Abstract: The present invention fiber composite components obtainable, for example, by impregnating fibers with a reactive polyurethane resin mixture of polyisocyanates, polyols, thermo-latent catalysts and optionally additives, and to a method for the production thereof.

Abstract: Dispersions of nanoparticles in a resin component are described. The nanoparticles have a multimodal particle size distribution including at least a first mode and a second mode. The number average particle diameter of the particles in the first mode is greater than the number average particle size distribution in the second mode. The use of multimodal nanoparticle size distributions and the relative number of particles in the first and second mode to reduce or eliminate particle stacking behavior is also described.

Abstract: A rim 58, 83 of a post cure inflator 60 can be changed in an easy and safety manner, while the amount of energy consumption is reduced. A inflator body 61 having the lower rim 58 can be located at a lower position, and the upper rim 83 can be moved downward to a lower position. Thus, the lower rim 58 and the upper rim 83 can be changed at the lower position in response to the change of the type of the tire to be manufactured, whereby the changing operation is made easy and safety. Further, the upper rim 83 moves upward. With this configuration, a vulcanized tire T having a heavy weight only moves in a front and rear direction while being supported by the inflator 61(lower rim 58), whereby the amount of energy consumption can be reduced easily.

Abstract: In some examples, a method for densifying a material via pitch comprises inserting the material to be densified into a mold, wherein the mold is part of an apparatus. The apparatus may include a ram configured to apply a ram pressure sufficient to force a pitch into the mold to densify the material, a gas source configured to apply a gas pressure sufficient to force the pitch into the mold to densify the material, and a vacuum source operable to create a vacuum pressure in the mold at least prior to application of either the ram pressure or the gas pressure. The method may further comprise densifying the material in the mold via pitch using a selectable one of the ram, the gas source, the ram and the vacuum source, or the gas source and the vacuum source.

Abstract: The synthetic resin moldings are molded pressing the bottom force 210 to the top force for feeding 103, followed by feeding the melted synthetic resin raw material to the opening portion 2101 of the bottom force 210 through said feeding path 1023 of the top force for feeding 103, thereby filling said synthetic resin in the cavity in the mold CT1 made up by closing the mold with this top force for feeding 103 and the bottom force 210, followed by pushing down the bottom force 210, and extending said synthetic resin raw material contained in said feeding path 1023 and tearing off at the portion X where the raw material has prescribed amount of resin blocks RX for molding, pushing up this bottom force 210 in which these torn resin blocks RX are placed and remained to the top force for molding 104, thereby closing the mold and compressing.

Abstract: A sulfur-containing material in a melt state is stored in material hopper 1 heated to a temperature within a preset temperature range of which a lower limit is equal to or above a melting point of sulfur. The stored sulfur-containing material is sucked by pressure generators 2a, 2b and pulled out into cylinders 11a, 11b heated to a temperature within the preset temperature range. The pulled out sulfur-containing material is pushed out from the cylinders under predetermined pressure applied by the pressure generator, and thereafter, the resultant material is injected from injection port 24 into mold 5 having therein a cavity which can be hermetically sealed and the mold being heated to a temperature within the preset temperature range. The injection port of the mold after the sulfur-containing material is fully injected in the cavity is closed. By stopping heating of the mold, the sulfur-containing material injected in the cavity is slowly cooled.

Abstract: A method comprising: a first process of placing a laminated rotor core in a preheating device to preheat the laminated core; a second process of removing the preheated laminated core from the preheating device and disposing the laminated core between upper and lower dies of a resin sealing apparatus; a third process of pressing the laminated core by the upper and lower dies and liquefying resin material in resin reservoir pots by heating; and a fourth process of ejecting the liquefied resin material from the pots into the magnet insertion holes by plungers inserted and moving vertically in the pots and thermally curing the resin material. The method improves efficiency of resin sealing the permanent magnets in the laminated core.

Abstract: A PET granule hopper and dryer (1) feeding an extruder (2). The extruder in turn via a rotary seal, feeds a metering wheel (3) on which there are metering devices. An injection-compression wheel (4) supporting injection-compression devices (5) is positioned after the metering wheel (3). If the installation is not designed for continuous feeding of a blower for converting the preformed into packagings, a perform cooler is provided, by means of a cooling wheel (6) equipped with a set of water-cooled devices (1) blowing air onto the performs before they are taken away for storage.

Abstract: A method comprising: a first process of placing a laminated rotor core in a preheating device to preheat the laminated core; a second process of removing the preheated laminated core from the preheating device and disposing the laminated core between upper and lower dies of a resin sealing apparatus; a third process of pressing the laminated core by the upper and lower dies and liquefying resin material in resin reservoir pots by heating; and a fourth process of ejecting the liquefied resin material from the pots into the magnet insertion holes by plungers inserted and moving vertically in the pots and thermally curing the resin material. The method improves efficiency of resin sealing the permanent magnets in the laminated core.

Abstract: A belt splicing apparatus includes: a mold including a cavity into which connecting end portions of a resin-made belt are inserted, opposing each other, to connect the end portions by using a bonding resin; a heating unit that heats a bonding resin to more than a flow starting temperature of the bonding resin; and a pressure maintaining unit. The pressure maintaining unit includes: a reservoir communicating with the cavity and maintaining the bonding resin in a fluid state; a pressure transmitting member that transmits pressure to the bonding resin in the fluid state; an urging unit that urges the pressure transmitting member; and an urging force adjusting unit that adjusts an urging force applied by the urging unit.

Abstract: Provided is an RTM molding method enabling to yield an FRP molded body formed so as to be increased in the fiber volume content and to thereby be made more excellent in strength and lightweightness. The resin composition is a chain-curing resin composition, and after the initiation of the curing of the resin composition, the highest temperature at the curing head of the resin composition, undergoing chain curing, within 10 seconds after the initiation of the curing is increased to be higher by 50° C. or more than the temperature of the resin composition at after the impregnation and before the curing, and thus, the resin composition is chain-cured with a Vf of 41% or more.

Abstract: According to one embodiment of the present invention a method of creating a composite with an object having a central axis is provided which comprises wrapping a first fabric layer around the object in one of a clockwise or a counterclockwise direction around the central axis of the object. A second fabric layer is wrapped over the first fabric layer. The second fabric layer is wrapped around the object in the other of the clockwise or the counterclockwise direction around the central axis. The object is placed in a mold and resin is injected into the mold to form the composite.

Abstract: A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The pre-formation of the film allows materials to be used that are not suitable for use with prior art methods.

Abstract: The invention relates to a method of manufacturing a composite turbomachine blade, the method comprising the following steps: a) making a preform by three-dimensionally weaving yarns including tracer yarns disposed at least at the surface of the preform; b) cutting out said preform so as to leave intact a series of tracer yarns situated along a reference face of the preform; c) pre-deforming said cut-out preform; d) compacting and stiffening said pre-deformed preform; e) providing an injection mold in which said stiffened preform is placed; f) heating said injection mold; g) injecting a binder into said injection mold, the binder comprising a thermosettable resin; and h) extracting from the mold a composite molded part presenting substantially the shape and the dimensions of said blade. The invention is applicable to a making fan blade.

Abstract: A method for the production of elastomer and duromer molded items in an injection molding process using an injection molding machine with a respectively separately heatable filling unit, injection unit and cross-linking tool. The filling unit is heated to a temperature which is non-critical with regard to the cross-linking reaction of the plastic to be treated. The injection unit is heated to a temperature which is slightly below the cross-linking temperature of the molding material used.

Abstract: Disclosed is an apparatus for separating culls coupled to a lead frame when a semiconductor chip is molded. The apparatus includes a lower plate, on which culls coupled to a lead frame are placed, an upper plate pressing culls placed on the lower plate in order to separate culls from the lead frame, a pilot pin installed in the upper plate by passing through the upper plate in order to press culls together with the upper plate when the upper plate presses the culls, and a sensor unit installed adjacent to the movement path of the pilot pin so as to detect a movement of the pilot pin. When culls are separated, faults of articles caused by a molding material insufficiently filled in a mold are checked through detecting a movement of the pilot pin.

Abstract: According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that includes a first non-planar surface and a second mold plate that includes a second non-planar surface. The first and second non-planar surfaces form upper and lower surfaces of a mold cavity when the first and second mold plates are engaged. The mold tool also includes a distribution system coupled to the mold cavity. The distribution system transfers a mold compound into the mold cavity to substantially encapsulate an integrated circuit. The distribution system includes a gate runner coupled to the mold cavity. The gate runner funnels the mold compound into the mold cavity. The distribution system also includes a bridge insert that decreases wear on the gate runner as the mold compound is transferred through the gate runner.

Abstract: Resin or pitch is melted in a melt blender apparatus (11) and then loaded, into a heated jacketed holding tank (12). A pair of feed lines (14, 16) receives resin from the holding tank (12) and feeds an upper gear pump (15) and a lower gear pump (17). A mixing enhancement such as a static mixer (18, 19) is located in each of the feed lines (14, 16) between the gear pumps (15, 17) and the resin delivery ends (25, 26) of the feed lines. The resin-melt feed lines may be equipped with pressure indicators (27, 28, 32, 34) and pressure relief valves (23, 24). The resin-melt feed lines may also be equipped with pump accumulators (31, 33). Resin melt pressure created by the gear pumps (15, 17) forces a piston inside the accumulator back to the desired position. The accumulators (31, 33) can also be used to maintain constant pressure in the feed stock. Resin can be recycled from the accumulators (31, 33) into the melt blender (11).

Abstract: The present invention relates to an apparatus for producing solid active ingredient-containing forms from an active ingredient-containing formulation which comprises at least one polymeric binder. The apparatus according to the invention has at least one extruder 1 for continuous plastication of the formulation and at least two injection units 2 which are provided separate from one another, each of which is connected to the extruder 1, and through which the formulation can be injected into at least one mold 3.

Abstract: A blow-molded decorative article is disclosed which comprises a plurality of different polymers having different melt flow rates that cause inter-dispersion of the polymers upon blow-molding. The article is blow-molded from a multiple layer parison that a plurality of layers of like polymers, i.e., polyethylenes, polypropylenes, polystyrenes, etc., that have different melt flow rates and different colors. As a result in the differences in the melt flow rates, the polymers of the various layers mix upon blow-molding to create the look of a glazed ceramic pottery or an exterior pattern such as a tie-dyed marbleized or camouflaged pattern.

Abstract: Resin or pitch is melted in a melt blender apparatus (11) and then loaded, into a heated jacketed holding tank (12). A pair of feed lines (14, 16) receives resin from the holding tank (12) and feeds an upper gear pump (15) and a lower gear pump (17). A mixing enhancement such as a static mixer (18, 19) is located in each of the feed lines (14, 16) between the gear pumps (15, 17) and the resin delivery ends (25, 26) of the feed lines. The resin-melt feed lines may be equipped with pressure indicators (27, 28, 32, 34) and pressure relief valves (23, 24). The resin-melt feed lines may also be equipped with pump accumulators (31, 33). Resin melt pressure created by the gear pumps (15, 17) forces a piston inside the accumulator back to the desired position. The accumulators (31, 33) can also be used to maintain constant pressure in the feed stock. Resin can be recycled from the accumulators (31, 33) into the melt blender (11).

Abstract: Molding material consisting of resin coated reinforcing fibers in a molten mass of resin and fibers is prepared at a molding site for controlled supply to a molding machine. A conveying device, such as a pair of pinch rollers, serves to pull fibers from supply spools through guide orifices of a coating die having a chamber within which the fiber is coated with molten resin. Further impregnation of the fibers with resin takes place in the conveying device, which also develops pressure on its output side serving to push the mass of hot resin and fiber into a receiving device for movement to a molding machine. The receiving device may be the feed screw for an injection molding machine or simply a plate movable to and from a compression molding machine. The fibers may be cut into predetermined lengths by a cutting device positioned downstream of the aforesaid conveying device.

Abstract: The invention relates to compression injection plastic molding using a repository space, for the temporary storage of the molding material melt to prevent structural faults and reduce workpiece costs. The molten molding material is first fed into the repository space, whose volume corresponds to the volume of the mold cavity. When the injection process starts, the bottom of the piston aligns with the edge of the repository space and with the wall of the mold cavity so that a small amount of molding material melt reaches the mold cavity directly. The piston then slides into the cylinder. The repository space, which continuously becomes larger, is filled with a melted material at almost no pressure. The melt is conveyed into the plastic core until tho supply of the melted molding material is ended. The piston is then retracted, and the mold cavity is thus completely filled with molding material.

Abstract: An injection molding apparatus includes a vessel, mold, pusher, and thrust providing section. The vessel stores a molding material and has a nozzle hole which is formed in the bottom portion to inject the molding material and a first seal surface formed around the nozzle hole. The mold is made up of stacked members stacked on the lower side of the vessel and is filled with the molding material injected from the vessel. The mold has a sprue communicating with the nozzle hole and a second seal surface formed around the sprue. The stacked members respectively have third seal surfaces at portions where the members are in contact with each other. The pusher pressurizes the molding material in the vessel. The thrust providing section provides a thrust to the pusher to pressurize one of the pusher and the mold through the molding material in the vessel.

Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.

Abstract: A method for the multi-component injection molding of plastic parts, in which at least two different plastic components are injected into an injection molding tool to form a plastic part, the method comprising the following steps: a) introducing a first plastic component into a melt accumulation chamber, which is bounded by a piston-like end section; b) subsequently introducing a second plastic component into the melt accumulation chamber; c) transferring plastic melt accumulated in the melt accumulation chamber into the injection molding tool. In one embodiment the pressure conditions in the cavity region are homogenized. For this purpose the invention specifies that, when the plastic melt is transferred in accordance with the above step c), the piston-like end section of the melt accumulation chamber is moved in such a way that it forms part of the cavity wall of the injection molding tool.

Abstract: A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The pre-formation of the film allows materials to be used that are not suitable for use with prior art methods.

Abstract: A molding apparatus and molding method are provided for molding of small objects from a thermoplastic elastomer. The apparatus includes a heated transfer plate assembly, an insulation plate assembly adjacent the transfer plate assembly and a cooled cavity plate assembly. The transfer plate assembly is heated sufficiently to maintain a thermoplastic elastomer in a molten state. The cavity plate assembly is cooled sufficiently to solidify a thermoplastic elastomer injected into cavities of the cavity plate assembly.

Abstract: A hydrostatic injection molding apparatus and process are provided for thermoplastic materials, especially thermoplastic elastomers. The apparatus includes a hot pot plate with a transfer chamber for receiving a thermoplastic material. The hot pot plate is heated to maintain the thermoplastic material in the transfer chamber in a molten state. A cavity plate is positioned adjacent the transfer pot plate, the cavity plate is formed with a plurality of cavities extending therein. Gates are formed in the hot pot plate and the cavity plate. The gates in the respective plates register with one another to provide communication between the transfer chamber and the cavities. The cavity plate is cooled to enable a rapid curing of the thermoplastic material therein.

Abstract: A semiconductor chip mounted on a lead frame is sealed in a synthetic resin package through a molding process, and pressure is applied to synthetic resin softened from granular. synthetic resin so as to evacuate the air from the synthetic resin before injecting the synthetic resin into cavities formed in a molding die, thereby preventing the synthetic resin package from void.

Abstract: An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot. A top mold unit is clamped to the bottom mold unit.

Abstract: An apparatus to actuate an injection element (1) for injecting a defined quantity of plasticized plastic or the like into an injection molding tool. The injection element (1) is designed as a piston or as a screw and is guided in a guide (2) and moved by an actuation element. The actuation element (3) has a tappet (4), which is guided on a crank plate (5), the crank plate (5) being turned with positional accuracy by a controlled or regulated servomotor (6). The invention provides that, for the return stroke of the injection element (1), a second tappet (7) is present, which is actuated by a second crank plate (8).

Abstract: Flowable reaction components of a reaction mixture which form solid or foamed material comprising filling material are transported from a storage container to a high-pressure mixing head in pressure stages by the use of gear pumps connected in series without major wear of the gear pumps.

Abstract: An improved elastomeric mold for use in fabricating microstructures, the mold having first and second surfaces, the first surface including at least one recessed microchannel and the second surface including an access opening or filling member that extends through the mold to the first surface and communicates with the recessed microchannel. The mold is used by placing it onto a substrate with the recessed microchannel facing the substrate. The access opening of the mold is filled with a liquid material which is capable of solidifying. The access opening continuously introduces the liquid material into the space defined between the microchannel and the substrate. After the liquid material solidifies, the mold is removed from the substrate thereby leaving a microstructure formed from the solidified liquid material on the substrate.

Abstract: A semiconductor chip mounted on a lead frame is sealed in a synthetic resin package through a molding process, and pressure is applied to synthetic resin softened from granular synthetic resin so as to evacuate the air from the synthetic resin before injecting the synthetic resin into cavities formed in a molding die, thereby preventing the synthetic resin package from void.

Abstract: An improved mold system (20) is provided. The mold system (20) includes a mold (30) having a mold cavity (28). A pot (22) is connected to the mold cavity (28) through a boomerang runner system (24). The boomerang runner system may include a boomerang passage (25) having an inner curvilinear surface (44) and an outer curvilinear surface (42).

Abstract: An apparatus for encapsulating with plastic lead frames carrying chips includes mutually movable halves. In the closed position the movable halves bound a mold cavity for receiving a lead frame, a feed runner connecting onto the mold cavity for supplying encapsulating material, a pot for receiving an encapsulating material and a plunger reciprocating in the pot, connected onto said feed runner for carrying up encapsulating material under pressure. At a distance from a head end of the plunger a peripheral groove is arranged which is connected to the head end by at least one flow channel. The outer wall of the plunger is provided with helically running grooves and the depth of the grooves increases as seen from the drive side of the plunger.