Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.

Abstract: Provided is a use of a mitoxantrone hydrochloride liposome in the preparation of a drug for treating urothelial cancer, breast cancer, and bone and soft tissue sarcoma. Further provided is a method for treating urothelial cancer, breast cancer, and bone and soft tissue sarcoma, and the method is to administer a therapeutically effective amount of mitoxantrone hydrochloride liposomes to a patient in need. The mitoxantrone hydrochloride liposome can effectively treat urothelial cancer, breast cancer, and bone and soft tissue sarcoma, and compared with common mitoxantrone hydrochloride injections, the mitoxantrone hydrochloride liposome has better therapeutic effect and fewer adverse reactions.

Abstract: A method of wireless communication is performed by a user equipment (UE). The method receives, from a network, a configuration for a decision making module. The method also executes the decision making module to determine a selection parameter for a configuration of at least one machine learning module. The method selects the configuration of the at least one machine learning module based on the selection parameter. Further, the method reports, to the network, a decision resulting from executing the decision making module.

Abstract: Disclosed are example embodiments of methods, apparatuses and systems supporting beam diversity for multimedia broadcast multicast services. A method may comprise receiving information of one or more beams and abeam-specific repetition pattern for at least one of the one or more beams for transmission of a service from a network device, and receiving the service on the at least one of the one or more beams based on the beam-specific repetition pattern.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive, from a network node, a configuration of a beam prediction model that is trained to predict beam measurements for a set of beams. The UE may receive, from the network node, an indication of a subset of beams, from the set of beams, that are to be associated with a measurement report. The UE may transmit, to the network node, the measurement report indicating one or more predicted beam measurements that are based at least in part on an output of the beam prediction model, the output of the beam prediction model including beam predictions associated with the set of beams, and the one or more predicted beam measurements including information associated with the subset of beams. Numerous other aspects are provided.

Abstract: The invention provides CCL14 antibodies.

Abstract: This disclosure provides systems, methods, and apparatuses, including computer programs encoded on computer storage media, for wireless communication, including techniques for sidelink resource allocation and communication. In some aspects, a user equipment (UE) may receive from a base station a single message that indicates a first transmission opportunity for transmission of information from the UE to a second UE and that indicates one or more additional transmission opportunities for at least one subsequent transmission of information from the UE to the second UE. The UE may transmit the information to the second UE in the first transmission opportunity. The UE may also retransmit the information to the second UE in at least one of the one or more additional transmission opportunities responsive to the transmission of the information in the first transmission opportunity being unsuccessful. Other aspects and features are also claimed and described.

Abstract: A power dividing and combining device comprising a resonance body, a plurality of circuit boards, an upper cover and a lower cover is provided. The resonance body comprises a solid conductive body, a plurality of first dividing elements, a plurality of second dividing elements, a signal-receiving end and a signal-transmitting end. The solid conductive body has a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connecting the first surface and the second surface. The first dividing elements are disposed on the first surface and separate a plurality of first resonance channels on the first surface. The first resonance channels intersect at a first common region on the first surface. The second dividing elements are disposed on the second surface and separate a plurality of second resonance channels on the second surface. The second resonance channels intersect at a second common region on the second surface.

Abstract: A computing device includes a processor and a medium storing instructions. The instructions are executable by the processor to: in response to a receipt of an electronic request comprising one or more structured data fields and one or more unstructured data fields, identify a set of previous electronic requests using the one or more structured data fields of the received electronic request; train a probabilistic classification model using at least one structured data field of the identified set of previous electronic requests; execute the trained probabilistic classification model using the one or more unstructured data fields of the received electronic request; and automatically select a request handler using an output of the executed probabilistic classification model.

Abstract: In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.

Abstract: The present disclosure provides a method for testing an internal force increment of an arch bridge suspender by inertial measurement, including the following steps: (1) selecting a suspender to be tested with internal force increment, and mounting an acceleration sensing device or a speed sensing device at a lower edge of the suspender to be tested; (2) setting an appropriate sampling frequency and collecting signals; (3) processing information data collected in step (2) by using Formulas; and (4) recording a result of the information data processing and obtaining the internal force increment of the suspender. The method can obtain the internal force increment of the suspender by collecting acceleration or speed signals of the lower edge of the suspender and performing calculation from the signals. This method has the advantages of simple and convenient testing, high replicability and low test cost.

Abstract: A method for generating an image of an object with a magnetic resonance imaging (MM) system is presented. The method includes first performing a calibration scan of the object. The calibration scan is performed with a zero echo time (ZTE) radial sampling scheme to obtain calibration k-spaces for surface coil elements and a body coil of the MRI system. The calibration scan is performed in such a manner that the endpoints of calibration k-space lines in each calibration k-space follow a spiral path. A plurality of calibration parameters are then obtained from the plurality of calibration k-spaces. A second scan of the object is then performed to acquire the MR image data. The image of the object is then generated based on the plurality of calibration parameters and the MR image data.

Abstract: A chip package includes a substrate, a semiconductor chip, and a thermal conductive structure. The chip package includes a first and a second support structures below the thermal conductive structure. The first and the second support structures connect the substrate and corners of the thermal conductive structure. The thermal conductive structure has a side edge connecting the first and the second support structures. The first and the second support structures and the side edge together define of an opening exposing a space surrounding the semiconductor chip. The first and the second support structures are disposed along a side of the substrate. The first support structure is laterally separated from the side of the substrate by a first lateral distance. The side edge of the thermal conductive structure is laterally separated from the side of the substrate by a second lateral distance different than the first lateral distance.

Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: The present disclosure describes ultrasound imaging systems and methods for ultrasonically inspecting biological tissue. An ultrasound imaging system according to the present disclosure may be configured to automatically apply tissue-specific imaging parameter settings (312, 314) based upon the automatic identification of the type of tissue being scanned. Tissue type identification (315) may be performed automatically for the images in the live image stream (304) and thus adjustments to the imaging settings may be applied automatically by using a neural network (320) and thus dynamically during the exam obviating the need for the sonographer to manually switch presets or adjust the imaging settings when moving to different portion of the anatomy.

Abstract: The disclosure discloses a method for generating a conversation, an electronic device, and a storage medium. The detailed implementation includes: obtaining a current conversation and historical conversations of the current conversation; selecting multiple reference historical conversations from the historical conversations and adding the multiple reference historical conversations to a temporary conversation set; and generating reply information of the current conversation based on the current conversation and the temporary conversation set.

Abstract: Certain aspects of the present disclosure provide techniques for determining and using channel ratio metrics for beamformed communication. A method that may be performed by a user equipment (UE) includes selecting a first beam of a plurality of beams for determining one or more channel ratio metrics, determining the one or more channel ratio metrics for the first beam, wherein determining the one or more channel ratio metrics is based, at least in part, on an angular separation between the first beam and one or more neighboring beams of the plurality of beams, and transmitting signaling via the first beam based on the one or more channel ratio metrics.

Abstract: A thin film transistor (TFT) structure includes a gate electrode, a gate dielectric layer on the gate electrode, a channel layer including a semiconductor material with a first polarity on the gate dielectric layer. The TFT structure also includes a multi-layer material stack on the channel layer, opposite the gate dielectric layer, an interlayer dielectric (ILD) material over the multi-layer material stack and beyond a sidewall of the channel layer. The TFT structure further includes source and drain contacts through the interlayer dielectric material, and in contact with the channel layer, where the multi-layer material stack includes a barrier layer including oxygen and a metal in contact with the channel layer, where the barrier layer has a second polarity. A sealant layer is in contact with the barrier layer, where the sealant layer and the ILD have a different composition.

Abstract: In a method of cleaning a lithography system, during idle mode, a stream of air is directed, through a first opening, into a chamber of a wafer table of an EUV lithography system. One or more particles is extracted by the directed stream of air from surfaces of one or more wafer chucks in the chamber of the wafer table. The stream of air and the extracted one or more particle are drawn, through a second opening, out of the chamber of the wafer table.