate to be polished, in which the substrate held by the top ring is pressed against the polishing surface of the polishing table and thus polished. A capacitance type sensor and/or an eddy-current type sensor is disposed in one or more location(s) in the vicinity of the top ring. The capacitance type sensor detects the escaping of the substrate to be polished based on a change in capacitance between the capacitance type sensor and a top surface of the polishing table. The eddy-current type sensor detects the escaping of the substrate to be polished based on a change in electrical resistance between the eddy-current type sensor and the top surface of the polishing table.

Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

Abstract: When ink droplets are ejected, angled or splashed where a plurality of minute ink droplets are generated, angled or splashed ink clings on an electrode 401, 402 and increases the amount of electric current conducted therethrough. Hence, the defectiveness of ink ejection can be detected by monitoring the amount of the electric current. When the defectiveness of ink ejection is detected, ejection data D is retrieved and updates the ejection data D based on a condition register S, and set to a defect register E. When the defect register E has only one element that takes a condition value of 1 indicating defectiveness, the corresponding nozzle is identified as defective. The restoring means reallocates dots, which have been originally allocated to the defective nozzle, to neighboring nozzle.

Abstract: A polishing apparatus has a polishing table having a polishing surface, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the polishing table, and a film thickness measuring device embedded in the polishing table. The film thickness measuring device includes a light source for applying light having a predetermined wavelength to a surface of the workpiece, a spectroscope for separating light reflected from the surface of the workpiece, and a charge coupled device array for capturing light separated by the spectroscope. The polishing apparatus also has a controller operable to analyze information captured by the charge coupled device array over the entire surface of the workpiece to obtain a film thickness at a desired point on the surface of the workpiece.