Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract: To increase the yield of the separation process. To produce display devices formed through the separation process with higher mass productivity. A first layer is formed using a material including a resin or a resin precursor over a substrate. Then, first heat treatment is performed on the first layer, whereby a first resin layer including a residue of an oxydiphthalic acid is formed. Then, a layer to be separated is formed over the first resin layer. Then, the layer to be separated and the substrate are separated from each other. The first heat treatment is performed in an atmosphere containing oxygen.

Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.

Abstract: A method of bonding a device wafer to a carrier wafer includes disposing a first adhesive over a central portion of a carrier wafer, the first adhesive having a first glass transition temperature, disposing a second adhesive over a peripheral portion of the carrier wafer, the second adhesive having a second glass transition temperature greater than the first glass transition temperature, and bonding the first adhesive to an active front side of the device wafer and the second adhesive to a peripheral portion of the front side of the device wafer. Related assemblies may be used in such methods.

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

Abstract: An apparatus for removing a protective film for a flat display panel includes a laser oscillating member configured to be disposed over the protective film, the protective film attached to a surface of the flat display panel, the laser oscillating member configured to cut the protective film into a plurality of division regions by irradiating a laser beam; a separation member configured to peel at least one of the plurality of division regions from the flat display panel; a spacer member configured for insertion between the protective film and the at least one division region to be peeled from the flat display panel; and an adhesive member configured for attachment to a surface of the division region opposite the spacer member on the division region, the spacer member and the adhesive member being configured to move in a same direction.

Abstract: A semiconductor production apparatus includes a supporting substrate having an upper surface to which a semiconductor substrate is bonded and a lower surface to which a back side grinding (BSG) tape is bonded, a stage having an upper surface on which a peeling tape is positioned such that an adhesive surface of the peeling tape is oriented upwards, and a handler which transfers the supporting substrate to the stage in a state such that the BSG tape bonded to the lower surface of the supporting substrate is oriented downwards toward the stage and positioned onto the peeling tape. A peeling unit draws the peeling tape to peel the BSG tape from the lower surface of the supporting substrate.

Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.

Abstract: A label peeling machine is configured to one by one peel adhesive labels of a non-liner label having a number of adhesive labels stuck continuously so as to be overlapped while being shifted by a predetermined width. The non-liner label wound and held on a reel is placed on a carrier belt entrained about a first driven shaft, a second driven shaft, and a third driven shaft and is moved forward or backward. The label peeling machine includes a first sensor for causing the carrier belt to move backward, a second sensor for stopping the carrier belt, a peeling claw for engaging the non-liner label moving upward along the drive belt and peel the adhesive labels one by one, and a control apparatus configured to control a switch, the first sensor and the second sensor.

Abstract: A system for manufacturing a liquid crystal display device, includes peeling means that peels off a sheet piece of the polarizing film from a carrier film; take-up means that takes up the carrier film; bonding means that bonds the sheet piece to a panel; and velocity control means for controlling a feed velocity of the take-up means and a feed velocity of the bonding means in such a manner that: Vh(t)>Vs(t) during a period from the start of the process of bonding the sheet piece to the end of the bonding and that slack formed in the sheet piece being subjected to the bonding is eliminated between a front end of the peeling means and a position in which the bonding is performed by the bonding means; and that during a period from the start of the bonding process to the end of the bonding, L>Ls.

Abstract: The present invention relates to a polarizer film peeling machine and a polarizer film peeling method thereof. The polarizer film peeling machine includes an operation platform and a conveyor device having a translatable surface. The operation platform forms a slit at a site where a polarizer film is peeled off. The translatable surface of the conveyor device is located under the slit. In peeling off a polarizer film, a glass substrate from which the polarizer film is to be removed is set to slide on the a top surface of the operation platform to pass through the slit and the peeled-off polarizer film is guided through the slit to be laid flat on the translatable surface of the conveyor device and move with the translatable surface of the conveyor device.

Abstract: The present invention relates to a peeling device which peels off a reinforcing sheet stuck on a substrate, including: a supporting unit which supports one main surface of a laminate having the substrate and the reinforcing sheet; a plate-shaped flexible member to be attached to the other main surface of the laminate; a plurality of pads fixed to a surface of the flexible member lying opposite to the laminate side; a plurality of rods each of which is coupled to any one of the plurality of pads; a plurality of driving devices by which the plurality of rods are made to move, respectively, in their individual axial directions; and a control device by which a position of each of the plurality of rods is controlled on an individual basis, in which each of the plurality of pads is coupled to any one of the plurality of the rods via any one of a plurality of joints so that each pad is allowed to be pivotable centering on a vicinity of an intersection point of a centerline of the rod coupled thereto with a surface o

Abstract: A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.

Abstract: Apparatus, devices, systems and methods for removing automatically removing fixed carpeting such as glued down carpeting from spaces. The apparatus can include a motor powered winch having a hook end that can grip about a raised edge of the carpet. The winch can be anchored to a doorway by clamping ends of a telescopic bar to doorjamb members about the doorway opening. An operator can operate the winch by remote control and be spaced outside the room that the carpet is being removed from. Another version can include a U-shaped telescopic clamp arrangement so that the winch is also spaced outside the room from which the carpet is being removed.

Abstract: During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.

Abstract: New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.

Abstract: An automatic mask peeling apparatus 10 includes: a brushing apparatus 30 for removing solidified plugging slurry attached to the mask 24; an air injection apparatus 36 for injecting, after the removal of the solidified plugging slurry, air from the opposite end face-side of the one end face to raise a folded surplus part of the mask from the one end face; a mask peeling apparatus 50 for holding the part raised by the air injection apparatus 36 to peel the mask 24; and a carrying apparatus 55 for carrying a masked plugging honeycomb structure 200 from the brushing apparatus 30 to the mask peeling apparatus 50. This apparatus can be used to peel a mask 24 which has been used for plugging only the predetermined cells of a masked plugging honeycomb structure 200; the mask 24 having an area larger than the area of the end face of the structure.

Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.