Abstract: Optical components are aligned within an optoelectronic device using a composite adhesive material. An optical subassembly of the optoelectronic device includes a package housing, an optical component, and a composite adhesive that at least indirectly maintains the optical component in a predetermined position on a mounting surface within the package housing. The composite adhesive includes an adhesive substance, and a plurality of spacing elements intermixed in the adhesive substance. The spacing elements at least indirectly space the optical component from a designated surface of the package housing such that the component is positioned in the predetermined position.

Abstract: Embodiments of the invention generally provide an optical component configured to minimize reflectance. The component generally includes an optical housing having a bore formed therethrough, the bore having a central component receiving portion, and a glass block positioned in the component receiving portion in abutment with a fiber receiving bore. The component further includes a fuzzy mount secured in the central component receiving portion, the fuzzy mount being secured via a plurality of extending teeth formed on an outer surface thereof, the teeth being configured to engage an inner surface of the central component receiving portion to secure the fuzzy mount therein.

Abstract: A spacer tool system is used with an optoelectronic package to properly align an optical component within the device. The package includes a mounting surface, and an optical component positioned on the mounting surface at a predetermined distance from a reference point. The optical component is positioned at the predetermined distance by a spacer tool, wherein the spacer tool is interposed between the optical component and a spacer tool mount during optical component positioning. The spacer tool is of a length that corresponds with the predetermined distance between the optical component and the reference point.

Abstract: A input device comprises a navigation member, a light source, a sensor module, and a support structure. The navigation member includes a substantially spherical first portion and a second portion, the first portion extending outwardly from the second portion. The light source is configured to illuminate the first portion and the sensor module is configured to detect movement of the illuminated first portion to enable capture of user control inputs. The support structure includes a support surface configured to enable sliding rotational movement of the first portion relative to the sensor module in response to tilting movement of the second portion of the navigation member.

Abstract: An optical subassembly includes a housing and a port configured to be coupled to each other. Located within the housing is an opto-electronic device having an alignment error relative to a reference of the housing. Located within the port is an optical element having an alignment error relative to a reference of the port, such that an error vector and error angle associated with the optical element corresponds with an error vector and error angle associated with the opto-electronic device. The port is rotated relative to the housing such that a predetermined rotation of the port corresponds with substantial coaxial alignment of the optical element and the opto-electronic device.

Abstract: A slide pad membrane is provided. The slide pad membrane comprises an annular ring having an inner edge, a center portion having an outer edge, and a plurality of concentric annular ripples including an outer annular ripple connected to the inner edge of the annular ring and an inner annular ripple connected to the outer edge of the center portion.

Abstract: Embodiments of the invention generally provide an optical component configured to minimize reflectance. The component generally includes an optical housing having a device receiving end, a fiber receiving end, and an intermediate portion, wherein a bore connects the fiber receiving end to the device receiving end via the intermediate portion. The component further includes a split sleeve assembly press fitted into the intermediate portion, and a fiber stub press fitted into the split sleeve assembly, the fiber stub being positioned proximate a terminating end of the split sleeve.

Abstract: This disclosure generally concerns modules. In one example, a module includes a housing, a printed circuit board, and an optical subassembly. The housing has a first part and a second part, with the second part holding the printed circuit board and optical subassembly. The printed circuit board has a contact element located near one end of the printed circuit board. The optical subassembly includes a connector which has a free end. The free end of the connector and the contact element of the printed circuit board are pinched together when the first and second parts of the housing are joined, thus forming an electrical connection.

Abstract: A ferrule connector assembly includes a housing having a bore therethrough. The housing has a first end adapted to receive a sleeve assembly having a split sleeve and core member disposed in the split sleeve. A second end of the housing receives a ferrule containing an optical fiber. The core member has a hole extending therethrough that is optically aligned with the optical fiber. The sleeve assembly is press-fit within the bore of the housing and secured within the housing through one or more securing structures.

Abstract: An optoelectronic device that employs a composite adhesive to properly position optical components within the device is disclosed. In one embodiment, an optical subassembly is disclosed, comprising a package housing, an optical component, and a composite adhesive that at least indirectly maintains the optical component in a predetermined position on a mounting surface within the package housing. The composite adhesive includes an adhesive substance, and a plurality of spacing elements intermixed in the adhesive substance, wherein the spacing elements at least indirectly space the optical component from a designated surface of the package housing such that the component is positioned in the predetermined position.

Abstract: An optoelectronic package that employs a spacer tool system to properly align an optical component within the device is disclosed. In one embodiment, the package includes a mounting surface, and an optical component positioned on the mounting surface at a predetermined distance from a reference point. The optical component is positioned at the predetermined distance by a spacer tool, wherein the spacer tool is interposed between the optical component and a spacer tool mount during optical component positioning. The spacer tool is of a length that corresponds with the predetermined distance between the optical component and the reference point.

Abstract: An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature.

Abstract: Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.

Abstract: The principles of the present invention relate to aligning optical components with three degrees of translational freedom. A lens pin, a lens base, and a molded package are aligned in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized. The lens pin is mechanically coupled to the lens base to fix the position of the lens relative to the molded package in the first direction. Subsequently, the lens base and the molded package are realigned in the second and third directions such that the signal strength is again optimized. The lens base is mechanically coupled to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.

Abstract: A connector for interconnecting electronic components within a device, such as an optical transceiver module, is disclosed. In one embodiment the connector utilizes compressive engagement to electrically connect an optical subassembly to a printed circuit board within the optical transceiver. In one embodiment, the electrical connector includes a body that mechanically mounts on the printed circuit board. The body defines a plurality of slots, each having a first portion of a conductive finger positioned therein. The first portion of each finger is arcuately shaped and extends from the slot. The connector is positioned such that each finger compressively engages and electrically connects with a corresponding contact pad on the optical subassembly when the optical transceiver is assembled. A second portion of each finger extends from a face of the connector body and electrically connects with corresponding contact pads on the printed circuit board, electrically connecting it with the optical subassembly.

Abstract: A vaginal lubricant comprises (i) water, (ii) a DHEA salt, (iii) a polyether, and (iv) a lubricant. The pH of the vaginal lubricant is at least 5.6.

Abstract: Methods are disclosed for modulating brain damage mediated by non-NMDA ionotropic glutamate receptor antagonists, as topiramate, in conditions such as periventricular leukomalacia, cerebral palsy, mental retardation and neonatal stroke.

Abstract: A modular TOSA that is compatible with multiple optical fiber connector standards and a method of making the TOSA are presented. With the invention, a modular TOSA can be made compatible with different connector standards by switching the nose assembly while keeping the port assembly design and the adapter assembly design constant. The nose assembly that is compatible with the desired connector standard is selected from a group of nose assemblies, which are designed to be coupled with the same port assembly but having different connector standards.

Abstract: This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an optoelectronic assembly is provided that includes a TO package having a base through which one or more leads pass. The leads are electrically coupled to an optoelectronic device in the TO package, and are electrically isolated from the base. Some or all of the leads include a ground ring that is electrically isolated from the lead and electrically coupled with the base. A circuit interconnect is also included that is electrically coupled to the optoelectronic device and the TO package. The circuit interconnect includes a dielectric substrate having signal traces that are electrically coupled to the signal leads. A ground signal conductor disposed on the dielectric substrate is electrically coupled with the ground rings.

Abstract: A compact packaging assembly is disclosed. In one embodiment, the compact packaging assembly includes a header can and a header structure which can be actively aligned. The header can is configured to house a window and/or lens. The header structure includes an optical device, and, optionally, an active temperature control device. The packaging assembly can be connected to a nose assembly without requiring additional components to connect thereto.