Abstract: A ship navigation display system is set in a ship and includes a communications device, sensing device, first computing device, second computing device and wearable device. The communications device receives first coordinate information corresponding to a ship. The sensing device senses second coordinate information corresponding to a first ship around the ship. The first computing device is communicably connected with the communications device and calculates a collision probability according to the first and second coordinate information. When the collision probability is greater than a threshold value, the first computing device transmits a collision prediction signal. The second computing device receives the collision prediction signal and projects the second coordinate information corresponding to the first ship to a virtual coordinate in a virtual space.

Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.

Abstract: A data transmission method includes receiving, by first UE, bearer configuration information sent by a serving node; and performing, by the first UE, bearer configuration. A data transmission method, includes: sending, by a first base station, a sidelink (SL) data forwarding request to a second base station; and receiving, by the first base station, an SL data forwarding response sent by the second base station.

Abstract: The present application provides a battery module and an electric vehicle. The battery module includes a case, a longitudinal beam, and a tray. The case is provided with at least one exhaust port. The longitudinal beam is disposed in the case and is abutted against a bottom surface of the case to partition accommodating areas in the case on both sides of the longitudinal beam along a width direction. The tray is disposed in one of the accommodating areas and is configured to install a battery cell. A through hole opposite to an end of the battery cell is defined on the tray, the tray is spaced from the bottom surface of the case to define a pressure relief cavity, the through hole and the exhaust port are respectively communicated with the pressure relief cavity.

Abstract: A detection method for a malicious domain name in a domain name system (DNS) and a detection device are provided. The method includes: obtaining network connection data of an electronic device; capturing log data related to at least one domain name from the network connection data; analyzing the log data to generate at least one numerical feature related to the at least one domain name; inputting the at least one numerical feature into a multi-type prediction model, which includes a first data model and a second data model; and predicting whether a malicious domain name related to a malware or a phishing website exists in the at least one domain name by the multi-type prediction model according to the at least one numerical feature.

Abstract: A memory device and a method of operating a memory device are disclosed. In one aspect, the memory device includes a plurality of non-volatile memory cells, each of the plurality of non-volatile memory cells is operatively coupled to a word line, a gate control line, and a bit line. Each of the plurality of non-volatile memory cells comprises a first transistor, a second transistor, a first diode-connected transistor, and a capacitor. The first transistor, second transistor, first diode-connected transistor are coupled in series, with the capacitor having a first terminal connected to a common node between the first diode-connected transistor and the second transistor.

Abstract: An electronic device including a body and a receptacle connector is provided. The body has a side wall surface, a receptacle slot located at the side wall surface, a waterproof protrusion protruding from the side wall surface, and two gutters located at the side wall surface, where the waterproof protrusion is located above the receptacle slot, and the two gutters are respectively located at two opposite sides of the receptacle slot. The receptacle connector is disposed in the receptacle slot.

Abstract: A transistor includes a body of semiconductor material, where the body has laterally opposed body sidewalls and a top surface. A gate structure contacts the top surface of the body. A source region contacts a first one of the laterally opposed body sidewalls and a drain region contacts a second one of the laterally opposed body sidewalls. A first isolation region is under the source region and has a top surface in contact with a bottom surface of the source region. A second isolation region is under the drain region and has a top surface in contact with a bottom surface of the drain region. Depending on the transistor configuration, a major portion of the inner-facing sidewalls of the first and second isolation regions contact respective sidewalls of either a subfin structure (e.g., FinFET transistor configurations) or a lower portion of a gate structure (e.g., gate-all-around transistor configuration).

Abstract: A display panel is provided. The display panel includes a substrate, and a plurality of anodes, a pixel definition layer, a light-emitting layer, and a cathode layer that are laminated on the substrate. By collecting the anodes spaced apart from each other in a first direction in a same first pixel opening, number of the first pixel openings in the display area can be reduced, and number of ink droplets that can be sprayed within a single first pixel opening can be increased, so that a risk of bridging between adjacent ones of pixel openings can be lowered.

Abstract: Disclosed herein are memory device, method for program operations. In an aspect, a memory device comprises a memory configured to store a program code and a processor. The processor is configured to perform a first programming to a first cell of the memory device by incremental step pulse programming (ISPP) with a first step voltage. The processor is further configured to perform a second programming to a second cell of the memory device by ISPP with a second step voltage. The first step voltage is larger than the second step voltage. The first cell corresponds to a first target voltage and the second cell corresponds to a second target voltage. The first cell corresponds to a first target voltage and the second cell corresponds to a second target voltage.

Abstract: A method for data radio bearer management, the method including: transmitting a data radio bearer (DRB) setup request message to a wireless communication node; receiving a DRB setup response message from the wireless communication node, determining at least one DRB and at least one Quality of Service (QoS) flow mapped to the at least one DRB supported by the wireless communication node; and configuring the wireless communication node to support the at least one DRB and the at least one QoS flow.

Abstract: One or more embodiments described herein relate to selective methods for fabricating devices and structures. In these embodiments, the devices are exposed inside the process volume of a process chamber. Precursor gases are flowed in the process volume at certain flow ratios and at certain process conditions. The process conditions described herein result in selective epitaxial layer growth on the {100} planes of the crystal planes of the devices, which corresponds to the top of each of the fins. Additionally, the process conditions result in selective etching of the {110} plane of the crystal planes, which corresponds to the sidewalls of each of the fins. As such, the methods described herein provide a way to grow or etch epitaxial films at different crystal planes. Furthermore, the methods described herein allow for simultaneous epitaxial film growth and etch to occur on the different crystal planes.

Abstract: A subset of blocks from a set of blocks of a memory device are identified based on a valid data count constraint. A first block from the subset of blocks is selected based on a valid data count of the first block. A second block from the subset of blocks is selected based on a data temperature of the second block. A comparison of the first block and the second block is performed in accordance with one or more comparison criterion. The first block or the second block is selected as a garbage collection source block based on the comparison. Garbage collection is performed at the garbage collection source block.

Abstract: A memory device includes a memory array including a cell, and a controller coupled to the memory array. The controller is configured to control sequentially applying programming voltage pulses to the cell. A pulse width of each of the programming voltage pulses decreases as a pulse count of the programming voltage pulses increases.

Abstract: A light-emitting diode and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, an LED wafer is provided. The LED wafer includes a substrate and a light-emitting semiconductor stacking structure positioned on the surface of the substrate. The light-emitting semiconductor stacking structure includes a first type semiconductor layer, an active layer, and a second type semiconductor layer from a side of the substrate. Second, dicing lanes are defined on the upper surface of the LED wafer. Third, dicing is performed along the dicing lanes of the substrate using a laser. The laser is focused on the lower surface of the substrate to form a surface hole and focused inside the substrate to form an internal hole. The diameter of the surface hole is greater than the diameter of the internal hole. Fourth, the LED wafer is separated into LED chips along the dicing lanes.

Abstract: An antiferroelectric field effect transistor (Anti-FeFET) of a memory cell includes an antiferroelectric layer instead of a ferroelectric layer. The antiferroelectric layer may operate based on a programmed state and an erased state in which the antiferroelectric layer is in a fully polarized alignment and a non-polarized alignment (or a random state of polarization), respectively. This enables the antiferroelectric layer in the FeFET to provide a sharper/larger voltage drop for an erase operation of the FeFET (e.g., in which the FeFET switches or transitions from the programmed state to the erased state) relative to a ferroelectric material layer that operates based on switching between two opposing fully polarized states.

Abstract: A battery module and an electric vehicle are provided by the present application. The battery module includes a case body and at least one tray; at least one exhaust port is defined in the case body, at least one tray mounting cavity is defined in the case body, and the case body includes a first mounting surface surrounding a periphery of the tray; the tray is disposed in the tray mounting cavity to divide the tray mounting cavity into a cell accommodating cavity located above the tray and a pressure relief cavity located below the tray, the tray is provided with through holes facing battery cells, the pressure relief cavity is communicated with the through holes and the exhaust port, respectively, and the cell accommodating cavity is configured to accommodate the battery cells; the tray includes a second mounting surface, and the second mounting surface abuts against the first mounting surface.

Abstract: An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

Abstract: A laser glass doped with high concentration of mid-infrared fluoroindate and a preparation method thereof are provided in the present application, belonging to the technical field of luminescent glass. The laser glass doped with high concentration of mid-infrared fluoroindate includes the raw materials in parts by mole percentage: 27-38 parts of InF3, 13 parts of ZnF2, 10 parts of GdF3, 19 parts of BaF2, 5 parts of CaF2, 10 parts of SrF2, 5-15 parts of Al(PO3)3 and 1-11 parts of ErF3.

Abstract: Embodiments disclosed herein include electronic systems with vias that include a horizontal and vertical portion in order to provide interconnects to stacked components, and methods of forming such systems. In an embodiment, an electronic system comprises a board, a package substrate electrically coupled to the board, and a die electrically coupled to the package substrate. In an embodiment the die comprises a stack of components, and a via adjacent to the stack of components, wherein the via comprises a vertical portion and a horizontal portion.