Patents by Inventor Yi Liu
Yi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240178977Abstract: Methods and apparatus of enhanced Physical Downlink Control Channel (PDCCH) candidate monitoring are disclosed. The method includes: receiving, by a receiver, configurations of a plurality of search space sets that are linked for a Physical Downlink Control Channel (PDCCH) transmission with a plurality of repetitions; wherein the plurality of repetitions of the PDCCH are transmitted on a plurality of linked candidates; determining, by a processor, whether there is a collision between at least one of the linked candidates and a reserved resource; and providing, by the processor, a candidate monitoring scheme in response to a determination that a first candidate of the linked candidates collides with the reserved resource.Type: ApplicationFiled: April 1, 2021Publication date: May 30, 2024Applicant: Lenovo (Beijing) LimitedInventors: Yi Zhang, Chenxi Zhu, Bingchao Liu, Wei Ling, Lingling Xiao
-
Publication number: 20240178102Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.Type: ApplicationFiled: April 21, 2023Publication date: May 30, 2024Inventors: Chun-Ti LU, Hao-Yi TSAI, Chiahung LIU, Ken-Yu CHANG, Tzuan-Horng LIU, Chih-Hao CHANG, Bo-Jiun LIN, Shih-Wei CHEN, Pei-Rong NI, Hsin-Wei HUANG, Zheng GangTsai, Tai-You LIU, Steve SHIH, Yu-Ting HUANG, Steven SONG, Yu-Ching WANG, Tsung-Yuan YU, Hung-Yi KUO, CHung-Shi LIU, Tsung-Hsien CHIANG, Ming Hung TSENG, Yen-Liang LIN, Tzu-Sung HUANG, Chun-Chih CHUANG
-
Publication number: 20240178536Abstract: A cross-coupling structure for dielectric cavity filters includes a base and a tuner. The base is communicated with plural resonant cavities, a side through hole and a blind hole, and has a first channel formed between two adjacent resonant cavities which are not used for producing cross-coupling, and a second channel the resonant cavities formed between two adjacent resonant cavities which are used for producing cross-coupling. The side through hole is penetrated through the base and communicated with the second channel. The blind hole is formed on a wall of the second channel and has an opening facing the side through hole. The tuner is entered into the second channel from the side through hole and extended into the blind hole and can be adjustably moved between the opening of the blind hole and the bottom of the blind hole to set a cross-coupling amount target value.Type: ApplicationFiled: November 30, 2022Publication date: May 30, 2024Applicant: Universal Microwave Technology, Inc.Inventors: TUNG-YI WU, SHENG-FENG YEH, WUN-KAI WU, SUNG-FAN LIU, CHIEN-CHIH LEE, JEN-TI PENG
-
Publication number: 20240178151Abstract: Embodiments disclosed herein include a package architecture. In an embodiment, the package architecture comprises a first substrate with a first fiducial mark on a surface of the first substrate. In an embodiment, the package architecture further comprises a second substrate over the first substrate, where the second substrate comprises glass and a second fiducial mark on the second substrate, and where a footprint of the second fiducial mark at least partially overlaps a footprint of the first fiducial mark.Type: ApplicationFiled: November 30, 2022Publication date: May 30, 2024Inventors: Minglu LIU, Alexander AGUINAGA, Gang DUAN, Jung Kyu HAN, Yosuke KANAOKA, Yi LI, Robin MCREE, Hong Seung YEON
-
Publication number: 20240177905Abstract: A gapless ferrite structure for circulator or isolator includes a first base having a first flange and a first limit slot surrounded by the first flange, a second base having a second flange and a second limit slot surrounded by the second flange, a ferrite with two ends accommodated in the first limit slot and the second limit slot respectively, two limit magnets installed on the first base and the second base respectively and configured to be corresponsive to the ferrite to generate an attraction force on the ferrite, and two sealing units configured between an end of the ferrite and the first limit slot and between the other end of the ferrite and the second limit slot respectively. In this way, a gapless structure can be formed on a signal transmission path in a circulator or isolator.Type: ApplicationFiled: November 30, 2022Publication date: May 30, 2024Applicant: Universal Microwave Technology, Inc.Inventors: TUNG-YI WU, SHENG-FENG YEH, WUN-KAI WU, SUNG-FAN LIU, CHIEN-CHIH LEE, JEN-TI PENG
-
Publication number: 20240178091Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.Type: ApplicationFiled: February 7, 2024Publication date: May 30, 2024Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
-
Publication number: 20240178150Abstract: A semiconductor device package structure is provided, including a redistribution structure, a first semiconductor device, a second semiconductor device, a bridge die, a first conductive bump, and a second conductive bump bumps, a third conductive bumps, and a first solder material. The first semiconductor device is disposed on a first side of the redistribution structure, the second semiconductor device and the bridge die are disposed on a second side opposite to the first side. The first conductive bump is disposed on the first semiconductor device, the second conductive bump is disposed on the second side of the redistribution structure and the third conductive bump is disposed on the second semiconductor device. The first solder material is electrically connected between the second conductive bump and the third conductive bump, and the redistribution structure is electrically connected between the first conductive bump and the second conductive bump.Type: ApplicationFiled: January 19, 2023Publication date: May 30, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tzuan-Horng LIU, Hao-Yi TSAI, Tsung-Yuan YU
-
Publication number: 20240177661Abstract: An array substrate is provided. The array substrate includes K number of reset signal lines respectively configured to provide reset signals to reset transistors in K columns pixel driving circuits of the array substrate. The K number of reset signal lines includes a plurality of third reset signal lines in (2k?1)-th columns of K columns, K and k being positive integers, 1?k?(K/2), and a plurality of fourth reset signal lines in (2k)-th columns of the K columns. A respective third reset signal line and a respective fourth reset signal line have different line patterns.Type: ApplicationFiled: September 17, 2021Publication date: May 30, 2024Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Tinghua Shang, Biao Liu, Siyu Wang, Yuge Chu, Yi Zhang
-
Publication number: 20240178417Abstract: A fuel supply apparatus for a fuel cell system, the apparatus comprising a fuel supply flow path by which fuel is supplied to an inlet of said fuel cell system, wherein the fuel supply flow path comprises a first branch, and a second branch arranged in parallel to the first branch; a fuel recirculation flow path by which residual fuel is transferred from an outlet of said fuel cell system to the fuel supply flow path, wherein the fuel recirculation flow path comprises a first branch and a second branch; a first ejector for introducing recirculated fuel from the first branch of the fuel recirculation flow path to the first branch of the fuel supply flow path; a second ejector for introducing recirculated fuel from the second branch of the fuel recirculation flow path to the second branch of the fuel supply flow path; a first valve for controlling flow at the second branch of the fuel supply flow path, and a second valve for controlling flow at the second branch of the fuel recirculation flow path, wherein theType: ApplicationFiled: April 8, 2021Publication date: May 30, 2024Inventors: Yi Liu, Jing Cheng, Yujie Bai
-
Publication number: 20240175324Abstract: The disclosure discloses a penetrating cushion damping device comprising a penetrator, and belongs to the field of in-situ penetrating exploration of extraterrestrial celestial bodies. A magnetic conductor encloses the non-penetrating end of the penetrator, a drag plate connected to the penetrator is provided at the lower end face of the magnetic conductor, and a magnetic source structure for generating magnetic force on the magnetic conductor is provided in the non-penetrating end of the penetrator. The disclosure utilizes the penetrating cushion anti-drag mode with the drag plate and the electromagnetic structure, which is self-adaptive to the flight penetration speed and compact in structure, reduces the jump probability, and further reduces the cushion resistance after the speed is reduced.Type: ApplicationFiled: December 21, 2022Publication date: May 30, 2024Inventors: XINJIAN WANG, YI ZUO, CHENG QIAN, ANLIN JIANG, LISHENG DENG, YUNYUN GUO, XIANDONG NIE, JIN LIU, PENG LU, YUEHAI CHEN, YUBIN YANG
-
Publication number: 20240174810Abstract: A modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration and hydrogenation of dicyclopentadiene phenolic resin.Type: ApplicationFiled: November 30, 2022Publication date: May 30, 2024Applicant: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chi-Lin Chen
-
Publication number: 20240174779Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, a spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene, a second resin including a polyphenylene ether resin modified by bismaleimide, and a SBS resin. The resin composition of the present disclosure can have a high glass transition temperature, a low dielectric constant and a low dissipation factor.Type: ApplicationFiled: January 3, 2023Publication date: May 30, 2024Applicant: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu, HungFan Lee
-
Publication number: 20240174897Abstract: A transparent heat resistive adhesive tape with antistatic performance and a method of use thereof are provided. The adhesive tape includes at least a transparent backing film layer, an electrically conductive transparent layer disposed on the backing film layer, and a transparent acrylic adhesive layer disposed on the electrically conductive transparent layer. The adhesive tape has heat resistivity and antistatic performance on an adhesive side of the tape while maintaining good optical transparency.Type: ApplicationFiled: March 28, 2022Publication date: May 30, 2024Inventors: Aizoh Sakurai, Ching-Yi Liu
-
Publication number: 20240174849Abstract: A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.Type: ApplicationFiled: November 30, 2022Publication date: May 30, 2024Applicant: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu
-
Patent number: 11997820Abstract: A cage assembly includes a cage body and an adjustable component, where the adjustable component is movably disposed on the cage body, the adjustable component has a connector-installing portion, and a position of the connector-installing portion is changed along with the adjustable component.Type: GrantFiled: August 11, 2022Date of Patent: May 28, 2024Assignee: WISTRON CORP.Inventors: Zih-Yao Liu, Shin-Yi Hsieh
-
Patent number: 11995796Abstract: A method of reconstruction of super-resolution of video frame includes inputting a first video frame with a first resolution and a plurality of consecutive frames thereof into a pre-trained super-resolution reconstruction network, and outputting, by the pre-trained super-resolution reconstruction network, a second video frame with a second resolution corresponding to the first video frame. The second resolution is higher than the first resolution. The super-resolution reconstruction network includes a feature extraction subnetwork, a spatial-temporal non-local alignment subnetwork, an attention progressive fusion subnetwork, and an up-sampling subnetwork which are connected in sequence.Type: GrantFiled: November 17, 2021Date of Patent: May 28, 2024Inventors: Dengyin Zhang, Chao Zhou, Can Chen, Junjiang Li, Zijie Liu, Yi Cheng
-
Publication number: 20240166641Abstract: The present disclosure provides compounds and pharmaceutically acceptable salt thereof, and methods of using the same. The compounds and methods have a range of utilities as therapeutics, diagnostics, and research tools. In particular, the subject compositions and methods are useful for reducing signaling output of oncogenic proteins.Type: ApplicationFiled: September 7, 2023Publication date: May 23, 2024Inventors: Liansheng Li, Xiuwen Zhu, Pingda Ren, Jonathan Deane, Lomon So, Yi Liu
-
Publication number: 20240164522Abstract: A retractable drawer divider includes a toothed plate telescopically arranged in a fixed plate and provided with two rows of first tooth parts arranged at intervals, wherein the toothed plate may be placed in at least a first state and a second state. A switch assembly for transitioning the toothed plate between the first and second state includes a locking block, a movable block, a pull rod and a button. The first state is an adjustable state in which the toothed plate can be freely extended and retracted, and the second state defines a fixed or locked state of the drawer divider. The drawer divider length can be adjusted easily and freely according to the size of the drawer environment, and in the locked state provides a snug fit between the divider and an inner wall of a drawer.Type: ApplicationFiled: November 20, 2023Publication date: May 23, 2024Inventors: Sandy A. Felsenthal, Michael Herndon, Yi Liu
-
Publication number: 20240166859Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture comprising styrene, divinylbenzene and ethylene, a second resin polymerized by modified dicyclopentadiene diamine and maleic anhydride, and a SBS resin. The resin composition of the disclosure may have a high glass transition temperature and a low dielectric constant and a low dissipation factor after curing.Type: ApplicationFiled: December 22, 2022Publication date: May 23, 2024Applicant: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu
-
Patent number: D1028971Type: GrantFiled: March 27, 2019Date of Patent: May 28, 2024Assignee: COMPAL ELECTRONICS, INC.Inventors: Hsing-Yi Kao, Ming-Chung Liu, Yu-Hsin Chen