Abstract: A method of making semiconductor packages includes providing a first lead frame having a first plurality of semiconductor dies arranged along a first longitudinal axis, each of the first plurality of semiconductor dies having a first number of metal contacts; providing a second lead frame having a second plurality of semiconductor dies arranged along a second longitudinal axis, each of the second plurality of semiconductor dies having a second number of metal contacts, the second number of metal contacts different than the first number of metal contacts; and covering the first plurality of semiconductor dies in a first mold using a common semiconductor die cavity; covering the second plurality of semiconductor dies in a second mold using the common semiconductor die cavity.

Abstract: A golf club head with a face component having a variable thickness and a coating on a rear surface of the face component that provides a flat surface to which a medallion can be affixed, and methods of manufacturing such golf club heads, are disclosed herein. The coating is made from a fill material comprising a polymer and a plurality of microscopic bubbles, which preferably constitute 5-70% of the volume of the fill material. The polymer material preferably is a polyurethane having a Poisson's ratio of 0.40-0.50.

Abstract: The invention relates to a composition comprising mica and glass, said glass comprising: 10 to 30 mol % of SiO2 5 to 40 mol % of BaO 15 to 30 mol % of B2O3, the sum of the concentrations of zinc oxide, alkali metal oxide and alkaline earth oxide in the glass extending from 15 to 65 mol %. This composition is intended to be molded at a temperature above the Tg of the glass so as to form composite parts that can serve as an electrical insulator.

Abstract: A rim 58, 83 of a post cure inflator 60 can be changed in an easy and safety manner, while the amount of energy consumption is reduced. A inflator body 61 having the lower rim 58 can be located at a lower position, and the upper rim 83 can be moved downward to a lower position. Thus, the lower rim 58 and the upper rim 83 can be changed at the lower position in response to the change of the type of the tire to be manufactured, whereby the changing operation is made easy and safety. Further, the upper rim 83 moves upward. With this configuration, a vulcanized tire T having a heavy weight only moves in a front and rear direction while being supported by the inflator 61(lower rim 58), whereby the amount of energy consumption can be reduced easily.

Abstract: In some examples, a method for densifying a material via pitch comprises inserting the material to be densified into a mold, wherein the mold is part of an apparatus. The apparatus may include a ram configured to apply a ram pressure sufficient to force a pitch into the mold to densify the material, a gas source configured to apply a gas pressure sufficient to force the pitch into the mold to densify the material, and a vacuum source operable to create a vacuum pressure in the mold at least prior to application of either the ram pressure or the gas pressure. The method may further comprise densifying the material in the mold via pitch using a selectable one of the ram, the gas source, the ram and the vacuum source, or the gas source and the vacuum source.

Abstract: A method is described that allows a first mobile device to persistently lock onto a second mobile device, thereby allowing the first mobile device to not only constantly monitor the dynamic location of the second mobile device but also to adaptively navigate in real-time to the dynamic location associated with the second mobile device. The dynamic location may include a current location of the second mobile device or a final destination for travel of the second mobile device.

Abstract: A method is described that allows a first mobile device to persistently lock onto a second mobile device, thereby allowing the first mobile device to not only constantly monitor the dynamic location of the second mobile device but also to adaptively navigate in real-time to the dynamic location associated with the second mobile device. The dynamic location may include a current location of the second mobile device or a final destination for travel of the second mobile device.

Abstract: A resin molten in a pot portion 59 is molded by being loaded via a gate 48 into a cavity, which has a rectangular parallelepiped shape in plan view and is formed of both molds 1 and 2, which are a second mold 2 and a first mold 1 that can make or release contact with the second mold 2. The pot portion 59 is provided at either one of the molds 1 and 2 and constituted of recess portions 54c located at prescribed intervals at the cavity. The recess portions 54c have a bottom surface constituted of part of a moving member 60 movable toward an opening portion. The gate 48 is structured so that one side of the cavity and the long side of the pot portion 59 are connected with each other.

Abstract: A PET granule hopper and dryer (1) feeding an extruder (2). The extruder in turn via a rotary seal, feeds a metering wheel (3) on which there are metering devices. An injection-compression wheel (4) supporting injection-compression devices (5) is positioned after the metering wheel (3). If the installation is not designed for continuous feeding of a blower for converting the preformed into packagings, a perform cooler is provided, by means of a cooling wheel (6) equipped with a set of water-cooled devices (1) blowing air onto the performs before they are taken away for storage.

Abstract: A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The pre-formation of the film allows materials to be used that are not suitable for use with prior art methods.

Abstract: The invention mainly concerns a method for making a composite RTM part (23) which consists in producing a dry fibrous preform (8) by inserting in said dry preform (8) composite parts (10, 11) made of prepregs. Said parts, pre-impregnated with a first resin, are partly polymerized. The assembly is placed in a mold (16). A second resin is injected into the mold and impregnates the dry fibers (7). The two resins are polymerized simultaneously. The partial polymerization of the pre-impregnated parts (10, 11) results in a good chemical bonding between the two resins. The pre-impregnated parts (10, 11) have better mechanical properties, in particular in compression, than RTM parts. This is particularly due to a better alignment of the fibers (12) in the direction of stresses, and to a higher fiber volume ratio. The final component (23), reinforced with pre-impregnated parts, has better mechanical properties than the same RTM component without pre-impregnated reinforcements, in particular in compression.

Abstract: The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point outside of the area of the finished package, but within the dam bars, so that the leadframe space acts as a virtual gate. This reduces the need for trimming and lowers stress on the finished package.

Abstract: A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the molds. To reduce the level of dust which enters the molding region, the path along which the leadframe items are conveyed to the molding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the molding region under a cover including a vacuum source, so that the dust is continually sucked away from them.

Abstract: Disclosed are a resin material supply apparatus and a method thereof ensuring a predetermined amount of resin material to be supplied and the molding quality to be improved without the need of storing many types of tablets or managing products by separation of damaged ones or by other methods.

Abstract: A method and apparatus for encapsulating a microelectronic substrate. In one embodiment, the apparatus can include a mold having an internal volume with a first portion configured to receive the microelectronic substrate coupled to a second portion configured to receive a pellet for encapsulating the microelectronic substrate. A plunger moves axially in the second portion to force the pellet into the first portion and around the microelectronic substrate. The pellet has overall external dimensions approximately the same as a conventional pellet, but has cavities or other features that reduce the volume of the pellet and the amount of pellet waste material left after the pellet encapsulates the microelectronic substrate. Accordingly, the pellet can be used with existing pellet handling machines. The mold and/or the plunger can have protrusions and/or other shape features that reduce the size of the first portion of the internal volume.

Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101.

Abstract: An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot. A top mold unit is clamped to the bottom mold unit.

Abstract: A ceramic fiber band that can fulfill a plurality of functions in connection with the injection and/or extrusion process of an injection molding or extrusion apparatus (i.e. heat, cool, and insulate), thereby reducing overall energy costs and creating a safer working environment. The ceramic band, being an insulator and having heating and/or cooling elements with a faster response contained therein, exert the desired heating/cooling effect upon the barrel portion of the injection/extrusion machine thereby raising, lowering, or maintaining the temperature of the fluid plastic compound passing through the barrel.

Abstract: An apparatus to actuate an injection element (1) for injecting a defined quantity of plasticized plastic or the like into an injection molding tool. The injection element (1) is designed as a piston or as a screw and is guided in a guide (2) and moved by an actuation element. The actuation element (3) has a tappet (4), which is guided on a crank plate (5), the crank plate (5) being turned with positional accuracy by a controlled or regulated servomotor (6). The invention provides that, for the return stroke of the injection element (1), a second tappet (7) is present, which is actuated by a second crank plate (8).

Abstract: Method for implementing a multi-phase plastic package for electronic components, and packaged electronic components produced according to the method. The present invention contemplates the use of molding compounds having two or more discrete phases in a transfer molding process wherein a temperature differential is induced between the electronic component to be packaged and the mold of the molding apparatus prior to molding. Each of the molding compound phases, when used in a current transfer molding apparatus, generates a separate layer in the resultant package, and each of the resultant layers possesses certain unique properties. In its simplest implementation, the present invention provides a two-phase molding compound pellet which provides an outer layer containing mold release compounds to facilitate release of the completed packaged device from the mold, and an inner layer without mold release agents. Other implementations include multiple layers.

Abstract: A band-like raw material which becomes a contact plate is supplied to a position between an upper mold and a lower mold as these molds are closed, a convex part for the contact with the lower mold is engaged with a concave part for contact with the upper mold, by which, simultaneously punching out the contact part onto a part of the band-like raw material, the band-like raw material is cut to a predetermined length between edge parts to form the contact plate. At this time, a tip of a press pin on which the concave part is formed is brought into direct contact with a central part of the band-like raw material. A resin is injected into the mold cavities to form a push rod integrally with the contact plate, and the central part of the contact plate is deformed in the concave part to provide a stopgap.